Inventor · disambiguated record
Quat Vu
Also filed as: VU QUAT · VU QUAT T
32 granted patents·4 pending applications·2,481 citations·filing 1993–2007
98Inventor score
Top patents by PatentIndex Score
36 records- 0199US6902950B2Method to protect an encapsulated die package during back grinding with a solder metallization layer and devices formed therebyINTEL CORP·Filed 2002·Granted Jun 7, 2005·251 cites·16 claims
- 0299US6423570B1Method to protect an encapsulated die package during back grinding with a solder metallization layer and devices formed therebyINTEL CORP·Filed 2000·Granted Jul 23, 2002·352 cites·9 claims
- 0398US7078788B2Microelectronic substrates with integrated devicesINTEL CORP·Filed 2004·Granted Jul 18, 2006·223 cites·9 claims
- 0498US6790704B2Method for capacitively coupling electronic devicesINTEL CORP·Filed 2001·Granted Sep 14, 2004·188 cites·11 claims
- 0598US6734534B1Microelectronic substrate with integrated devicesINTEL CORP·Filed 2000·Granted May 11, 2004·183 cites·4 claims
- 0697US7189596B1Process for forming a direct build-up layer on an encapsulated die packages utilizing intermediate structuresINTEL CORP·Filed 2000·Granted Mar 13, 2007·151 cites·24 claims
- 0797US7126207B2Capacitor with carbon nanotubesINTEL CORP·Filed 2005·Granted Oct 24, 2006·55 cites·15 claims
- 0897US6964889B2Method to protect an encapsulated die package during back grinding with a solder metallization layer and devices formed therebyINTEL CORP·Filed 2002·Granted Nov 15, 2005·153 cites·16 claims
- 0996US6586822B1Integrated core microelectronic packageINTEL CORP·Filed 2000·Granted Jul 1, 2003·179 cites·19 claims
- 1095US6586836B1Process for forming microelectronic packages and intermediate structures formed therewithINTEL CORP·Filed 2000·Granted Jul 1, 2003·111 cites·26 claims
- 1193US6894399B2Microelectronic device having signal distribution functionality on an interfacial layer thereofINTEL CORP·Filed 2001·Granted May 17, 2005·130 cites·26 claims
- 1292US7696015B2Method of forming a stack of heat generating integrated circuit chips with intervening cooling integrated circuit chipsINTEL CORP·Filed 2006·Granted Apr 13, 2010·15 cites·9 claims
- 1392US6825063B2Integrated core microelectronic packageINTEL CORP·Filed 2003·Granted Nov 30, 2004·73 cites·21 claims
- 1491US7071024B2Method for packaging a microelectronic device using on-die bond pad expansionINTEL CORP·Filed 2001·Granted Jul 4, 2006·93 cites·27 claims
- 1585US6303464B1Method and structure for reducing interconnect system capacitance through enclosed voids in a dielectric layerINTEL CORP·Filed 1996·Granted Oct 16, 2001·87 cites·8 claims
- 1678US6861274B2Method of making a SDI electroosmotic pump using nanoporous dielectric fritINTEL CORP·Filed 2003·Granted Mar 1, 2005·13 cites·5 claims
- 1774US6992381B2Using external radiators with electroosmotic pumps for cooling integrated circuitsINTEL CORP·Filed 2003·Granted Jan 31, 2006·16 cites·18 claims
- 1874US6981849B2Electro-osmotic pumps and micro-channelsINTEL CORP·Filed 2002·Granted Jan 3, 2006·20 cites·16 claims
- 1971US6656822B2Method for reduced capacitance interconnect system using gaseous implants into the ILDINTEL CORP·Filed 1999·Granted Dec 2, 2003·39 cites·21 claims
- 2071US5583739ACapacitor fabricated on a substrate containing electronic circuitryINTEL CORP·Filed 1995·Granted Dec 10, 1996·34 cites·24 claims
- 2167US7084495B2Electroosmotic pumps using porous frits for cooling integrated circuit stacksINTEL CORP·Filed 2003·Granted Aug 1, 2006·7 cites·24 claims
- 2266US5472900ACapacitor fabricated on a substrate containing electronic circuitryINTEL CORP·Filed 1993·Granted Dec 5, 1995·30 cites·11 claims
- 2362US6310400B1Apparatus for capacitively coupling electronic devicesINTEL CORP·Filed 1997·Granted Oct 30, 2001·23 cites·24 claims
- 2460US7576432B2Using external radiators with electroosmotic pumps for cooling integrated circuitsINTEL CORP·Filed 2005·Granted Aug 18, 2009·1 cites·15 claims
- 2556US5909635ACladding of an interconnect for improved electromigration performanceINTEL CORP·Filed 1996·Granted Jun 1, 1999·21 cites·38 claims
- 2655US6238954B1COF packaged semiconductorINTEL CORP·Filed 1999·Granted May 29, 2001·17 cites·6 claims
- 2754US6737754B2COF packaged semiconductorINTEL CORP·Filed 2001·Granted May 18, 2004·5 cites·7 claims
- 2850US2007278668A1Packaged electroosmotic pumps using porous frits for cooling integrated circuitsKIM SARAH E·Filed 2007·Application pending·0 cites
- 2949US7667319B2Electroosmotic pump using nanoporous dielectric fritINTEL CORP·Filed 2004·Granted Feb 23, 2010·1 cites·11 claims
- 3048US7274106B2Packaged electroosmotic pumps using porous frits for cooling integrated circuitsINTEL CORP·Filed 2003·Granted Sep 25, 2007·2 cites·14 claims
- 3147US2007111460A1Capacitor with carbon nanotubesMOSLEY LARRY E·Filed 2006·Application pending·0 cites
- 3244US7723208B2Integrated re-combiner for electroosmotic pumps using porous fritsINTEL CORP·Filed 2003·Granted May 25, 2010·0 cites·3 claims
- 3338US2002020898A1Microelectronic substrates with integrated devicesFiled 2001·Application pending·0 cites
- 3434US2002070443A1Microelectronic package having an integrated heat sink and build-up layersFiled 2000·Application pending·0 cites
- 3533US6388328B1Capping layer in interconnect system and method for bonding the capping layer onto the interconnect systemINTEL CORP·Filed 1998·Granted May 14, 2002·6 cites·8 claims
- 3623US6087728AInterconnect design with controlled inductanceINTEL CORP·Filed 1996·Granted Jul 11, 2000·2 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →