Packaged electroosmotic pumps using porous frits for cooling integrated circuits

Abstract

An integrated electroosmotic pump may be incorporated in the same integrated circuit package with a re-combiner, and an integrated circuit chip to be cooled by fluid pumped by the electroosmotic pump.

1 . A method comprising: 
 securing an integrated electroosmotic pump to an integrated circuit to be cooled; and    packaging the integrated electroosmotic pump coupled to an integrated circuit with a re-combiner.    
   
   
       2 . The method of  claim 1  including forming said electroosmotic pump in an integrated circuit die, said pump formed on one side of said die.  
   
   
       3 . The method of  claim 2  including forming microchannels to circulate a cooling fluid on the opposite side of said die, and coupling said opposite of said die to said integrated circuit to be cooled.  
   
   
       4 . The method of  claim 1  including stacking a first die including said integrated electroosmotic pump on a second die including said integrated circuit to be cooled.  
   
   
       5 . The method of  claim 4  including forming said condenser on a third die and stacking said third die on said first die.  
   
   
       6 . The method of  claim 5  including mounting a heat exchanger on said re-combiner.  
   
   
       7 . The method of  claim 5  including coupling said first die to said second die using copper-to-copper bonding.  
   
   
       8 . The method of  claim 1  including packaging said integrated electroosmotic pump coupled to said integrated circuit in a flip-chip package.  
   
   
       9 . The method of combiner  claim 1  including packaging said integrated electroosmotic pump coupled to an integrated circuit with a re-combiner in a bumpless build-up layer package.