Inventor · disambiguated record
R. Scott List
Also filed as: LIST R S · LIST R SCOTT
40 granted patents·6 pending applications·4,690 citations·filing 1997–2007
99Inventor score
Top patents by PatentIndex Score
46 records- 0199US7157787B2Process of vertically stacking multiple wafers supporting different active integrated circuit (IC) devicesINTEL CORP·Filed 2004·Granted Jan 2, 2007·867 cites·29 claims
- 0299US7037804B2Wafer bonding using a flexible bladder press for three dimensional (3D) vertical stack integrationINTEL CORP·Filed 2003·Granted May 2, 2006·258 cites·7 claims
- 0399US6887769B2Dielectric recess for wafer-to-wafer and die-to-die metal bonding and method of fabricating the sameINTEL CORP·Filed 2002·Granted May 3, 2005·516 cites·5 claims
- 0499US6762076B2Process of vertically stacking multiple wafers supporting different active integrated circuit (IC) devicesINTEL CORP·Filed 2002·Granted Jul 13, 2004·579 cites·9 claims
- 0599US6661085B2Barrier structure against corrosion and contamination in three-dimensional (3-D) wafer-to-wafer vertical stackINTEL CORP·Filed 2002·Granted Dec 9, 2003·536 cites·14 claims
- 0698US7615462B2Etch stop layer for silicon (Si) via etch in three-dimensional (3-D) wafer-to-wafer vertical stackINTEL CORP·Filed 2006·Granted Nov 10, 2009·154 cites·20 claims
- 0798US7056813B2Methods of forming backside connections on a wafer stackINTEL CORP·Filed 2005·Granted Jun 6, 2006·77 cites·51 claims
- 0898US7056807B2Barrier structure against corrosion and contamination in three-dimensional (3-D) wafer-to-wafer vertical stackINTEL CORP·Filed 2003·Granted Jun 6, 2006·245 cites·19 claims
- 0998US6975016B2Wafer bonding using a flexible bladder press and thinned wafers for three-dimensional (3D) wafer-to-wafer vertical stack integration, and application thereofINTEL CORP·Filed 2002·Granted Dec 13, 2005·252 cites·13 claims
- 1098US6908565B2Etch thinning techniques for wafer-to-wafer vertical stacksINTEL CORP·Filed 2002·Granted Jun 21, 2005·251 cites·19 claims
- 1197US6790748B2Thinning techniques for wafer-to-wafer vertical stacksINTEL CORP·Filed 2002·Granted Sep 14, 2004·242 cites·22 claims
- 1296US6897125B2Methods of forming backside connections on a wafer stackINTEL CORP·Filed 2003·Granted May 24, 2005·95 cites·17 claims
- 1396US6059553AIntegrated circuit dielectricsTEXAS INSTRUMENTS INC·Filed 1997·Granted May 9, 2000·131 cites·6 claims
- 1492US7696015B2Method of forming a stack of heat generating integrated circuit chips with intervening cooling integrated circuit chipsINTEL CORP·Filed 2006·Granted Apr 13, 2010·15 cites·9 claims
- 1592US6977435B2Thick metal layer integrated process flow to improve power delivery and mechanical bufferingINTEL CORP·Filed 2003·Granted Dec 20, 2005·82 cites·28 claims
- 1692US6645832B2Etch stop layer for silicon (Si) via etch in three-dimensional (3-D) wafer-to-wafer vertical stackINTEL CORP·Filed 2002·Granted Nov 11, 2003·67 cites·20 claims
- 1791US7148565B2Etch stop layer for silicon (Si) via etch in three-dimensional (3-D) wafer-to-wafer vertical stackINTEL CORP·Filed 2003·Granted Dec 12, 2006·61 cites·20 claims
- 1890US7129172B2Bonded wafer processing methodINTEL CORP·Filed 2004·Granted Oct 31, 2006·45 cites·22 claims
- 1988US7569426B2Apparatus and method integrating an electro-osmotic pump and microchannel assembly into a die packageINTEL CORP·Filed 2007·Granted Aug 4, 2009·14 cites·12 claims
- 2084US7355277B2Apparatus and method integrating an electro-osmotic pump and microchannel assembly into a die packageINTEL CORP·Filed 2003·Granted Apr 8, 2008·30 cites·15 claims
- 2181US6870270B2Method and structure for interfacing electronic devicesINTEL CORP·Filed 2002·Granted Mar 22, 2005·25 cites·26 claims
- 2278US6861274B2Method of making a SDI electroosmotic pump using nanoporous dielectric fritINTEL CORP·Filed 2003·Granted Mar 1, 2005·13 cites·5 claims
- 2377US7842553B2Cooling micro-channelsINTEL CORP·Filed 2007·Granted Nov 30, 2010·6 cites·5 claims
- 2475US7105382B2Self-aligned electrodes contained within the trenches of an electroosmotic pumpINTEL CORP·Filed 2003·Granted Sep 12, 2006·20 cites·16 claims
- 2574US7227257B2Cooling micro-channelsINTEL CORP·Filed 2002·Granted Jun 5, 2007·17 cites·3 claims
- 2674US6992381B2Using external radiators with electroosmotic pumps for cooling integrated circuitsINTEL CORP·Filed 2003·Granted Jan 31, 2006·16 cites·18 claims
- 2774US6981849B2Electro-osmotic pumps and micro-channelsINTEL CORP·Filed 2002·Granted Jan 3, 2006·20 cites·16 claims
- 2872US7537954B2Microelectronic assembly having thermoelectric elements to cool a die and a method of making the sameINTEL CORP·Filed 2005·Granted May 26, 2009·4 cites·12 claims
- 2969US7034394B2Microelectronic assembly having thermoelectric elements to cool a die and a method of making the sameINTEL CORP·Filed 2003·Granted Apr 25, 2006·12 cites·27 claims
- 3067US7084495B2Electroosmotic pumps using porous frits for cooling integrated circuit stacksINTEL CORP·Filed 2003·Granted Aug 1, 2006·7 cites·24 claims
- 3167US6664168B1Method of making an on-die decoupling capacitor for a semiconductor deviceINTEL CORP·Filed 2002·Granted Dec 16, 2003·12 cites·3 claims
- 3265US7348217B2Method and structure for interfacing electronic devicesINTEL CORP·Filed 2006·Granted Mar 25, 2008·2 cites·4 claims
- 3365US6833321B2Method of making a semiconductor device that has copper damascene interconnects with enhanced electromigration reliabilityINTEL CORP·Filed 2001·Granted Dec 21, 2004·10 cites·4 claims
- 3460US7576432B2Using external radiators with electroosmotic pumps for cooling integrated circuitsINTEL CORP·Filed 2005·Granted Aug 18, 2009·1 cites·15 claims
- 3554US6790780B2Fabrication of 3-D capacitor with dual damascene processINTEL CORP·Filed 2001·Granted Sep 14, 2004·4 cites·16 claims
- 3650US2007278668A1Packaged electroosmotic pumps using porous frits for cooling integrated circuitsKIM SARAH E·Filed 2007·Application pending·0 cites
- 3750US2007111386A1Process of vertically stacking multiple wafers supporting different active integrated circuit (IC) devicesKIM SARAH E·Filed 2006·Application pending·0 cites
- 3849US7667319B2Electroosmotic pump using nanoporous dielectric fritINTEL CORP·Filed 2004·Granted Feb 23, 2010·1 cites·11 claims
- 3949US2007087528A1Method and structure for vertically-stacked device contactKIM SARAH E·Filed 2006·Application pending·0 cites
- 4048US7274106B2Packaged electroosmotic pumps using porous frits for cooling integrated circuitsINTEL CORP·Filed 2003·Granted Sep 25, 2007·2 cites·14 claims
- 4146US2006076678A1Thick metal layer integrated process flow to improve power delivery and mechanical bufferingKIM SARAH E·Filed 2005·Application pending·0 cites
- 4246US2005184400A1Method and structure for interfacing electronic devicesFiled 2005·Application pending·0 cites
- 4345US7300871B2Method of doping a conductive layer near a viaINTEL CORP·Filed 2004·Granted Nov 27, 2007·1 cites·4 claims
- 4444US7723208B2Integrated re-combiner for electroosmotic pumps using porous fritsINTEL CORP·Filed 2003·Granted May 25, 2010·0 cites·3 claims
- 4544US7120817B2Method of signal distribution based on a standing wave within a closed loop pathINTEL CORP·Filed 2003·Granted Oct 10, 2006·0 cites·24 claims
- 4640US2004124509A1Method and structure for vertically-stacked device contactFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →