Inventor · disambiguated record
Rachel Layda Abinan
Also filed as: ABINAN RACHEL L · ABINAN RACHEL LAYDA
11 granted patents·1 pending application·140 citations·filing 2006–2011
89Inventor score
Technology areasH10W
Files withSTATS CHIPPAC LTD4ESPIRITU EMMANUEL A2MERILO LEO A2BATHAN HENRY DESCALZO1ESPIRITU EMMANUEL1
Top patents by PatentIndex Score
12 records- 0197US7518226B2Integrated circuit packaging system with interposerSTATS CHIPPAC LTD·Filed 2007·Granted Apr 14, 2009·78 cites·12 claims
- 0287US8026129B2Stacked integrated circuits package system with passive componentsSTATS CHIPPAC LTD·Filed 2006·Granted Sep 27, 2011·16 cites·20 claims
- 0387US7687892B2Quad flat packageSTATS CHIPPAC LTD·Filed 2006·Granted Mar 30, 2010·14 cites·17 claims
- 0483US9281300B2Chip scale module package in BGA semiconductor packageMERILO LEO A·Filed 2010·Granted Mar 8, 2016·9 cites·15 claims
- 0582US7911046B2Integrated circuit packaging system with interposerSTATS CHIPPAC LTD·Filed 2009·Granted Mar 22, 2011·9 cites·17 claims
- 0678US8395254B2Integrated circuit package system with heatspreaderESPIRITU EMMANUEL·Filed 2006·Granted Mar 12, 2013·9 cites·20 claims
- 0765US8138080B2Integrated circuit package system having interconnect stack and external interconnectFILOTEO JR DARIO S·Filed 2006·Granted Mar 20, 2012·4 cites·20 claims
- 0860US8802555B2Integrated circuit packaging system with interconnects and method of manufacture thereofBATHAN HENRY DESCALZO·Filed 2011·Granted Aug 12, 2014·1 cites·20 claims
- 0944US9000579B2Integrated circuit package system with bonding in viaSHIM IL KWON·Filed 2007·Granted Apr 7, 2015·0 cites·18 claims
- 1043US8097496B2Method of forming quad flat packageESPIRITU EMMANUEL A·Filed 2010·Granted Jan 17, 2012·0 cites·45 claims
- 1143US8097935B2Quad flat packageESPIRITU EMMANUEL A·Filed 2010·Granted Jan 17, 2012·0 cites·45 claims
- 1242US2008042265A1Chip scale module package in bga semiconductor packageMERILO LEO A·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →