Inventor · disambiguated record
Raj K. Bansal
Also filed as: BANSAL RAJ K
18 granted patents·8 pending applications·12 citations·filing 2018–2025
89Inventor score
Top patents by PatentIndex Score
26 records- 0195US11450645B2Semiconductor assemblies with hybrid fanouts and associated methods and systemsMICRON TECHNOLOGY INC·Filed 2020·Granted Sep 20, 2022·4 cites·10 claims
- 0293US11705432B2Stacked die package including a first die coupled to a substrate through direct chip attachment and a second die coupled to the substrate through wire bonding, and related methods and devicesMICRON TECHNOLOGY INC·Filed 2021·Granted Jul 18, 2023·2 cites·18 claims
- 0384US12266630B2Bond pad connection layoutLODESTAR LICENSING GROUP LLC·Filed 2024·Granted Apr 1, 2025·0 cites·20 claims
- 0482US11211347B2Integrated circuit structures and methods of forming an opening in a materialMICRON TECHNOLOGY INC·Filed 2020·Granted Dec 28, 2021·1 cites·6 claims
- 0581US12444713B2Semiconductor assemblies with hybrid fanouts and associated methods and systemsLODESTAR LICENSING GROUP LLC·Filed 2023·Granted Oct 14, 2025·0 cites·20 claims
- 0680US10943841B2Substrates, structures within a scribe-line area of a substrate, and methods of forming a conductive line of a redistribution layer of a substrate and of forming a structure within a scribe-line area of the substrateMICRON TECHNOLOGY INC·Filed 2020·Granted Mar 9, 2021·1 cites·5 claims
- 0779US2025210581A1Bond pad connection layoutLODESTAR LICENSING GROUP LLC·Filed 2025·Application pending·0 cites
- 0878US11876068B2Bond pad connection layoutMICRON TECHNOLOGY INC·Filed 2022·Granted Jan 16, 2024·0 cites·20 claims
- 0977US10847482B2Integrated circuit structures and methods of forming an opening in a materialMICRON TECHNOLOGY INC·Filed 2018·Granted Nov 24, 2020·2 cites·31 claims
- 1076US2025029957A1Semiconductor devices including stacked dies with interleaved wire bonds and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 1175US11769756B2Semiconductor assemblies with hybrid fanouts and associated methods and systemsLODESTAR LICENSING GROUP LLC·Filed 2022·Granted Sep 26, 2023·0 cites·19 claims
- 1273US11081468B2Stacked die package including a first die coupled to a substrate through direct chip attachment and a second die coupled to the substrate through wire bonding and related methods, devices and apparatusesMICRON TECHNOLOGY INC·Filed 2019·Granted Aug 3, 2021·1 cites·32 claims
- 1372US12125789B2Semiconductor device and method of forming the sameMICRON TECHNOLOGY INC·Filed 2022·Granted Oct 22, 2024·0 cites·16 claims
- 1471US12136607B2Semiconductor devices including stacked dies with interleaved wire bonds and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2022·Granted Nov 5, 2024·0 cites·17 claims
- 1571US11502053B2Bond pad connection layoutMICRON TECHNOLOGY INC·Filed 2020·Granted Nov 15, 2022·0 cites·22 claims
- 1671US10651100B2Substrates, structures within a scribe-line area of a substrate, and methods of forming a conductive line of a redistribution layer of a substrate and of forming a structure within a scribe-line area of the substrateMICRON TECHNOLOGY INC·Filed 2018·Granted May 12, 2020·1 cites·17 claims
- 1765US11456253B2Semiconductor device and method of forming the sameMICRON TECHNOLOGY INC·Filed 2020·Granted Sep 27, 2022·0 cites·7 claims
- 1859US2024371824A1Plasma dicing for semiconductor device fabricationMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 1958US11810822B2Apparatuses and methods including patterns in scribe regions of semiconductor devicesMICRON TECHNOLOGY INC·Filed 2021·Granted Nov 7, 2023·0 cites·16 claims
- 2057US2025069952A1Systems and methods for mitigating crack meandering in semiconductor dicingMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 2157US2024014083A1Semiconductor device assemblies with screen-printed epoxy spacers and methods for forming the sameMICRON TECHNOLOGY INC·Filed 2023·Application pending·0 cites
- 2256US2025357398A1Self-aligned patterning on package substrateMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 2353US2024072002A1Semiconductor devices, assemblies, and associated methodsMICRON TECHNOLOGY INC·Filed 2022·Application pending·0 cites
- 2452US12500179B2Techniques for forming a device with scribe asymmetryMICRON TECHNOLOGY INC·Filed 2022·Granted Dec 16, 2025·0 cites·5 claims
- 2551US12230608B2Semiconductor assemblies with system and methods for conveying signals using through mold viasMICRON TECHNOLOGY INC·Filed 2021·Granted Feb 18, 2025·0 cites·12 claims
- 2647US2023290684A1Structures and methods for dicing semiconductor devicesMICRON TECHNOLOGY INC·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →