Inventor · disambiguated record
Rajmohan Bhandari
Also filed as: BHANDARI RAJMOHAN
7 granted patents·6 pending applications·79 citations·filing 2007–2021
82Inventor score
Top patents by PatentIndex Score
13 records- 0193US7951300B2Water-scale needle arrayUNIV UTAH RES FOUND·Filed 2007·Granted May 31, 2011·32 cites·7 claims
- 0289US8865288B2Micro-needle arrays having non-planar tips and methods of manufacture thereofBHANDARI RAJMOHAN·Filed 2007·Granted Oct 21, 2014·38 cites·23 claims
- 0379US10058263B2Neural interfaceUNIV UTAH RES FOUND·Filed 2015·Granted Aug 28, 2018·5 cites·15 claims
- 0471US10799132B2Multi-site electrode arrays and methods of making the sameUNIV UTAH RES FOUND·Filed 2016·Granted Oct 13, 2020·2 cites·25 claims
- 0565US10172558B2Structure and methodology for a shadow mask having hollow high aspect ratio projectionsUNIV UTAH RES FOUND·Filed 2016·Granted Jan 8, 2019·1 cites·22 claims
- 0661US2022071537A1Micro-molded electrodes, arrays, and methods of making the sameUNIV UTAH RES FOUND·Filed 2021·Application pending·0 cites
- 0759US11185271B2Methods of making micro-molded electrodes and arraysUNIV UTAH RES FOUND·Filed 2014·Granted Nov 30, 2021·1 cites·17 claims
- 0854US2009246515A1Neuroelectrode Coating and Associated MethodsNEGI SANDEEP·Filed 2008·Application pending·0 cites
- 0944US2010010601A1Self-Aligning Latch-up Mechanism in Out of Plane Silicon Microelectrode ArraysNEGI SANDEEP·Filed 2009·Application pending·0 cites
- 1043US2012132613A1Wafer-scale needle arrayBHANDARI RAJMOHAN·Filed 2011·Application pending·0 cites
- 1142US10293153B2Pseudoporous surface of implantable materials and methods of making the sameUNIV UTAH RES FOUND·Filed 2015·Granted May 21, 2019·0 cites·19 claims
- 1242US2009301994A1Methods for Wafer Scale Processing of Needle Array DevicesBHANDARI RAJMOHAN·Filed 2009·Application pending·0 cites
- 1340US2008138581A1Masking high-aspect aspect ratio structuresBHANDARI RAJMOHAN·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →