Inventor · disambiguated record
Rahamat Bidin
Also filed as: BIDIN RAHAMAT
3 granted patents·1 pending application·267 citations·filing 1999–2011
71Inventor score
Technology areasH10W
Files withBIDIN RAHAMAT1ST ASSEMBLY TEST SERVICES LTD1UNITED TEST & ASSEMBLY CT LTD1UNITED TEST AND ASSEMBLY CT1
Top patents by PatentIndex Score
4 records- 0194US6420779B1Leadframe based chip scale package and method of producing the sameST ASSEMBLY TEST SERVICES LTD·Filed 1999·Granted Jul 16, 2002·263 cites·8 claims
- 0258US8544755B2Subscriber identity module (SIM) cardBIDIN RAHAMAT·Filed 2011·Granted Oct 1, 2013·2 cites·20 claims
- 0358US7816775B2Multi-die IC package and manufacturing methodUNITED TEST & ASSEMBLY CT LTD·Filed 2005·Granted Oct 19, 2010·2 cites·14 claims
- 0434US2008290509A1Chip Scale Package and Method of Assembling the SameUNITED TEST AND ASSEMBLY CT·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →