Inventor · disambiguated record
Raymond L. Dietz
Also filed as: DIETZ RAYMOND · DIETZ RAYMOND L · DIETZ RAYMOND LOUIS
21 granted patents·1 pending application·551 citations·filing 1976–2016
96Inventor score
Top patents by PatentIndex Score
22 records- 0187US5334558ALow temperature glass with improved thermal stress properties and method of useDIEMAT INC·Filed 1992·Granted Aug 2, 1994·52 cites·18 claims
- 0284US4459166AMethod of bonding an electronic device to a ceramic substrateJOHNSON MATTHEY INC·Filed 1983·Granted Jul 10, 1984·59 cites·7 claims
- 0383US4401767ASilver-filled glassJOHNSON MATTHEY INC·Filed 1982·Granted Aug 30, 1983·58 cites·6 claims
- 0483US4142203AMethod of assembling a hermetically sealed semiconductor unitAVX CORP·Filed 1976·Granted Feb 27, 1979·45 cites·10 claims
- 0580US6140402APolymeric adhesive pasteDIEMAT INC·Filed 1997·Granted Oct 31, 2000·48 cites·27 claims
- 0679US5663109ALow temperature glass paste with high metal to glass ratioQUANTUM MATERIALS INC·Filed 1996·Granted Sep 2, 1997·47 cites·18 claims
- 0776US7906373B1Thermally enhanced electrically insulative adhesive pasteCZUBAROW PAWEL·Filed 2008·Granted Mar 15, 2011·3 cites·26 claims
- 0871US4817322ABarrel protector for a weaponQUALITY MOLD INC·Filed 1987·Granted Apr 4, 1989·28 cites·6 claims
- 0971US4436785ASilver-filled glassJOHNSON MATTHEY INC·Filed 1983·Granted Mar 13, 1984·33 cites·6 claims
- 1070US10290601B2Method of manufacturing bonded bodyNAMICS CORP·Filed 2016·Granted May 14, 2019·1 cites·19 claims
- 1168US4933030ALow temperature glass composition, paste and method of useDIETZ RAYMOND L·Filed 1989·Granted Jun 12, 1990·35 cites·12 claims
- 1267US6901203B1Fiber optic feed-through tube and method for making the sameDIEMAT INC·Filed 2002·Granted May 31, 2005·16 cites·22 claims
- 1366US5543366ALow temperature glass paste with improved thermal stress propertiesQUANTUM MATERIALS INC·Filed 1994·Granted Aug 6, 1996·21 cites·28 claims
- 1465US5488082APolymeric adhesive pasteDIEMAT INC·Filed 1995·Granted Jan 30, 1996·28 cites·18 claims
- 1564US5391604AAdhesive paste containing polymeric resinDIEMAT INC·Filed 1993·Granted Feb 21, 1995·28 cites·10 claims
- 1655US9776909B2Glass fritNAMICS CORP·Filed 2014·Granted Oct 3, 2017·0 cites·21 claims
- 1755US6265471B1High thermally conductive polymeric adhesiveDIEMAT INC·Filed 1997·Granted Jul 24, 2001·20 cites·12 claims
- 1848US5076876AMethod of attaching an electronic device to a substrateDIEMAT INC·Filed 1990·Granted Dec 31, 1991·17 cites·15 claims
- 1947US8344523B2Conductive compositionDIEMAT INC·Filed 2009·Granted Jan 1, 2013·0 cites·45 claims
- 2044US6111005APolymeric adhesive pasteDIEMAT INC·Filed 1996·Granted Aug 29, 2000·12 cites·21 claims
- 2143US9540275B2Conductive paste and method for producing a semiconductor device using the sameNAMICS CORP·Filed 2015·Granted Jan 10, 2017·0 cites·15 claims
- 2238US2007256783A1Thermally enhanced adhesive pasteDIETZ RAYMOND L·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →