Inventor · disambiguated record
Rama R. Goruganthu
Also filed as: GORUGANTHU RAMA · GORUGANTHU RAMA R · GORUGANTHU RAMA RAO
67 granted patents·1,105 citations·filing 1990–2017
99Inventor score
Files withADVANCED MICRO DEVICES INC50MICROELECTRONICS & COMPUTER6GORUGANTHU RAMA R3QUALCOMM INC3ADVANCE MICRO DEVICES INC1
Top patents by PatentIndex Score
67 records- 0196US6608494B1Single point high resolution time resolved photoemission microscopy system and methodADVANCED MICRO DEVICES INC·Filed 1998·Granted Aug 19, 2003·134 cites·32 claims
- 0295US6483327B1Quadrant avalanche photodiode time-resolved detectionADVANCED MICRO DEVICES INC·Filed 1999·Granted Nov 19, 2002·123 cites·22 claims
- 0393US5272309ABonding metal members with multiple laser beamsMICROELECTRONICS & COMPUTER·Filed 1992·Granted Dec 21, 1993·89 cites·51 claims
- 0486US5083007ABonding metal electrical members with a frequency doubled pulsed laser beamMICROELECTRONICS & COMPUTER·Filed 1990·Granted Jan 21, 1992·49 cites·36 claims
- 0584US10224264B1High performance evaporation-condensation thermal spreading chamber for compute packagesQUALCOMM INC·Filed 2017·Granted Mar 5, 2019·6 cites·25 claims
- 0679US6391664B1Selectively activatable solar cells for integrated circuit analysisADVANCED MICRO DEVICES INC·Filed 1999·Granted May 21, 2002·52 cites·19 claims
- 0779US5156997AMethod of making semiconductor bonding bumps using metal cluster ion depositionMICROELECTRONICS & COMPUTER·Filed 1991·Granted Oct 20, 1992·55 cites·20 claims
- 0878US5290732AProcess for making semiconductor electrode bumps by metal cluster ion deposition and etchingMICROELECTRONICS & COMPUTER·Filed 1992·Granted Mar 1, 1994·51 cites·29 claims
- 0974US6780664B1Nanotube tip for atomic force microscopeADVANCED MICRO DEVICES INC·Filed 2002·Granted Aug 24, 2004·22 cites·28 claims
- 1073US9304308B2Laser scanning module including an optical isolatorGORUGANTHU RAMA R·Filed 2012·Granted Apr 5, 2016·3 cites·11 claims
- 1172US6994584B1Thermally conductive integrated circuit mounting structuresADVANCED MICRO DEVICES INC·Filed 2002·Granted Feb 7, 2006·25 cites·14 claims
- 1272US6069366AEndpoint detection for thinning of silicon of a flip chip bonded integrated circuitADVANCED MICRO DEVICES INC·Filed 1998·Granted May 30, 2000·27 cites·29 claims
- 1371US7196800B1Semiconductor die analysis as a function of optical reflections from the dieADVANCED MICRO DEVICES INC·Filed 2002·Granted Mar 27, 2007·15 cites·21 claims
- 1470US6657446B1Picosecond imaging circuit analysis probe and systemADVANCED MICRO DEVICES INC·Filed 1999·Granted Dec 2, 2003·32 cites·14 claims
- 1569US6469529B1Time-resolved emission microscopy systemADVANCED MICRO DEVICES INC·Filed 2000·Granted Oct 22, 2002·14 cites·40 claims
- 1668US6709985B1Arrangement and method for providing an imaging path using a silicon-crystal damaging laserADVANCED MICRO DEVICES INC·Filed 1999·Granted Mar 23, 2004·32 cites·15 claims
- 1768US5331172AIonized metal cluster beam systems and methodsMICROELECTRONICS & COMPUTER·Filed 1993·Granted Jul 19, 1994·30 cites·31 claims
- 1866US8232586B2Silicon photon detectorPOTOK RONALD M·Filed 2009·Granted Jul 31, 2012·2 cites·17 claims
- 1966US7272010B1Thermally conductive integrated circuit mounting structuresADVANCED MICRO DEVICES INC·Filed 2006·Granted Sep 18, 2007·7 cites·17 claims
- 2065US6417680B1Method and apparatus for stress testing a semiconductor device using laser-induced circuit excitationADVANCED MICRO DEVICES INC·Filed 1999·Granted Jul 9, 2002·24 cites·20 claims
- 2165US6387715B1Integrated circuit defect detection via laser heat and IR thermographyADVANCED MICRO DEVICES INC·Filed 1999·Granted May 14, 2002·27 cites·20 claims
- 2264US6281025B1Substrate removal as a function of SIMS analysisADVANCED MICRO DEVICES INC·Filed 1999·Granted Aug 28, 2001·28 cites·21 claims
- 2363US7884633B2Wide area soft defect localizationADVANCED MICRO DEVICES INC·Filed 2008·Granted Feb 8, 2011·6 cites·22 claims
- 2462US6285036B1Endpoint detection for thinning of silicon of a flip chip bonded integrated circuitADVANCED MICRO DEVICES INC·Filed 2000·Granted Sep 4, 2001·8 cites·10 claims
- 2560US6828809B1Photon detection enhancement of superconducting hot-electron photodetectorsADVANCED MICRO DEVICES INC·Filed 2002·Granted Dec 7, 2004·9 cites·28 claims
- 2660US6714294B1De broglie microscopeADVANCED MICRO DEVICES INC·Filed 2002·Granted Mar 30, 2004·2 cites·49 claims
- 2759US6894518B1Circuit analysis and manufacture using electric field-induced effectsADVANCED MICRO DEVICES INC·Filed 2002·Granted May 17, 2005·8 cites·26 claims
- 2859US6833716B1Electro-optical analysis of integrated circuitsADVANCED MICRO DEVICES INC·Filed 2002·Granted Dec 21, 2004·9 cites·20 claims
- 2958US6716683B1Optical analysis for SOI integrated circuitsADVANCED MIRCOR DEVICES INC·Filed 2001·Granted Apr 6, 2004·6 cites·30 claims
- 3058US6566888B1Repair of resistive electrical connections in an integrated circuitADVANCED MICRO DEVICES INC·Filed 2001·Granted May 20, 2003·8 cites·23 claims
- 3157US6836132B1High resolution heat exchangeADVANCE MICRO DEVICES INC·Filed 2002·Granted Dec 28, 2004·5 cites·20 claims
- 3257US6518783B1Circuit construction in back side of die and over a buried insulatorADVANCED MICRO DEVICES INC·Filed 2001·Granted Feb 11, 2003·7 cites·22 claims
- 3357US6414335B1Selective state change analysis of a SOI dieADVANCED MICRO DEVICES INC·Filed 2001·Granted Jul 2, 2002·7 cites·20 claims
- 3457US6252239B1Substrate removal from a semiconductor chip structure having buried insulator (BIN)ADVANCED MICRO DEVICES INC·Filed 2000·Granted Jun 26, 2001·7 cites·36 claims
- 3554US8537464B2Optical isolation module and method for utilizing the sameGORUGANTHU RAMA R·Filed 2009·Granted Sep 17, 2013·0 cites·13 claims
- 3654US6483326B1Localized heating for defect isolation during die operationADVANCED MICRO DEVICES INC·Filed 1999·Granted Nov 19, 2002·15 cites·25 claims
- 3753US6833718B1Photon beaconADVANCED MICRO DEVICES INC·Filed 2002·Granted Dec 21, 2004·7 cites·16 claims
- 3853US6686757B1Defect detection in semiconductor devicesADVANCED MICRO DEVICES INC·Filed 1999·Granted Feb 3, 2004·16 cites·16 claims
- 3953US6430728B1Acoustic 3D analysis of circuit structuresADVANCED MICRO DEVICES INC·Filed 1999·Granted Aug 6, 2002·16 cites·22 claims
- 4051US10168222B2Thermal detector array configured to detect thermal radiation from the integrated circuitQUALCOMM INC·Filed 2017·Granted Jan 1, 2019·0 cites·24 claims
- 4151US6635572B1Method of substrate silicon removal for integrated circuit devicesADVANCED MICRO DEVICES INC·Filed 2001·Granted Oct 21, 2003·4 cites·20 claims
- 4249US6303396B1Substrate removal as a function of resistance at the back side of a semiconductor deviceADVANCED MICRO DEVICES INC·Filed 1999·Granted Oct 16, 2001·13 cites·20 claims
- 4349US5192913ASegmented charge limiting test algorithm for electrical componentsMICROELECTRONICS & COMPUTER·Filed 1992·Granted Mar 9, 1993·14 cites·35 claims
- 4447US7235800B1Electrical probing of SOI circuitsADVANCED MICRO DEVICES INC·Filed 2000·Granted Jun 26, 2007·3 cites·25 claims
- 4547US6653849B1IC analysis involving logic state mapping in a SOI dieADVANCED MICRO DEVICES INC·Filed 2001·Granted Nov 25, 2003·3 cites·21 claims
- 4647US6621288B1Timing margin alteration via the insulator of a SOI dieADVANCED MICRO DEVICES INC·Filed 2001·Granted Sep 16, 2003·3 cites·22 claims
- 4746US6281029B1Probe points for heat dissipation during testing of flip chip ICADVANCED MICRO DEVICES INC·Filed 1999·Granted Aug 28, 2001·11 cites·21 claims
- 4846US6277659B1Substrate removal using thermal analysisADVANCED MICRO DEVICES INC·Filed 1999·Granted Aug 21, 2001·11 cites·20 claims
- 4945US10132861B2Visible laser circuit fault isolationQUALCOMM INC·Filed 2016·Granted Nov 20, 2018·0 cites·17 claims
- 5044US8187772B2Solid immersion lens lithographyGORUGANTHU RAMA R·Filed 2004·Granted May 29, 2012·0 cites·18 claims
Showing the top 50 of 67 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →