Inventor · disambiguated record
Rajesh Katkar
Also filed as: KATKAR RAJESH
210 granted patents·93 pending applications·4,230 citations·filing 2010–2025
99Inventor score
Files withADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC120INVENSAS CORP108INVENSAS BONDING TECH INC31ADEIA SEMICONDUCTOR TECH LLC23XCELSIS CORP7
Top patents by PatentIndex Score
303 records- 0199US11842894B2Electrical redundancy for bonded structuresADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2020·Granted Dec 12, 2023·14 cites·33 claims
- 0299US11817409B2Directly bonded structures without intervening adhesive and methods for forming the sameADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2021·Granted Nov 14, 2023·13 cites·30 claims
- 0399US11762200B2Bonded optical devicesADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2020·Granted Sep 19, 2023·11 cites·32 claims
- 0499US11476213B2Bonded structures without intervening adhesiveINVENSAS BONDING TECH INC·Filed 2020·Granted Oct 18, 2022·50 cites·22 claims
- 0599US11348898B2Systems and methods for releveled bump planes for chipletsXCELSIS CORP·Filed 2020·Granted May 31, 2022·144 cites·17 claims
- 0699US11256004B2Direct-bonded lamination for improved image clarity in optical devicesINVENSAS BONDING TECH INC·Filed 2018·Granted Feb 22, 2022·157 cites·19 claims
- 0798US12266640B2Molded direct bonded and interconnected stackADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2023·Granted Apr 1, 2025·4 cites·35 claims
- 0898US12218107B2Electrical redundancy for bonded structuresADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2023·Granted Feb 4, 2025·3 cites·20 claims
- 0998US12198981B2Diffusion barrier collar for interconnectsADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2023·Granted Jan 14, 2025·3 cites·34 claims
- 1098US12100684B2Bonded structuresADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2022·Granted Sep 24, 2024·3 cites·26 claims
- 1198US12046583B2Electrical redundancy for bonded structuresADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2023·Granted Jul 23, 2024·4 cites·21 claims
- 1298US11955463B2Direct bonded stack structures for increased reliability and improved yield in microelectronicsADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2022·Granted Apr 9, 2024·6 cites·55 claims
- 1398US11955445B2Metal pads over TSVADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2022·Granted Apr 9, 2024·5 cites·23 claims
- 1498US11935907B2Image sensor deviceADEIA SEMICONDUCTOR TECH LLC·Filed 2021·Granted Mar 19, 2024·5 cites·30 claims
- 1598US11876076B2Apparatus for non-volatile random access memory stacksADEIA SEMICONDUCTOR TECH LLC·Filed 2020·Granted Jan 16, 2024·7 cites·31 claims
- 1698US11848284B2Protective elements for bonded structuresADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2022·Granted Dec 19, 2023·7 cites·16 claims
- 1798US11837582B2Molded direct bonded and interconnected stackADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2022·Granted Dec 5, 2023·14 cites·33 claims
- 1898US11764189B2Molded direct bonded and interconnected stackADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2021·Granted Sep 19, 2023·17 cites·30 claims
- 1998US11728287B2Wafer-level bonding of obstructive elementsADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2021·Granted Aug 15, 2023·7 cites·36 claims
- 2098US11715730B2Direct-bonded LED arrays including optical elements configured to transmit optical signals from LED elementsADEIA SEMICONDUCTOR TECH LLC·Filed 2021·Granted Aug 1, 2023·6 cites·19 claims
- 2198US11694925B2Diffusion barrier collar for interconnectsADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2021·Granted Jul 4, 2023·3 cites·36 claims
- 2298US11670615B2Bonded structuresADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2020·Granted Jun 6, 2023·6 cites·23 claims
- 2398US11610846B2Protective elements for bonded structures including an obstructive elementADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2020·Granted Mar 21, 2023·9 cites·18 claims
- 2498US11600542B2Cavity packagesADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2021·Granted Mar 7, 2023·6 cites·23 claims
- 2598US11515279B2Low temperature bonded structuresADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2020·Granted Nov 29, 2022·10 cites·22 claims
- 2698US11393779B2Large metal pads over TSVINVENSAS BONDING TECH INC·Filed 2019·Granted Jul 19, 2022·58 cites·15 claims
- 2798US11387214B2Multi-chip modules formed using wafer-level processing of a reconstituted waferINVENSAS LLC·Filed 2019·Granted Jul 12, 2022·61 cites·20 claims
- 2898US11380597B2Bonded structuresINVENSAS BONDING TECH INC·Filed 2018·Granted Jul 5, 2022·57 cites·19 claims
- 2998US11373963B2Protective elements for bonded structuresINVENSAS BONDING TECH INC·Filed 2020·Granted Jun 28, 2022·52 cites·27 claims
- 3098US11329034B2Direct-bonded LED structure contacts and substrate contactsINVENSAS CORP·Filed 2020·Granted May 10, 2022·146 cites·23 claims
- 3198US11296053B2Direct bonded stack structures for increased reliability and improved yield in microelectronicsINVENSAS BONDING TECH INC·Filed 2020·Granted Apr 5, 2022·41 cites·18 claims
- 3298US11296044B2Bond enhancement structure in microelectronics for trapping contaminants during direct-bonding processesINVENSAS BONDING TECH INC·Filed 2019·Granted Apr 5, 2022·80 cites·24 claims
- 3398US11205625B2Wafer-level bonding of obstructive elementsINVENSAS BONDING TECH INC·Filed 2020·Granted Dec 21, 2021·68 cites·28 claims
- 3498US11158606B2Molded direct bonded and interconnected stackINVENSAS BONDING TECH INC·Filed 2019·Granted Oct 26, 2021·159 cites·35 claims
- 3598US11088099B2Multi-metal contact structure in microelectronic componentINVENSAS BONDING TECH INC·Filed 2019·Granted Aug 10, 2021·155 cites·21 claims
- 3698US11069734B2Image sensor deviceINVENSAS CORP·Filed 2019·Granted Jul 20, 2021·100 cites·20 claims
- 3798US11031285B2Diffusion barrier collar for interconnectsINVENSAS BONDING TECH INC·Filed 2018·Granted Jun 8, 2021·159 cites·23 claims
- 3898US11011503B2Direct-bonded optoelectronic interconnect for high-density integrated photonicsINVENSAS BONDING TECH INC·Filed 2018·Granted May 18, 2021·148 cites·17 claims
- 3998US11011494B2Layer structures for making direct metal-to-metal bonds at low temperatures in microelectronicsINVENSAS BONDING TECH INC·Filed 2018·Granted May 18, 2021·133 cites·36 claims
- 4098US11004757B2Bonded structuresINVENSAS BONDING TECH INC·Filed 2018·Granted May 11, 2021·117 cites·20 claims
- 4198US10923408B2Cavity packagesINVENSAS BONDING TECH INC·Filed 2018·Granted Feb 16, 2021·133 cites·17 claims
- 4298US10790262B2Low temperature bonded structuresINVENSAS BONDING TECH INC·Filed 2019·Granted Sep 29, 2020·160 cites·13 claims
- 4398US10629567B2Multiple plated via arrays of different wire heights on same substrateINVENSAS CORP·Filed 2019·Granted Apr 21, 2020·15 cites·20 claims
- 4498US10522499B2Bonded structuresINVENSAS BONDING TECH INC·Filed 2017·Granted Dec 31, 2019·137 cites·28 claims
- 4598US10515913B2Multi-metal contact structureINVENSAS BONDING TECH INC·Filed 2018·Granted Dec 24, 2019·24 cites·15 claims
- 4698US10508030B2Seal for microelectronic assemblyINVENSAS BONDING TECH INC·Filed 2018·Granted Dec 17, 2019·124 cites·14 claims
- 4798US10269853B2Image sensor deviceINVENSAS CORP·Filed 2018·Granted Apr 23, 2019·32 cites·10 claims
- 4898US10002844B1Bonded structuresINVENSAS BONDING TECH INC·Filed 2016·Granted Jun 19, 2018·167 cites·20 claims
- 4998US9899442B2Image sensor deviceINVENSAS CORP·Filed 2015·Granted Feb 20, 2018·154 cites·14 claims
- 5098US9824974B2Integrated circuit assemblies with rigid layers used for protection against mechanical thinning and for other purposes, and methods of fabricating such assembliesINVENSAS CORP·Filed 2016·Granted Nov 21, 2017·54 cites·20 claims
Showing the top 50 of 303 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Rajesh Katkar files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →