Inventor · disambiguated record
Rahul N. Manepalli
Also filed as: MANEPALLI RAHUL · MANEPALLI RAHUL N · MANEPALLI RAHUL NAGARAJ
90 granted patents·70 pending applications·296 citations·filing 2001–2025
99Inventor score
Top patents by PatentIndex Score
160 records- 0197US7948090B2Capillary-flow underfill compositions, packages containing same, and systems containing sameINTEL CORP·Filed 2006·Granted May 24, 2011·29 cites·26 claims
- 0296US11664290B2Package with underfill containment barrierINTEL CORP·Filed 2021·Granted May 30, 2023·3 cites·20 claims
- 0395US11990427B2Chiplet first architecture for die tiling applicationsINTEL CORP·Filed 2022·Granted May 21, 2024·2 cites·15 claims
- 0495US11973041B2Chiplet first architecture for die tiling applicationsINTEL CORP·Filed 2021·Granted Apr 30, 2024·2 cites·41 claims
- 0593US11355438B2Hybrid fan-out architecture with EMIB and glass core for heterogeneous die integration applicationsINTEL CORP·Filed 2018·Granted Jun 7, 2022·6 cites·24 claims
- 0693US11164818B2Inorganic-based embedded-die layers for modular semiconductive devicesINTEL CORP·Filed 2019·Granted Nov 2, 2021·7 cites·19 claims
- 0792US7202304B2Anhydride polymers for use as curing agents in epoxy resin-based underfill materialINTEL CORP·Filed 2006·Granted Apr 10, 2007·19 cites·8 claims
- 0891US9000599B2Multichip integration with through silicon via (TSV) die embedded in packageRAORANE DIGVIJAY A·Filed 2013·Granted Apr 7, 2015·14 cites·13 claims
- 0990US10170428B2Cavity generation for embedded interconnect bridges utilizing temporary structuresINTEL CORP·Filed 2016·Granted Jan 1, 2019·7 cites·12 claims
- 1089US11158558B2Package with underfill containment barrierINTEL CORP·Filed 2016·Granted Oct 26, 2021·5 cites·16 claims
- 1188US11901248B2Embedded die architecture and method of makingINTEL CORP·Filed 2020·Granted Feb 13, 2024·2 cites·20 claims
- 1287US8466559B2Forming die backside coating structures with coreless packagesMANEPALLI RAHUL N·Filed 2010·Granted Jun 18, 2013·9 cites·17 claims
- 1387US2025015003A1Hybrid fan-out architecture with emib and glass core for heterogeneous die integration applicationsINTEL CORP·Filed 2024·Application pending·0 cites
- 1486US12125793B2Hybrid fan-out architecture with EMIB and glass core for heterogeneous die integration applicationsINTEL CORP·Filed 2023·Granted Oct 22, 2024·0 cites·20 claims
- 1586US10892219B2Molded embedded bridge for enhanced EMIB applicationsPIETAMBARAM SRINIVAS V·Filed 2016·Granted Jan 12, 2021·5 cites·23 claims
- 1685US12308329B2Chiplet first architecture for die tiling applicationsINTEL CORP·Filed 2024·Granted May 20, 2025·0 cites·20 claims
- 1785US12087695B2Hybrid fan-out architecture with EMIB and glass core for heterogeneous die integration applicationsINTEL CORP·Filed 2023·Granted Sep 10, 2024·0 cites·20 claims
- 1885US7535114B2Integrated circuit devices including compliant material under bond pads and methods of fabricationINTEL CORP·Filed 2005·Granted May 19, 2009·14 cites·27 claims
- 1985US2025038114A1Electrical interconnect bridgeINTEL CORP·Filed 2024·Application pending·0 cites
- 2084US12327773B2Package with underfill containment barrierINTEL CORP·Filed 2024·Granted Jun 10, 2025·0 cites·20 claims
- 2183US12148704B2Electrical interconnect bridgeINTEL CORP·Filed 2023·Granted Nov 19, 2024·0 cites·8 claims
- 2283US11791269B2Electrical interconnect bridgeINTEL CORP·Filed 2020·Granted Oct 17, 2023·1 cites·10 claims
- 2383US11107781B2RFIC having coaxial interconnect and molded layerINTEL CORP·Filed 2017·Granted Aug 31, 2021·3 cites·20 claims
- 2483US9716084B2Multichip integration with through silicon via (TSV) die embedded in packageINTEL CORP·Filed 2016·Granted Jul 25, 2017·3 cites·10 claims
- 2583US9312233B2Method of forming molded panel embedded die structureINTEL CORP·Filed 2013·Granted Apr 12, 2016·5 cites·28 claims
- 2683US2025253265A1Chiplet first architecture for die tiling applicationsINTEL CORP·Filed 2025·Application pending·0 cites
- 2781US9068067B2Flexible underfill compositions for enhanced reliabilityXU DINGYING·Filed 2010·Granted Jun 30, 2015·3 cites·10 claims
- 2881US6620512B2Anhydride polymers for use as curing agents in epoxy resin-based underfill materialINTEL CORP·Filed 2001·Granted Sep 16, 2003·23 cites·18 claims
- 2980US11935805B2Package with underfill containment barrierINTEL CORP·Filed 2023·Granted Mar 19, 2024·0 cites·20 claims
- 3079US12300620B2Inorganic-based embedded-die layers for modular semiconductive devicesINTEL CORP·Filed 2023·Granted May 13, 2025·0 cites·20 claims
- 3179US11756890B2Hybrid fan-out architecture with EMIB and glass core for heterogeneous die integration applicationsINTEL CORP·Filed 2022·Granted Sep 12, 2023·0 cites·20 claims
- 3279US7041736B2Anhydride polymers for use as curing agents in epoxy resin-based underfill materialINTEL CORP·Filed 2003·Granted May 9, 2006·22 cites·6 claims
- 3378US10658281B2Integrated circuit substrate and method of makingINTEL CORP·Filed 2017·Granted May 19, 2020·2 cites·5 claims
- 3478US7033911B2Adhesive of folded packageINTEL CORP·Filed 2004·Granted Apr 25, 2006·29 cites·17 claims
- 3577US2025118647A1Nested interposer with through-silicon via bridge dieINTEL CORP·Filed 2024·Application pending·0 cites
- 3676US8009442B2Directing the flow of underfill materials using magnetic particlesINTEL CORP·Filed 2007·Granted Aug 30, 2011·6 cites·15 claims
- 3776US2025323132A1Nested interposer package for ic chipsINTEL CORP·Filed 2025·Application pending·0 cites
- 3875US11769735B2Chiplet first architecture for die tiling applicationsINTEL CORP·Filed 2019·Granted Sep 26, 2023·1 cites·25 claims
- 3975US10847471B2Dielectric filler material in conductive material that functions as fiducial for an electronic deviceINTEL CORP·Filed 2018·Granted Nov 24, 2020·2 cites·7 claims
- 4073US11177232B2Circuit device with monolayer bonding between surface structuresINTEL CORP·Filed 2018·Granted Nov 16, 2021·2 cites·19 claims
- 4173US8287996B2Coating for a microelectronic device, treatment comprising same, and method of managing a thermal profile of a microelectronic dieXU DINGYING·Filed 2009·Granted Oct 16, 2012·5 cites·11 claims
- 4273US8093105B2Method of fabricating a capillary-flow underfill compositionsMANEPALLI RAHUL N·Filed 2011·Granted Jan 10, 2012·3 cites·10 claims
- 4373US2024234225A1Glass core patch with in situ fabricated fan-out layer to enable die tiling applicationsINTEL CORP·Filed 2024·Application pending·0 cites
- 4472US11978685B2Glass core patch with in situ fabricated fan-out layer to enable die tiling applicationsINTEL CORP·Filed 2019·Granted May 7, 2024·1 cites·18 claims
- 4572US10080290B2Stretchable embedded electronic packageINTEL CORP·Filed 2015·Granted Sep 18, 2018·2 cites·5 claims
- 4672US6794225B2Surface treatment for microelectronic device substrateINTEL CORP·Filed 2002·Granted Sep 21, 2004·19 cites·24 claims
- 4772US2024088121A1Patch accommodating embedded dies having different thicknessesINTEL CORP·Filed 2023·Application pending·0 cites
- 4872US2024128138A1Embedded die architecture and method of makingINTEL CORP·Filed 2023·Application pending·0 cites
- 4971US11798887B2Inorganic-based embedded-die layers for modular semiconductive devicesINTEL CORP·Filed 2021·Granted Oct 24, 2023·0 cites·20 claims
- 5071US8508040B2In-situ foam materials as integrated heat spreader (IHS) sealantSTART PAUL R·Filed 2010·Granted Aug 13, 2013·3 cites·13 claims
Showing the top 50 of 160 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →