Inventor · disambiguated record
Raj N. Master
Also filed as: MASTER RAJ · MASTER RAJ N · MASTER RAJ NAVINCHANDRA
52 granted patents·4 pending applications·933 citations·filing 1979–2014
99Inventor score
Files withADVANCED MICRO DEVICES INC30IBM15MICROSOFT CORP5GLOBALFOUNDRIES INC2MICROSOFT TECHNOLOGY LICENSING LLC2
Top patents by PatentIndex Score
56 records- 0197US9027631B2Metal alloy injection molding overflowsMICROSOFT CORP·Filed 2012·Granted May 12, 2015·17 cites·20 claims
- 0295US4234367AMethod of making multilayered glass-ceramic structures having an internal distribution of copper-based conductorsIBM·Filed 1979·Granted Nov 18, 1980·91 cites·16 claims
- 0393US8991473B2Metal alloy injection molding protrusionsMICROSOFT CORP·Filed 2014·Granted Mar 31, 2015·18 cites·20 claims
- 0492US4340436AProcess for flattening glass-ceramic substratesIBM·Filed 1980·Granted Jul 20, 1982·93 cites·24 claims
- 0591US7833839B1Method for decreasing surface delamination of gel-type thermal interface material by management of the material cure temperatureGLOBALFOUNDRIES INC·Filed 2007·Granted Nov 16, 2010·22 cites·21 claims
- 0687US7678615B2Semiconductor device with gel-type thermal interface materialADVANCED MICRO DEVICES INC·Filed 2007·Granted Mar 16, 2010·15 cites·27 claims
- 0787US7651938B2Void reduction in indium thermal interface materialADVANCED MICRO DEVICES INC·Filed 2006·Granted Jan 26, 2010·15 cites·18 claims
- 0887US7544542B2Reduction of damage to thermal interface material due to asymmetrical loadADVANCED MICRO DEVICES INC·Filed 2006·Granted Jun 9, 2009·16 cites·18 claims
- 0985US6657707B1Metallurgical inspection and/or analysis of flip-chip pads and interfacesADVANCED MICRO DEVICES INC·Filed 2000·Granted Dec 2, 2003·47 cites·20 claims
- 1085US4885038AMethod of making multilayered ceramic structures having an internal distribution of copper-based conductorsIBM·Filed 1986·Granted Dec 5, 1989·72 cites·10 claims
- 1183US7999394B2Void reduction in indium thermal interface materialADVANCED MICRO DEVICES INC·Filed 2009·Granted Aug 16, 2011·10 cites·19 claims
- 1283US6372544B1Method to reduce occurrences of fillet cracking in flip-chip underfillADVANCED MICRO DEVICES INC·Filed 2000·Granted Apr 16, 2002·34 cites·18 claims
- 1382US6229207B1Organic pin grid array flip chip carrier packageADVANCED MICRO DEVICES INC·Filed 2000·Granted May 8, 2001·33 cites·17 claims
- 1479US5553766AIn-situ device removal for multi-chip modulesIBM·Filed 1994·Granted Sep 10, 1996·31 cites·20 claims
- 1577US6382500B1Solder reflow furnace with flux effluent collector and method of preventing flux contaminationADVANCED MICRO DEVICES INC·Filed 2000·Granted May 7, 2002·33 cites·22 claims
- 1673US4764341ABonding of pure metal films to ceramicsIBM·Filed 1987·Granted Aug 16, 1988·22 cites·16 claims
- 1772US9661770B2Graphic formation via material ablationMICROSOFT TECHNOLOGY LICENSING LLC·Filed 2013·Granted May 23, 2017·3 cites·20 claims
- 1871US7601612B1Method for forming solder joints for a flip chip assemblyGLOBALFOUNDRIES INC·Filed 2005·Granted Oct 13, 2009·5 cites·17 claims
- 1971US4627160AMethod for removal of carbonaceous residues from ceramic structures having internal metallurgyIBM·Filed 1985·Granted Dec 9, 1986·38 cites·17 claims
- 2070US6536649B1Method of preventing residue contamination of semiconductor devices during furnace processingADVANCED MICRO DEVICES INC·Filed 2000·Granted Mar 25, 2003·13 cites·18 claims
- 2168US5153408AMethod and structure for repairing electrical linesIBM·Filed 1990·Granted Oct 6, 1992·33 cites·44 claims
- 2267US5779133AIn-situ device removal for multi-chip modulesIBM·Filed 1996·Granted Jul 14, 1998·22 cites·19 claims
- 2365US6333210B1Process of ensuring detect free placement by solder coating on package padsADVANCED MICRO DEVICES INC·Filed 2000·Granted Dec 25, 2001·12 cites·11 claims
- 2464US6617195B1Method of reflowing organic packages using no-clean fluxADVANCED MICRO DEVICES INC·Filed 2000·Granted Sep 9, 2003·12 cites·14 claims
- 2564US6446818B1Boat for cleaning ball grid array packagesADVANCED MICRO DEVICES INC·Filed 2000·Granted Sep 10, 2002·10 cites·9 claims
- 2664US6409070B1Minimizing flux residue by controlling amount of moisture during reflowADVANCED MICRO DEVICES INC·Filed 2000·Granted Jun 25, 2002·14 cites·14 claims
- 2763US8733423B1Metal alloy injection molding protrusionsMICROSOFT CORP·Filed 2012·Granted May 27, 2014·0 cites·12 claims
- 2862US7923850B2Semiconductor chip with solder joint protection ringADVANCED MICRO DEVICES INC·Filed 2008·Granted Apr 12, 2011·2 cites·23 claims
- 2961US6709963B1Method and apparatus for jet printing a flux pattern selectively on flip-chip bumpsADVANCED MICRO DEVICES INC·Filed 2000·Granted Mar 23, 2004·8 cites·6 claims
- 3060US5605277AHot vacuum device removal process and apparatusIBM·Filed 1994·Granted Feb 25, 1997·18 cites·12 claims
- 3158US9563233B2Electronic device with plated electrical contactMICROSOFT TECHNOLOGY LICENSING LLC·Filed 2014·Granted Feb 7, 2017·1 cites·19 claims
- 3258US6632690B2Method of fabricating reliable laminate flip-chip assemblyADVANCED MICRO DEVICES INC·Filed 2002·Granted Oct 14, 2003·8 cites·8 claims
- 3357US6367679B1Detection of flux residueADVANCED MICRO DEVICES INC·Filed 2000·Granted Apr 9, 2002·6 cites·10 claims
- 3457US6103549ANo clean flux for flip chip assemblyADVANCED MICRO DEVICES INC·Filed 1998·Granted Aug 15, 2000·23 cites·6 claims
- 3556US5543584AStructure for repairing electrical linesIBM·Filed 1992·Granted Aug 6, 1996·21 cites·24 claims
- 3656US4671928AMethod of controlling the sintering of metal particlesIBM·Filed 1984·Granted Jun 9, 1987·17 cites·6 claims
- 3755US6371310B1Boat for land grid array packagesADVANCED MICRO DEVICES INC·Filed 2000·Granted Apr 16, 2002·7 cites·16 claims
- 3855US5988485AFlux cleaning for flip chip technology using environmentally friendly solventsADVANCED MICRO DEVICES INC·Filed 1998·Granted Nov 23, 1999·21 cites·5 claims
- 3953US6722553B2Controlled and programmed deposition of flux on a flip-chip die by sprayingADVANCED MICRO DEVICES INC·Filed 2001·Granted Apr 20, 2004·5 cites·10 claims
- 4053US6333253B1Pattern-block flux depositionADVANCED MICRO DEVICES INC·Filed 2000·Granted Dec 25, 2001·6 cites·10 claims
- 4152US9205486B2Metal alloy injection moldingMICROSOFT CORP·Filed 2012·Granted Dec 8, 2015·0 cites·19 claims
- 4252US6488158B1Boat for organic and ceramic flip chip package assemblyADVANCED MICRO DEVICES INC·Filed 2000·Granted Dec 3, 2002·5 cites·16 claims
- 4350US8297986B2Integrated circuit socketTOO SEAH SUN·Filed 2007·Granted Oct 30, 2012·3 cites·28 claims
- 4450US4776978AMethod of controlling the sintering of metal particlesIBM·Filed 1987·Granted Oct 11, 1988·16 cites·7 claims
- 4548US6258612B1Determination of flux prior to package assemblyADVANCED MICRO DEVICES INC·Filed 2000·Granted Jul 10, 2001·7 cites·13 claims
- 4645US6591992B1Boat for cleaning ball grid array packagesADVANCED MICRO DEVICES INC·Filed 2002·Granted Jul 15, 2003·3 cites·8 claims
- 4744US2014150982A1Metal Alloy Injection TechniquesMICROSOFT CORP·Filed 2012·Application pending·0 cites
- 4843US4824009AProcess for braze attachment of electronic package membersIBM·Filed 1981·Granted Apr 25, 1989·11 cites·8 claims
- 4939US2003047527A1Boat for ball attach manufacturing processADVANCED MICRO DEVICES INC·Filed 2002·Application pending·0 cites
- 5036US7215030B2Lead-free semiconductor packageADVANCED MICRO DEVICES INC·Filed 2005·Granted May 8, 2007·0 cites·8 claims
Showing the top 50 of 56 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →