Inventor · disambiguated record
Ralf Otremba
Also filed as: OTREMBA RALF
251 granted patents·40 pending applications·1,679 citations·filing 2001–2025
99Inventor score
Files withINFINEON TECHNOLOGIES AG140INFINEON TECHNOLOGIES AUSTRIA AG70OTREMBA RALF55INFINEON TECHNOLOGIES AUSTRIA18HOEGLAUER JOSEF1
Top patents by PatentIndex Score
291 records- 0199US7391121B2Semiconductor device with a number of bonding leads and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2006·Granted Jun 24, 2008·137 cites·24 claims
- 0299US7271470B1Electronic component having at least two semiconductor power devicesINFINEON TECHNOLOGIES AG·Filed 2006·Granted Sep 18, 2007·140 cites·25 claims
- 0398US9331060B2Device including two power semiconductor chips and manufacturing thereofINFINEON TECHNOLOGIES AG·Filed 2015·Granted May 3, 2016·48 cites·8 claims
- 0497US8698293B2Multi-chip package and method of manufacturing thereofOTREMBA RALF·Filed 2012·Granted Apr 15, 2014·40 cites·30 claims
- 0596US7598603B2Electronic component having a power switch with an anode thereof mounted on a die attach region of a heat sinkINFINEON TECHNOLOGIES AG·Filed 2006·Granted Oct 6, 2009·42 cites·22 claims
- 0695US8975711B2Device including two power semiconductor chips and manufacturing thereofOTREMBA RALF·Filed 2011·Granted Mar 10, 2015·22 cites·26 claims
- 0795US7880280B2Electronic component and method for manufacturing an electronic componentINFINEON TECHNOLOGIES AG·Filed 2007·Granted Feb 1, 2011·37 cites·23 claims
- 0895US7799614B2Method of fabricating a power electronic deviceINFINEON TECHNOLOGIES AG·Filed 2007·Granted Sep 21, 2010·30 cites·22 claims
- 0995US7759163B2Semiconductor moduleINFINEON TECHNOLOGIES AG·Filed 2008·Granted Jul 20, 2010·49 cites·17 claims
- 1095US7569920B2Electronic component having at least one vertical semiconductor power transistorINFINEON TECHNOLOGIES AG·Filed 2006·Granted Aug 4, 2009·40 cites·30 claims
- 1194US7800217B2Power semiconductor device connected in distinct layers of plasticINFINEON TECHNOLOGIES AG·Filed 2007·Granted Sep 21, 2010·27 cites·25 claims
- 1293US9837288B2Semiconductor power package and method of manufacturing the sameINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2016·Granted Dec 5, 2017·8 cites·20 claims
- 1393US7800208B2Device with a plurality of semiconductor chipsINFINEON TECHNOLOGIES AG·Filed 2007·Granted Sep 21, 2010·27 cites·16 claims
- 1493US7663212B2Electronic component having exposed surfacesINFINEON TECHNOLOGIES AG·Filed 2006·Granted Feb 16, 2010·29 cites·24 claims
- 1593US7291869B2Electronic module with stacked semiconductorsINFIEON TECHNOLOGIES A G·Filed 2006·Granted Nov 6, 2007·45 cites·24 claims
- 1692US9986636B2Printed circuit boards having a dielectric layer which includes a polymer and methods of manufacturing such printed circuit boardsINFINEON TECHNOLOGIES AG·Filed 2017·Granted May 29, 2018·6 cites·6 claims
- 1792US7947532B2Power semiconductor device and method for its productionINFINEON TECHNOLOGIES AG·Filed 2010·Granted May 24, 2011·12 cites·15 claims
- 1892US7757392B2Method of producing an electronic componentINFINEON TECHNOLOGIES AG·Filed 2006·Granted Jul 20, 2010·24 cites·9 claims
- 1992US7508012B2Electronic component and method for its assemblyINFINEON TECHNOLOGIES AG·Filed 2006·Granted Mar 24, 2009·23 cites·31 claims
- 2092US7443014B2Electronic module and method of assembling the sameINFINEON TECHNOLOGIES AG·Filed 2005·Granted Oct 28, 2008·24 cites·34 claims
- 2191US11978693B2Semiconductor device package comprising side walls connected with contact pads of a semiconductor dieINFINEON TECHNOLOGIES AG·Filed 2021·Granted May 7, 2024·2 cites·12 claims
- 2291US7732929B2Power semiconductor component with semiconductor chip stack in a bridge circuit and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2006·Granted Jun 8, 2010·23 cites·15 claims
- 2390US9648735B2Printed circuit boards and methods of manufacturing thereofINFINEON TECHNOLOGIES AG·Filed 2015·Granted May 9, 2017·5 cites·12 claims
- 2490US8507320B2Electronic device including a carrier and a semiconductor chip attached to the carrier and manufacturing thereofOTREMBA RALF·Filed 2008·Granted Aug 13, 2013·17 cites·10 claims
- 2590US7969018B2Stacked semiconductor chips with separate encapsulationsINFINEON TECHNOLOGIES AG·Filed 2008·Granted Jun 28, 2011·22 cites·20 claims
- 2690US7786558B2Semiconductor component and methods to produce a semiconductor componentINFINEON TECHNOLOGIES AG·Filed 2005·Granted Aug 31, 2010·20 cites·25 claims
- 2790US7759777B2Semiconductor moduleINFINEON TECHNOLOGIES AG·Filed 2007·Granted Jul 20, 2010·20 cites·7 claims
- 2889US9881862B1Top side cooling for GaN power deviceINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2016·Granted Jan 30, 2018·6 cites·20 claims
- 2989US8138587B2Device including two mounting surfacesOTREMBA RALF·Filed 2008·Granted Mar 20, 2012·15 cites·19 claims
- 3089US8030131B2Semiconductor moduleINFINEON TECHNOLOGIES AG·Filed 2009·Granted Oct 4, 2011·17 cites·13 claims
- 3189US7893545B2Semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2007·Granted Feb 22, 2011·12 cites·9 claims
- 3289US7868465B2Semiconductor device with a metallic carrier and two semiconductor chips applied to the carrierINFINEON TECHNOLOGIES AG·Filed 2007·Granted Jan 11, 2011·18 cites·15 claims
- 3389US7851908B2Semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2007·Granted Dec 14, 2010·19 cites·17 claims
- 3489US7541681B2Interconnection structure, electronic component and method of manufacturing the sameINFINEON TECHNOLOGIES AG·Filed 2006·Granted Jun 2, 2009·17 cites·31 claims
- 3588US9922910B2Functionalized interface structureINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2016·Granted Mar 20, 2018·7 cites·24 claims
- 3688US7642641B2Integrated circuit component with passivation layerINFINEON TECHNOLOGIES AG·Filed 2007·Granted Jan 5, 2010·17 cites·11 claims
- 3787US11600558B2Plurality of transistor packages with exposed source and drain contacts mounted on a carrierINFINEON TECHNOLOGIES AG·Filed 2020·Granted Mar 7, 2023·2 cites·14 claims
- 3887US10256119B2Method of manufacturing a semiconductor power packageINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2017·Granted Apr 9, 2019·4 cites·20 claims
- 3987US9515060B2Multi-chip semiconductor power deviceINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2013·Granted Dec 6, 2016·7 cites·16 claims
- 4087US9443787B2Electronic component and methodINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2013·Granted Sep 13, 2016·7 cites·16 claims
- 4187US8513798B2Power semiconductor chip packageOTREMBA RALF·Filed 2010·Granted Aug 20, 2013·7 cites·18 claims
- 4287US7514778B2Power semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2005·Granted Apr 7, 2009·15 cites·14 claims
- 4386US9048838B2Switching circuitINFINEON TECHNOLOGIES AUSTRIA·Filed 2013·Granted Jun 2, 2015·7 cites·29 claims
- 4486US8987879B2Semiconductor device including a contact clip having protrusions and manufacturing thereofOTREMBA RALF·Filed 2011·Granted Mar 24, 2015·8 cites·22 claims
- 4586US8227908B2Electronic device having contact elements with a specified cross section and manufacturing thereofOTREMBA RALF·Filed 2008·Granted Jul 24, 2012·11 cites·16 claims
- 4686US7821128B2Power semiconductor device having lines within a housingINFINEON TECHNOLOGIES AG·Filed 2006·Granted Oct 26, 2010·15 cites·22 claims
- 4785US10566260B2SMD package with top side coolingINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2018·Granted Feb 18, 2020·4 cites·19 claims
- 4885US9099454B2Molded semiconductor package with backside die metallizationINFINEON TECHNOLOGIES AG·Filed 2013·Granted Aug 4, 2015·8 cites·22 claims
- 4985US7936048B2Power transistor and power semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2007·Granted May 3, 2011·13 cites·19 claims
- 5085US7659611B2Vertical power semiconductor component, semiconductor device and methods for the production thereofINFINEON TECHNOLOGIES AG·Filed 2006·Granted Feb 9, 2010·13 cites·40 claims
Showing the top 50 of 291 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →