Inventor · disambiguated record
Raghav Sreenivasan
Also filed as: SREENIVASAN Raghav
9 granted patents·9 pending applications·10 citations·filing 2018–2023
78Inventor score
Top patents by PatentIndex Score
18 records- 0195US11586067B2Structure and method of advanced LCoS back-plane having robust pixel via metallizationAPPLIED MATERIALS INC·Filed 2020·Granted Feb 21, 2023·5 cites·18 claims
- 0295US11573452B2Method for LCoS DBR multilayer stack protection via sacrificial hardmask for RIE and CMP processesAPPLIED MATERIALS INC·Filed 2020·Granted Feb 7, 2023·5 cites·17 claims
- 0362US11881539B2Structure and method of advanced LCoS back-plane having highly reflective pixel via metallizationAPPLIED MATERIALS INC·Filed 2020·Granted Jan 23, 2024·0 cites·13 claims
- 0457US11819847B2Nanofluidic device with silicon nitride membraneAPPLIED MATERIALS INC·Filed 2020·Granted Nov 21, 2023·0 cites·20 claims
- 0556US2025079357A1Methods and structures for high strength asymmetric dielectric in hybrid bondingAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 0656US2025079312A1Methods and structures for high strength dielectric in hybrid bondingAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 0756US2025087573A1Method and material system for tunable hybrid bond interconnect resistanceAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 0855US11880052B2Structure and method of mirror grounding in LCoS devicesAPPLIED MATERIALS INC·Filed 2020·Granted Jan 23, 2024·0 cites·6 claims
- 0955US2025079356A1Method and material system for high strength selective dielectric in hybrid bondingAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1054US2024321636A1Method to improve interconnect coefficient of thermal expansionAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1153US11908678B2Method of CMP integration for improved optical uniformity in advanced LCOS back-planeAPPLIED MATERIALS INC·Filed 2021·Granted Feb 20, 2024·0 cites·17 claims
- 1251US11536708B2Methods to fabricate dual pore devicesAPPLIED MATERIALS INC·Filed 2020·Granted Dec 27, 2022·0 cites·20 claims
- 1351US2022242725A1Manufacturing methods for dual pore sensorsAPPLIED MATERIALS INC·Filed 2020·Application pending·0 cites
- 1450US2023369532A1Stress relaxation trenches for gallium nitride microled layers on silicon substratesAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 1549US2022236250A1Dual pore sensorsAPPLIED MATERIALS INC·Filed 2020·Application pending·0 cites
- 1648US12033964B2Chemical mechanical polishing for copper dishing controlAPPLIED MATERIALS INC·Filed 2021·Granted Jul 9, 2024·0 cites·20 claims
- 1744US11742363B2Barrier stacks for printed and/or thin film electronics, methods of manufacturing the same, and method of controlling a threshold voltage of a thin film transistorENSURGE MICROPOWER ASA·Filed 2019·Granted Aug 29, 2023·0 cites·10 claims
- 1838US2019013203A1Low-Temperature Dopant Activation Process Using a Cap Layer, and MOS Devices Including the Cap LayerSREENIVASAN Raghav·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →