Inventor · disambiguated record
Raja Swaminathan
Also filed as: SWAMINATHAN RAJA
9 granted patents·26 pending applications·10 citations·filing 2020–2024
79Inventor score
Files withADVANCED MICRO DEVICES INC35
Top patents by PatentIndex Score
35 records- 0196US11911839B2Low temperature hybrid bondingADVANCED MICRO DEVICES INC·Filed 2021·Granted Feb 27, 2024·5 cites·20 claims
- 0296US11830817B2Creating interconnects between dies using a cross-over die and through-die viasADVANCED MICRO DEVICES INC·Filed 2020·Granted Nov 28, 2023·4 cites·20 claims
- 0387US12165981B23D semiconductor package with die-mounted voltage regulatorADVANCED MICRO DEVICES INC·Filed 2021·Granted Dec 10, 2024·1 cites·23 claims
- 0481US2024321702A1Backside powerADVANCED MICRO DEVICES INC·Filed 2023·Application pending·0 cites
- 0580US2024321827A1Thermally aware stacking topologyADVANCED MICRO DEVICES INC·Filed 2023·Application pending·0 cites
- 0680US2024321668A1Temperature sensors in die pair topologyADVANCED MICRO DEVICES INC·Filed 2023·Application pending·0 cites
- 0778US2024324248A1Advanced process in process pair without fusesADVANCED MICRO DEVICES INC·Filed 2023·Application pending·0 cites
- 0875US2025070031A13d semiconductor package with die-mounted voltage regulatorADVANCED MICRO DEVICES INC·Filed 2024·Application pending·0 cites
- 0971US2024071940A1Creating interconnects between dies using a cross-over die and through-die viasADVANCED MICRO DEVICES INC·Filed 2023·Application pending·0 cites
- 1069US12276850B2Fanout module integrating a photonic integrated circuitADVANCED MICRO DEVICES INC·Filed 2023·Granted Apr 15, 2025·0 cites·16 claims
- 1160US2024404897A1Chip complex with embedded interposerADVANCED MICRO DEVICES INC·Filed 2024·Application pending·0 cites
- 1260US2024371714A1Chip package with a glass interposerADVANCED MICRO DEVICES INC·Filed 2024·Application pending·0 cites
- 1359US2025149525A1Chip package with active silicon bridgeADVANCED MICRO DEVICES INC·Filed 2024·Application pending·0 cites
- 1458US11709327B2Fanout module integrating a photonic integrated circuitADVANCED MICRO DEVICES INC·Filed 2021·Granted Jul 25, 2023·0 cites·20 claims
- 1557US12381127B2Semiconductor chip device integrating thermal pipes in three-dimensional packagingADVANCED MICRO DEVICES INC·Filed 2021·Granted Aug 5, 2025·0 cites·20 claims
- 1656US12374645B2Electronic device including dies and an interconnect coupled to the dies and processes of forming the sameADVANCED MICRO DEVICES INC·Filed 2022·Granted Jul 29, 2025·0 cites·16 claims
- 1756US2024234304A1Chip package with core embedded chipletADVANCED MICRO DEVICES INC·Filed 2024·Application pending·0 cites
- 1853US2023268319A1Stacking semiconductor devices by bonding front surfaces of different dies to each otherADVANCED MICRO DEVICES INC·Filed 2022·Application pending·0 cites
- 1953US2025112047A1Chip-on-wafer face-to-back hybrid bonding without support carrierADVANCED MICRO DEVICES INC·Filed 2023·Application pending·0 cites
- 2053US2024047229A1Organic package core for a substrate with high density plated holesADVANCED MICRO DEVICES INC·Filed 2022·Application pending·0 cites
- 2151US12278150B2Semiconductor package with annular package lid structureADVANCED MICRO DEVICES INC·Filed 2021·Granted Apr 15, 2025·0 cites·24 claims
- 2251US2024113070A1Integrating devices into a carrier wafer for three dimensionally stacked semiconductor devicesADVANCED MICRO DEVICES INC·Filed 2022·Application pending·0 cites
- 2351US2023207544A1Semiconductor device with an embedded active deviceADVANCED MICRO DEVICES INC·Filed 2021·Application pending·0 cites
- 2451US2025364486A1Lateral silicon bridge for stacked diesADVANCED MICRO DEVICES INC·Filed 2023·Application pending·0 cites
- 2551US2024047228A1Methods for constructing package substrates with high densityADVANCED MICRO DEVICES INC·Filed 2022·Application pending·0 cites
- 2650US2023069294A1Multi-die communications couplings using a single bridge dieADVANCED MICRO DEVICES INC·Filed 2021·Application pending·0 cites
- 2749US12266611B2Mixed density interconnect architectures using hybrid fan-outADVANCED MICRO DEVICES INC·Filed 2020·Granted Apr 1, 2025·0 cites·19 claims
- 2849US2025323212A1Systems and methods for stack construction of a semiconductor device having redistribution layers in a silicon carrierADVANCED MICRO DEVICES INC·Filed 2023·Application pending·0 cites
- 2949US2024113004A1Connecting a chiplet to an interposer die and to a package interface using a spacer interconnect coupled to a portion of the chipletADVANCED MICRO DEVICES INC·Filed 2022·Application pending·0 cites
- 3049US2022199429A1Structural thermal interfacing for lidded semiconductor packagesADVANCED MICRO DEVICES INC·Filed 2021·Application pending·0 cites
- 3149US2023130354A1Three-dimensional semiconductor package having a stacked passive deviceADVANCED MICRO DEVICES INC·Filed 2021·Application pending·0 cites
- 3248US2025293210A1Systems and methods for packaging a semiconductor deviceADVANCED MICRO DEVICES INC·Filed 2023·Application pending·0 cites
- 3348US2025293203A1Systems and methods for multi-tier multi-die modulesADVANCED MICRO DEVICES INC·Filed 2022·Application pending·0 cites
- 3446US2022208712A1Multi-level bridge interconnectsADVANCED MICRO DEVICES INC·Filed 2020·Application pending·0 cites
- 3546US2023197623A1Electronic device including an integrated circuit die and a support structureADVANCED MICRO DEVICES INC·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →