Inventor · disambiguated record
Ra-Min Tain
Also filed as: TAIN RA-MIN
77 granted patents·27 pending applications·539 citations·filing 2004–2025
99Inventor score
Top patents by PatentIndex Score
104 records- 0196US11690173B2Circuit board structureUNIMICRON TECHNOLOGY CORP·Filed 2022·Granted Jun 27, 2023·4 cites·8 claims
- 0296US7314291B2LED lampIND TECH RES INST·Filed 2004·Granted Jan 1, 2008·145 cites·21 claims
- 0395US10888001B2Circuit carrier board structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2019·Granted Jan 5, 2021·14 cites·12 claims
- 0494US12309943B2Circuit carrier and manufacturing method thereof and package structureUNIMICRON TECHNOLOGY CORP·Filed 2022·Granted May 20, 2025·2 cites·17 claims
- 0593US8810031B2Wafer-to-wafer stack with supporting pedestalCHANG CHI-SHIH·Filed 2010·Granted Aug 19, 2014·27 cites·40 claims
- 0693US7381995B2Lighting device with flipped side-structure of LEDsIND TECH RES INST·Filed 2005·Granted Jun 3, 2008·32 cites·20 claims
- 0792US11808787B2Probe card testing deviceUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted Nov 7, 2023·3 cites·13 claims
- 0892US7413326B2LED lampIND TECH RES INST·Filed 2007·Granted Aug 19, 2008·58 cites·18 claims
- 0992US7354178B2Structure of illuminating unit and structure of illuminating light sourceIND TECH RES INST·Filed 2005·Granted Apr 8, 2008·18 cites·22 claims
- 1089US11410971B2Chip package structureUNIMICRON TECHNOLOGY CORP·Filed 2020·Granted Aug 9, 2022·2 cites·11 claims
- 1188US8049330B2Wafer-level chip scale packaging for LED comprising carrier substrate with thermally conductive through holes and fill channelsIND TECH RES INST·Filed 2005·Granted Nov 1, 2011·18 cites·24 claims
- 1287US7443678B2Flexible circuit board with heat sinkIND TECH RES INST·Filed 2006·Granted Oct 28, 2008·39 cites·17 claims
- 1386US8552554B2Heat dissipation structure for electronic device and fabrication method thereofTAIN RA-MIN·Filed 2011·Granted Oct 8, 2013·9 cites·26 claims
- 1485US8456017B2Filled through-silicon via with conductive composite materialDAI MING-JI·Filed 2011·Granted Jun 4, 2013·10 cites·20 claims
- 1585US8102058B2Chip package structure and method for fabricating the sameHSIEH MING-CHE·Filed 2010·Granted Jan 24, 2012·8 cites·21 claims
- 1683US8674491B2Semiconductor deviceLIU CHUN-KAI·Filed 2011·Granted Mar 18, 2014·7 cites·23 claims
- 1783US8164165B2Wafer-to-wafer stack with supporting pedestalCHANG CHI-SHIH·Filed 2006·Granted Apr 24, 2012·10 cites·35 claims
- 1881US10685922B2Package structure with structure reinforcing element and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2019·Granted Jun 16, 2020·2 cites·8 claims
- 1981US7952368B1Apparatus and method for measuring diode chipIND TECHNOLOGY RES INSTITURE·Filed 2010·Granted May 31, 2011·8 cites·10 claims
- 2080US8075152B2Hermetic light-emitting deviceChen yao shun·Filed 2010·Granted Dec 13, 2011·15 cites·20 claims
- 2179US9859159B2Interconnection structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2015·Granted Jan 2, 2018·3 cites·3 claims
- 2279US8438847B2Heat-pipe electric power generating device and hydrogen/oxygen gas generating apparatus and internal combustion engine system having the sameCHEN YAO-SHUN·Filed 2009·Granted May 14, 2013·5 cites·31 claims
- 2378US9111774B2Wafer-to-wafer stack with supporting postIND TECH RES INST·Filed 2013·Granted Aug 18, 2015·3 cites·35 claims
- 2478US7205719B2Light source with LED and optical protrusionsIND TECH RES INST·Filed 2004·Granted Apr 17, 2007·24 cites·23 claims
- 2578US2025227857A1Manufacturing method of circuit carrierUNIMICRON TECHNOLOGY CORP·Filed 2025·Application pending·0 cites
- 2677US8519524B1Chip stacking structure and fabricating method of the chip stacking structureWU SHENG-TSAI·Filed 2012·Granted Aug 27, 2013·6 cites·31 claims
- 2776US8283613B2Heat-pipe electric-power generating deviceTAIN RA-MIN·Filed 2006·Granted Oct 9, 2012·5 cites·17 claims
- 2876US7610769B2Ultrasonic atomizing cooling apparatusIND TECH RES INST·Filed 2005·Granted Nov 3, 2009·8 cites·17 claims
- 2975US10141224B2Manufacturing method of interconnection structureUNIMICRON TECHNOLOGY CORP·Filed 2017·Granted Nov 27, 2018·2 cites·6 claims
- 3075US2025393127A1Substrate structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2025·Application pending·0 cites
- 3174US11127664B2Circuit board and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2016·Granted Sep 21, 2021·2 cites·10 claims
- 3272US2025351272A1Substrate structureUNIMICRON TECHNOLOGY CORP·Filed 2025·Application pending·0 cites
- 3371US8546924B2Package structures for integrating thermoelectric components with stacking chipsYU CHIH-KUANG·Filed 2010·Granted Oct 1, 2013·3 cites·16 claims
- 3471US8278755B2Heat dissipation structure for electronic device and fabrication method thereofTAIN RA-MIN·Filed 2010·Granted Oct 2, 2012·3 cites·26 claims
- 3571US7586187B2Interconnect structure with stress buffering ability and the manufacturing method thereofIND TECH RES INST·Filed 2006·Granted Sep 8, 2009·5 cites·12 claims
- 3669US11410940B2Package structure with structure reinforcing element and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted Aug 9, 2022·0 cites·6 claims
- 3769US10797017B2Embedded chip package, manufacturing method thereof, and package-on-package structureUNIMICRON TECHNOLOGY CORP·Filed 2019·Granted Oct 6, 2020·1 cites·20 claims
- 3869US2025240887A1Circuit board and method of manufacturing the sameUNIMICRON TECHNOLOGY CORP·Filed 2025·Application pending·0 cites
- 3968US9368442B1Method for manufacturing an interposer, interposer and chip package structureUNIMICRON TECHNOLOGY CORP·Filed 2014·Granted Jun 14, 2016·2 cites·13 claims
- 4068US8004079B2Chip package structure and manufacturing method thereofIND TECH RES INST·Filed 2009·Granted Aug 23, 2011·4 cites·34 claims
- 4167US11337303B2Circuit board structureUNIMICRON TECHNOLOGY CORP·Filed 2019·Granted May 17, 2022·1 cites·15 claims
- 4267US10957658B2Package structure with structure reinforcing element and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2020·Granted Mar 23, 2021·0 cites·9 claims
- 4367US8502224B2Measuring apparatus that includes a chip having a through silicon via, a heater, and a stress sensorTAIN RA-MIN·Filed 2010·Granted Aug 6, 2013·2 cites·19 claims
- 4464US7812898B2Light source module, illuminating apparatus and liquid crystal displayIND TECH RES INST·Filed 2006·Granted Oct 12, 2010·3 cites·37 claims
- 4564US2024159473A1Vapor chamber structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 4664US2023067112A1Vapor chamber structureUNIMICRON TECHNOLOGY CORP·Filed 2022·Application pending·0 cites
- 4763US8397584B2Fabricating method and testing method of semiconductor device and mechanical integrity testing apparatusHSIEH MING-CHE·Filed 2011·Granted Mar 19, 2013·1 cites·12 claims
- 4863US7754599B2Structure for reducing stress for vias and fabricating method thereofIND TECH RES INST·Filed 2009·Granted Jul 13, 2010·2 cites·11 claims
- 4963US7683522B2Composite mode transducer and cooling device having the composite mode transducerIND TECH RES INST·Filed 2008·Granted Mar 23, 2010·2 cites·19 claims
- 5063US2025240889A1Substrate structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2025·Application pending·0 cites
Showing the top 50 of 104 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →