Inventor · disambiguated record
Reinhold Bayerer
Also filed as: BAYERER REINHOLD
86 granted patents·4 pending applications·1,018 citations·filing 1986–2020
99Inventor score
Files withINFINEON TECHNOLOGIES AG42BAYERER REINHOLD24ASEA BROWN BOVERI7EUPEC GMBH & CO KG4BAGINSKI PATRICK2
Top patents by PatentIndex Score
90 records- 0197US9355950B1Power semiconductor module having low gate drive inductance flexible board connectionINFINEON TECHNOLOGIES AG·Filed 2015·Granted May 31, 2016·21 cites·21 claims
- 0295US7808100B2Power semiconductor module with pressure element and method for fabricating a power semiconductor module with a pressure elementINFINEON TECHNOLOGIES AG·Filed 2008·Granted Oct 5, 2010·40 cites·13 claims
- 0395US7791208B2Power semiconductor arrangementINFINEON TECHNOLOGIES AG·Filed 2007·Granted Sep 7, 2010·36 cites·23 claims
- 0494US9041196B2Semiconductor module arrangement and method for producing and operating a semiconductor module arrangementINFINEON TECHNOLOGIES AG·Filed 2013·Granted May 26, 2015·18 cites·17 claims
- 0594US7768337B2IGBT-driver circuit for desaturated turn-off with high desaturation levelINFINEON TECHNOLOGIES AG·Filed 2008·Granted Aug 3, 2010·22 cites·16 claims
- 0693US8593817B2Power semiconductor module and method for operating a power semiconductor moduleBAYERER REINHOLD·Filed 2010·Granted Nov 26, 2013·19 cites·25 claims
- 0793US4788626APower semiconductor moduleBBC BROWN BOVERI & CIE·Filed 1987·Granted Nov 29, 1988·159 cites·10 claims
- 0892US10312167B2Semiconductor package, assembly and module arrangements for measuring gate-to-emitter/source voltageINFINEON TECHNOLOGIES AG·Filed 2017·Granted Jun 4, 2019·9 cites·5 claims
- 0992US8120391B2Circuit arrangement including a voltage supply circuit and semiconductor switching elementBAYERER REINHOLD·Filed 2009·Granted Feb 21, 2012·20 cites·10 claims
- 1092US7755185B2Arrangement for cooling a power semiconductor moduleINFINEON TECHNOLOGIES AG·Filed 2006·Granted Jul 13, 2010·28 cites·50 claims
- 1191US10462921B2Method for producing an electronic module assembly and electronic module assemblyINFINEON TECHNOLOGIES AG·Filed 2017·Granted Oct 29, 2019·7 cites·19 claims
- 1291US8319335B2Power semiconductor module, power semiconductor module assembly and method for fabricating a power semiconductor module assemblyBAYERER REINHOLD·Filed 2010·Granted Nov 27, 2012·14 cites·25 claims
- 1391US7466185B2IGBT-Driver circuit for desaturated turn-off with high desaturation levelINFINEON TECHNOLOGIES AG·Filed 2006·Granted Dec 16, 2008·17 cites·16 claims
- 1490US8487407B2Low impedance gate control method and apparatusBAYERER REINHOLD·Filed 2011·Granted Jul 16, 2013·12 cites·21 claims
- 1588US9106124B2Low-inductance power semiconductor assemblyBAYERER REINHOLD·Filed 2011·Granted Aug 11, 2015·10 cites·8 claims
- 1688US7701051B2Power semiconductor moduleINFINEON TECHNOLOGIES AG·Filed 2005·Granted Apr 20, 2010·20 cites·20 claims
- 1787US9888563B2Electronics assembly with interference-suppression capacitorsINFINEON TECHNOLOGIES AG·Filed 2016·Granted Feb 6, 2018·6 cites·21 claims
- 1887US8787003B2Low inductance capacitor module and power system with low inductance capacitor moduleDOMES DANIEL·Filed 2011·Granted Jul 22, 2014·10 cites·19 claims
- 1987US8222928B2Circuit arrangement including voltage supply circuitBAYERER REINHOLD·Filed 2009·Granted Jul 17, 2012·14 cites·14 claims
- 2087US8154114B2Power semiconductor moduleBAYERER REINHOLD·Filed 2007·Granted Apr 10, 2012·16 cites·42 claims
- 2187US5574312ALow-inductance power semiconductor moduleABB MANAGEMENT AG·Filed 1995·Granted Nov 12, 1996·98 cites·19 claims
- 2286US8018047B2Power semiconductor module including a multilayer substrateINFINEON TECHNOLOGIES AG·Filed 2009·Granted Sep 13, 2011·19 cites·22 claims
- 2385US7511961B2Base plate for a power semiconductor moduleINFINEON TECHNOLOGIES AG·Filed 2006·Granted Mar 31, 2009·14 cites·17 claims
- 2484US9688060B2Method for producing a composite and a power semiconductor moduleBAYERER REINHOLD·Filed 2012·Granted Jun 27, 2017·4 cites·29 claims
- 2584US8992267B2Connecting system for electrically connecting electronic devices and method for connecting an electrically conductive first connector and an electrically conductive second connectorBAYERER REINHOLD·Filed 2010·Granted Mar 31, 2015·6 cites·19 claims
- 2684US8587116B2Semiconductor module comprising an insertHOHLFELD OLAF·Filed 2010·Granted Nov 19, 2013·8 cites·14 claims
- 2783US8773172B2Driver circuit with tight control of gate voltageINFINEON TECHNOLOGIES AG·Filed 2012·Granted Jul 8, 2014·6 cites·31 claims
- 2883US7548825B2Method and apparatus for current and temperature measurement in an electronic power circuitINFINEON TECHNOLOGIES AG·Filed 2007·Granted Jun 16, 2009·13 cites·9 claims
- 2982US8155916B2Semiconductor component and method of determining temperatureBAGINSKI PATRICK·Filed 2008·Granted Apr 10, 2012·12 cites·13 claims
- 3081US10453742B2Power semiconductor package having a parallel plate waveguideINFINEON TECHNOLOGIES AG·Filed 2018·Granted Oct 22, 2019·2 cites·19 claims
- 3181US8466548B2Semiconductor device including excess solderBAYERER REINHOLD·Filed 2011·Granted Jun 18, 2013·7 cites·25 claims
- 3280US8823175B2Reliable area joints for power semiconductorsBAYERER REINHOLD·Filed 2012·Granted Sep 2, 2014·5 cites·27 claims
- 3380US8164176B2Semiconductor module arrangementSIEPE DIRK·Filed 2006·Granted Apr 24, 2012·10 cites·9 claims
- 3480US7724065B2Desaturation circuit for an IGBTINFINEON TECHNOLOGIES AG·Filed 2006·Granted May 25, 2010·13 cites·27 claims
- 3578US10008411B2Parallel plate waveguide for power circuitsINFINEON TECHNOLOGIES AG·Filed 2016·Granted Jun 26, 2018·2 cites·4 claims
- 3678US7821130B2Module including a rough solder jointINFINEON TECHNOLOGIES AG·Filed 2008·Granted Oct 26, 2010·7 cites·19 claims
- 3776US9196562B2Semiconductor arrangement, semiconductor module, and method for connecting a semiconductor chip to a ceramic substrateSIEPE DIRK·Filed 2011·Granted Nov 24, 2015·4 cites·15 claims
- 3876US4766481APower semiconductor moduleBBC BROWN BOVERI & CIE·Filed 1986·Granted Aug 23, 1988·46 cites·10 claims
- 3975US7800213B2Power semiconductor circuit with busbar systemINFINEON TECHNOLOGIES AG·Filed 2006·Granted Sep 21, 2010·6 cites·16 claims
- 4075US7315439B2Method and circuit arrangement for limiting an overvoltageEUPEC GMBH & CO KG·Filed 2004·Granted Jan 1, 2008·18 cites·9 claims
- 4174US10410952B2Power semiconductor packages having a substrate with two or more metal layers and one or more polymer-based insulating layers for separating the metal layersINFINEON TECHNOLOGIES AG·Filed 2017·Granted Sep 10, 2019·2 cites·24 claims
- 4272US10134654B2Double-encapsulated power semiconductor module and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2017·Granted Nov 20, 2018·2 cites·15 claims
- 4371US7910952B2Power semiconductor arrangementINFINEON TECHNOLOGIES AG·Filed 2007·Granted Mar 22, 2011·5 cites·23 claims
- 4470US10104812B2Elastic mounting of power modulesBAYERER REINHOLD·Filed 2011·Granted Oct 16, 2018·3 cites·1 claims
- 4570US10032755B2Power semiconductor arrangement having a plurality of power semiconductor switching elements and reduced inductance asymmetryINFINEON TECHNOLOGIES AG·Filed 2016·Granted Jul 24, 2018·2 cites·17 claims
- 4669US10032743B2Method for producing a semiconductor moduleINFINEON TECHNOLOGIES AG·Filed 2014·Granted Jul 24, 2018·4 cites·18 claims
- 4769US8317525B2Press-fit connections for electronic modulesBAYERER REINHOLD·Filed 2011·Granted Nov 27, 2012·6 cites·10 claims
- 4869US5773320AMethod for producing a power semiconductor moduleASEA BROWN BOVERI·Filed 1995·Granted Jun 30, 1998·39 cites·8 claims
- 4968US8922030B2Moisture-tight semiconductor module and method for producing a moisture-tight semiconductor moduleINFINEON TECHNOLOGIES AG·Filed 2013·Granted Dec 30, 2014·2 cites·20 claims
- 5068US8212413B2Circuit assembly for gating a power semiconductor switchJANSEN UWE·Filed 2009·Granted Jul 3, 2012·7 cites·13 claims
Showing the top 50 of 90 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →