Inventor · disambiguated record
Reinhard Hess
Also filed as: HESS REINHARD
5 granted patents·69 citations·filing 2010–2015
78Inventor score
Top patents by PatentIndex Score
5 records- 0197US8183696B2Packaged semiconductor device with encapsulant embedding semiconductor chip that includes contact padsMEYER THORSTEN·Filed 2010·Granted May 22, 2012·47 cites·20 claims
- 0293US8741690B2Packaged semiconductor device with encapsulant embedding semiconductor chip that includes contact padsMEYER THORSTEN·Filed 2012·Granted Jun 3, 2014·16 cites·25 claims
- 0376US8951915B2Methods for manufacturing a chip arrangement, methods for manufacturing a chip package, a chip package and chip arrangementsHESS REINHARD·Filed 2012·Granted Feb 10, 2015·6 cites·14 claims
- 0446US9576875B2Methods for manufacturing a chip arrangement, methods for manufacturing a chip package, a chip package and chip arrangementsINFINEON TECHNOLOGIES AG·Filed 2015·Granted Feb 21, 2017·0 cites·11 claims
- 0540US9356092B2Semiconductor device and method for manufacturing a semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2013·Granted May 31, 2016·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →