Inventor · disambiguated record
Reiji Higuchi
Also filed as: HIGUCHI REIJI
15 granted patents·3 pending applications·151 citations·filing 2002–2016
92Inventor score
Top patents by PatentIndex Score
18 records- 0188US7312400B2Multilayer wiring board, base for multilayer wiring board, printed wiring board and its manufacturing methodFUJIKURA LTD·Filed 2003·Granted Dec 25, 2007·44 cites·35 claims
- 0287US6768064B2Multilayer wiring board assembly, multilayer wiring board assembly component and method of manufacture thereofFUJIKURA LTD·Filed 2002·Granted Jul 27, 2004·36 cites·6 claims
- 0385US6831236B2Multilayer wiring board assembly, multilayer wiring board assembly component and method of manufacture thereofFUJIKURA LTD·Filed 2002·Granted Dec 14, 2004·32 cites·31 claims
- 0479US9952361B2IR cut filter, method for manufacturing the same, and solid-state imaging deviceFUJIFILM CORP·Filed 2015·Granted Apr 24, 2018·3 cites·14 claims
- 0568US8210010B2Key and locking deviceHIGUCHI REIJI·Filed 2011·Granted Jul 3, 2012·4 cites·9 claims
- 0667US7122746B2Multilayer wiring board assembly, multilayer wiring board assembly component and method of manufacture thereofFUJIKURA LTD·Filed 2004·Granted Oct 17, 2006·10 cites·10 claims
- 0767US6914200B2Multilayer wiring board assembly, multilayer wiring board assembly component and method of manufacture thereofFUJIKURA LTD·Filed 2004·Granted Jul 5, 2005·10 cites·6 claims
- 0859US9939060B2Shift deviceTOKAI RIKA CO LTD·Filed 2014·Granted Apr 10, 2018·3 cites·8 claims
- 0956US6914199B2Multilayer wiring board assembly, multilayer wiring board assembly component and method of manufacture thereofFUJIKURA LTD·Filed 2004·Granted Jul 5, 2005·5 cites·31 claims
- 1051US8726495B2Multi-layer board manufacturing method thereofNAKAO OSAMU·Filed 2008·Granted May 20, 2014·1 cites·11 claims
- 1147US7776199B2Printed wiring board and production method thereofFUJIKURA LTD·Filed 2004·Granted Aug 17, 2010·3 cites·8 claims
- 1246US9032828B2Shift deviceTOKAI RIKA CO LTD·Filed 2013·Granted May 19, 2015·0 cites·6 claims
- 1346US2016362586A1Conductive film laminate and touch panel using the sameFUJIFILM CORP·Filed 2016·Application pending·0 cites
- 1445US2016253035A1Laminate for touch panel and flat panel displayFUJIFILM CORP·Filed 2016·Application pending·0 cites
- 1542US9074675B2Shift deviceTOKAI RIKA CO LTD·Filed 2013·Granted Jul 7, 2015·0 cites·2 claims
- 1641US9571706B2Support plate for solid-state imaging element, method for manufacturing the same, and solid-state imaging deviceFUJIFILM CORP·Filed 2015·Granted Feb 14, 2017·0 cites·19 claims
- 1739US7421779B2Multilayer board manufacturing methodFUJIKURA LTD·Filed 2004·Granted Sep 9, 2008·0 cites·6 claims
- 1838US2016216809A1Laminate for touch panelFUJIFILM CORP·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →