Inventor · disambiguated record
Reza-Ur Rahman Khan
Also filed as: KHAN REZA · KHAN REZA-UR R · KHAN REZA-UR RAHMAN
38 granted patents·7 pending applications·2,002 citations·filing 2000–2014
99Inventor score
Top patents by PatentIndex Score
45 records- 0198US7781266B2Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in leadframe integrated circuit (IC) packagesBROADCOM CORP·Filed 2009·Granted Aug 24, 2010·83 cites·15 claims
- 0298US7582951B2Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in leadframe integrated circuit (IC) packagesBROADCOM CORP·Filed 2005·Granted Sep 1, 2009·109 cites·44 claims
- 0398US6989593B2Die-up ball grid array package with patterned stiffener openingBROADCOM CORP·Filed 2002·Granted Jan 24, 2006·93 cites·25 claims
- 0498US6906414B2Ball grid array package with patterned stiffener layerBROADCOM CORP·Filed 2002·Granted Jun 14, 2005·222 cites·37 claims
- 0598US6861750B2Ball grid array package with multiple interposersBROADCOM CORP·Filed 2002·Granted Mar 1, 2005·163 cites·33 claims
- 0697US7161239B2Ball grid array package enhanced with a thermal and electrical connectorBROADCOM CORP·Filed 2002·Granted Jan 9, 2007·105 cites·8 claims
- 0796US8021927B2Die down ball grid array packages and method for making sameBROADCOM CORP·Filed 2010·Granted Sep 20, 2011·25 cites·27 claims
- 0895US7227256B2Die-up ball grid array package with printed circuit board attachable heat spreaderBROADCOM CORP·Filed 2002·Granted Jun 5, 2007·60 cites·27 claims
- 0995US7005737B2Die-up ball grid array package with enhanced stiffenerBROADCOM CORP·Filed 2002·Granted Feb 28, 2006·58 cites·32 claims
- 1094US7719110B2Flip chip package including a non-planar heat spreader and method of making the sameBROADCOM CORP·Filed 2007·Granted May 18, 2010·27 cites·15 claims
- 1194US7271479B2Flip chip package including a non-planar heat spreader and method of making the sameBROADCOM CORP·Filed 2004·Granted Sep 18, 2007·72 cites·39 claims
- 1294US6853070B2Die-down ball grid array package with die-attached heat spreader and method for making the sameBROADCOM CORP·Filed 2001·Granted Feb 8, 2005·82 cites·50 claims
- 1393US8310067B2Ball grid array package enhanced with a thermal and electrical connectorZHAO SAM ZIQUN·Filed 2011·Granted Nov 13, 2012·12 cites·19 claims
- 1493US7781882B2Low voltage drop and high thermal performance ball grid array packageBROADCOM CORP·Filed 2009·Granted Aug 24, 2010·22 cites·25 claims
- 1593US7102225B2Die-up ball grid array package with printed circuit board attachable heat spreaderBROADCOM CORP·Filed 2002·Granted Sep 5, 2006·49 cites·25 claims
- 1693US7038312B2Die-up ball grid array package with attached stiffener ringBROADCOM CORP·Filed 2002·Granted May 2, 2006·59 cites·14 claims
- 1792US7893546B2Ball grid array package enhanced with a thermal and electrical connectorBROADCOM CORP·Filed 2008·Granted Feb 22, 2011·16 cites·10 claims
- 1892US7312108B2Method for assembling a ball grid array package with two substratesBROADCOM CORP·Filed 2005·Granted Dec 25, 2007·25 cites·30 claims
- 1992US6825108B2Ball grid array package fabrication with IC die support structuresBROADCOM CORP·Filed 2002·Granted Nov 30, 2004·58 cites·18 claims
- 2091US8686558B2Thermally and electrically enhanced ball grid array packageZHAO SAM ZIQUN·Filed 2011·Granted Apr 1, 2014·9 cites·20 claims
- 2191US7482686B2Multipiece apparatus for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages and method of making the sameBRAODCOM CORP·Filed 2004·Granted Jan 27, 2009·62 cites·19 claims
- 2291US7432586B2Apparatus and method for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packagesBROADCOM CORP·Filed 2004·Granted Oct 7, 2008·66 cites·34 claims
- 2391US7259448B2Die-up ball grid array package with a heat spreader and method for making the sameBROADCOM CORP·Filed 2001·Granted Aug 21, 2007·61 cites·14 claims
- 2490US7245500B2Ball grid array package with stepped stiffener layerBROADCOM CORP·Filed 2002·Granted Jul 17, 2007·58 cites·71 claims
- 2590US7241645B2Method for assembling a ball grid array package with multiple interposersBROADCOM CORP·Filed 2004·Granted Jul 10, 2007·50 cites·20 claims
- 2690US6876553B2Enhanced die-up ball grid array package with two substratesBROADCOM CORP·Filed 2002·Granted Apr 5, 2005·52 cites·29 claims
- 2789US7786591B2Die down ball grid array packageBROADCOM CORP·Filed 2004·Granted Aug 31, 2010·46 cites·20 claims
- 2889US7259457B2Die-up ball grid array package including a substrate capable of mounting an integrated circuit die and method for making the sameBROADCOM CORP·Filed 2004·Granted Aug 21, 2007·46 cites·21 claims
- 2989US6879039B2Ball grid array package substrates and method of making the sameBROADCOM CORP·Filed 2001·Granted Apr 12, 2005·54 cites·51 claims
- 3088US7791189B2Multipiece apparatus for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages and method of making the sameBROADCOM CORP·Filed 2009·Granted Sep 7, 2010·13 cites·7 claims
- 3187US7132744B2Enhanced die-up ball grid array packages and method for making the sameBROADCOM CORP·Filed 2001·Granted Nov 7, 2006·45 cites·24 claims
- 3286US6887741B2Method for making an enhanced die-up ball grid array package with two substratesBROADCOM CORP·Filed 2003·Granted May 3, 2005·37 cites·50 claims
- 3384US7405145B2Ball grid array package substrates with a modified central opening and method for making the sameBROADCOM CORP·Filed 2005·Granted Jul 29, 2008·11 cites·20 claims
- 3484US7078806B2IC die support structures for ball grid array package fabricationBROADCOM CORP·Filed 2004·Granted Jul 18, 2006·30 cites·22 claims
- 3576US7566591B2Method and system for secure heat sink attachment on semiconductor devices with macroscopic uneven surface featuresBROADCOM CORP·Filed 2005·Granted Jul 28, 2009·6 cites·15 claims
- 3674US9390993B2Semiconductor border protection sealantBROADCOM CORP·Filed 2014·Granted Jul 12, 2016·3 cites·31 claims
- 3768US7859101B2Die-up ball grid array package with die-attached heat spreaderBROADCOM CORP·Filed 2002·Granted Dec 28, 2010·7 cites·34 claims
- 3862US7629681B2Ball grid array package with patterned stiffener surface and method of assembling the sameBROADCOM CORP·Filed 2004·Granted Dec 8, 2009·6 cites·8 claims
- 3960US2015137343A1Enhanced die-up ball grid array and method for making the sameBROADCOM CORP·Filed 2014·Application pending·0 cites
- 4057US2014210083A1Thermally and electrically enhanced ball grid array packageBROADCOM CORP·Filed 2014·Application pending·0 cites
- 4156US2009203172A1Enhanced Die-Up Ball Grid Array and Method for Making the SameBROADCOM CORP·Filed 2009·Application pending·0 cites
- 4253US2010025810A1Method and System for Secure Heat Sink Attachment on Semiconductor Devices with Macroscopic Uneven Surface FeaturesBROADCOM CORP·Filed 2009·Application pending·0 cites
- 4343US2005029657A1Enhanced die-up ball grid array and method for making the sameBROADCOM CORP·Filed 2004·Application pending·0 cites
- 4439US2006091542A1Flip chip package including a heat spreader having an edge with a recessed edge portion and method of making the sameBROADCOM CORP·Filed 2004·Application pending·0 cites
- 4539US2002079572A1Enhanced die-up ball grid array and method for making the sameFiled 2000·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →