Thermally and electrically enhanced ball grid array package

Abstract

In one embodiment, a device package is provided. The device package can include a substrate having first and second opposing surfaces, an opening being formed through the first and second surfaces of the substrate; a stiffener coupled to the first surface of the substrate, the stiffener having an extending portion that extends into the opening of the substrate; and an integrated circuit (IC) die coupled to the extending portion of the stiffener, the IC die being electrically coupled to the substrate.

What is claimed is:  
     
         1 . A device package, comprising:
 a substrate having first and second opposing surfaces, wherein an opening is formed through the first and second surfaces of the substrate;   a stiffener coupled to the first surface of the substrate, the stiffener having an extending portion that extends into the opening of the substrate; and   an integrated circuit (IC) die coupled to the extending portion of the stiffener, the IC die being electrically coupled to the substrate.   
     
     
         2 . The device package of  claim 1 , wherein the substrate comprises:
 a metal layer, wherein the IC die is electrically coupled to the metal layer.   
     
     
         3 . The device package of  claim 2 , wherein the substrate further comprises:
 a circuit mask coupled to the metal layer.   
     
     
         4 . The device package of  claim 3 , wherein the substrate further comprises:
 a dielectric layer coupled to the metal layer.   
     
     
         5 . The device package of  claim 4 , wherein the dielectric layer is coupled to the metal layer with an adhesive. 
     
     
         6 . The device package of  claim 2 , wherein the metal layer comprises a trace. 
     
     
         7 . The device package of  claim 2 , wherein the metal layer is a first metal layer and wherein the the substrate further comprises a second metal layer coupled to the first metal layer. 
     
     
         8 . The device package of  claim 2 , further comprising:
 a plurality of connection elements attached to the substrate and electrically coupled to the metal layer.   
     
     
         9 . The device package of  claim 8 , wherein the plurality of connection elements comprise a plurality of solder balls. 
     
     
         10 . The device package of  claim 1 , further comprising:
 a wire connection coupled to the IC die.   
     
     
         11 . The device package of  claim 10 , wherein the wire connection is coupled to the substrate. 
     
     
         12 . The device package of  claim 11 , wherein the stiffener comprises an opening formed therein and the wire connection passes through the opening. 
     
     
         13 . The device package of  claim 10 , wherein the wire connection is coupled to the stiffener. 
     
     
         14 . The device package of  claim 13 , wherein the stiffener comprises a plating surface and wherein the wire connection is coupled to the plating surface. 
     
     
         15 . The device package of  claim 1 , wherein the extending portion of the stiffener is exposed at an outer surface of the device package. 
     
     
         16 . The device package of  claim 1 , wherein the stiffener comprises a metal. 
     
     
         17 . A device package, comprising:
 a substrate having first and second opposing surfaces;   a stiffener coupled to the first surface of the substrate, wherein the substrate comprises a plurality of conductive paths extending between the first and second surfaces of the substrate and contacting the stiffener; and   an integrated circuit (IC) die coupled to the stiffener and electrically coupled to the substrate.   
     
     
         18 . The device package of  claim 17 , further comprising:
 a plurality of connection elements coupled to the second surface of the substrate, wherein a conductive path of the plurality of conductive paths is electrically coupled to a connection element of the plurality of connection elements.   
     
     
         19 . The device package of  claim 17 , wherein the substrate comprises: a metal layer. 
     
     
         20 . The device package of  claim 19 , further comprising:
 a wire connection coupled to the IC die and the metal layer.