Inventor · disambiguated record
Richard L. Bechtel
Also filed as: BECHTEL RICHARD · BECHTEL RICHARD L
15 granted patents·891 citations·filing 1987–2001
96Inventor score
Top patents by PatentIndex Score
15 records- 0193US6459582B1Heatsink apparatus for de-coupling clamping forces on an integrated circuit packageFUJITSU LTD·Filed 2000·Granted Oct 1, 2002·74 cites·46 claims
- 0293US5182632AHigh density multichip package with interconnect structure and heatsinkTACTICAL FABS INC·Filed 1991·Granted Jan 26, 1993·180 cites·51 claims
- 0391US6483708B2Heatsink apparatus for de-coupling clamping forces on an integrated circuit packageFUJITSU LTD·Filed 2001·Granted Nov 19, 2002·58 cites·15 claims
- 0489US5371991ARe-bar clamp assemblyFiled 1987·Granted Dec 13, 1994·109 cites·8 claims
- 0588US5691949AVery high density wafer scale device architectureTACTICAL FABS INC·Filed 1996·Granted Nov 25, 1997·63 cites·16 claims
- 0688US4836861ASolar cell and cell mountTACTICAL FABS INC·Filed 1988·Granted Jun 6, 1989·94 cites·55 claims
- 0787US5223741APackage for an integrated circuit structureTACTICAL FABS INC·Filed 1989·Granted Jun 29, 1993·76 cites·47 claims
- 0881US5502315AElectrically programmable interconnect structure having a PECVD amorphous silicon elementQUICKLOGIC CORP·Filed 1993·Granted Mar 26, 1996·58 cites·5 claims
- 0979US5780919AElectrically programmable interconnect structure having a PECVD amorphous silicon elementQUICKLOGIC CORP·Filed 1996·Granted Jul 14, 1998·47 cites·3 claims
- 1074US5315130AVery high density wafer scale device architectureTACTICAL FABS INC·Filed 1990·Granted May 24, 1994·29 cites·51 claims
- 1174US5252507AVery high density wafer scale device architectureTACTICAL FABS INC·Filed 1990·Granted Oct 12, 1993·37 cites·11 claims
- 1270US5514884AVery high density wafer scale device architectureTACTICAL FABS INC·Filed 1994·Granted May 7, 1996·23 cites·5 claims
- 1354US5717230AField programmable gate array having reproducible metal-to-metal amorphous silicon antifusesQUICKLOGIC CORP·Filed 1994·Granted Feb 10, 1998·19 cites·11 claims
- 1452US5989943AMethod for fabrication of programmable interconnect structureQUICKLOGIC CORP·Filed 1989·Granted Nov 23, 1999·13 cites·17 claims
- 1548US6150199AMethod for fabrication of programmable interconnect structureQUICKLOGIC CORP·Filed 1999·Granted Nov 21, 2000·11 cites·2 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →