Inventor · disambiguated record
Richard C. Blish, Ii
Also filed as: BLISH II RICHARD · BLISH II RICHARD C · BLISH II RICHARD CLARK · BLISH RICHARD
49 granted patents·3 pending applications·1,089 citations·filing 1976–2012
99Inventor score
Top patents by PatentIndex Score
52 records- 0196US7460369B1Counterflow microchannel cooler for integrated circuitsADVANCED MICRO DEVICES INC·Filed 2007·Granted Dec 2, 2008·45 cites·28 claims
- 0291US5489801AQuad flat package heat slug compositionINTEL CORP·Filed 1995·Granted Feb 6, 1996·109 cites·4 claims
- 0391US4870224AIntegrated circuit package for surface mount technologyINTEL CORP·Filed 1988·Granted Sep 26, 1989·107 cites·20 claims
- 0490US4213818ASelective plasma vapor etching processSIGNETICS CORP·Filed 1979·Granted Jul 22, 1980·77 cites·14 claims
- 0588US6362524B1Edge seal ring for copper damascene process and method for fabrication thereofADVANCED MICRO DEVICES INC·Filed 2000·Granted Mar 26, 2002·53 cites·15 claims
- 0686US5914873ADistributed voltage converter apparatus and method for high power microprocessor with array connectionsADVANCED MICRO DEVICES INC·Filed 1997·Granted Jun 22, 1999·93 cites·21 claims
- 0784US6037547AVia configuration with decreased pitch and/or increased routing spaceADVANCED MICRO DEVICES INC·Filed 1997·Granted Mar 14, 2000·57 cites·8 claims
- 0883US7561465B2Methods and systems for recovering data in a nonvolatile memory arrayADVANCED MICRO DEVICES INC·Filed 2007·Granted Jul 14, 2009·17 cites·10 claims
- 0978US6348356B1Method and apparatus for determining the robustness of memory cells to alpha-particle/cosmic ray induced soft errorsADVANCED MICRO DEVICES INC·Filed 2000·Granted Feb 19, 2002·23 cites·12 claims
- 1077US4040897AEtchants for glass films on metal substratesSIGNETICS CORP·Filed 1976·Granted Aug 9, 1977·33 cites·7 claims
- 1176US7253504B1Integrated circuit package and methodADVANCED MICRO DEVICES INC·Filed 2004·Granted Aug 7, 2007·23 cites·22 claims
- 1276US6043429AMethod of making flip chip packagesADVANCED MICRO DEVICES INC·Filed 1997·Granted Mar 28, 2000·50 cites·10 claims
- 1373US6046507AElectrophoretic coating methodology to improve internal package delamination and wire bond reliabilityADVANCED MICRO DEVICES INC·Filed 1997·Granted Apr 4, 2000·46 cites·1 claims
- 1471US6841841B1Neutron detecting deviceADVANCED MICRO DEVICES INC·Filed 2003·Granted Jan 11, 2005·18 cites·15 claims
- 1571US5882738AApparatus and method to improve electromigration performance by use of amorphous barrier layerADVANCED MICRO DEVICES INC·Filed 1997·Granted Mar 16, 1999·42 cites·19 claims
- 1668US6548881B1Method and apparatus to achieve bond pad crater sensing and stepping identification in integrated circuit productsADVANCED MICRO DEVICES INC·Filed 2000·Granted Apr 15, 2003·17 cites·10 claims
- 1766US6395568B1Method and apparatus for achieving bond pad crater sensing and ESD protection integrated circuit productsADVANCED MICRO DEVICES INC·Filed 2000·Granted May 28, 2002·11 cites·9 claims
- 1866US6315936B1Encapsulation method using non-homogeneous molding compound pelletsADVANCED MICRO DEVICES INC·Filed 2000·Granted Nov 13, 2001·12 cites·2 claims
- 1964US6806198B1Gas-assisted etch with oxygenADVANCED MICRO DEVICES INC·Filed 2001·Granted Oct 19, 2004·9 cites·14 claims
- 2062US7157131B1Prevention of counterfeit markings on semiconductor devicesADVANCED MICRO DEVICES INC·Filed 2002·Granted Jan 2, 2007·15 cites·8 claims
- 2162US6518661B1Apparatus for metal stack thermal management in semiconductor devicesADVANCED MICRO DEVICES INC·Filed 2001·Granted Feb 11, 2003·11 cites·14 claims
- 2260US6320400B1Method and system for selectively disconnecting a redundant power distribution network to indentify a site of a shortADVANCED MICRO DEVICES INC·Filed 1998·Granted Nov 20, 2001·23 cites·4 claims
- 2360US6091157AMethod to improve internal package delamination and wire bond reliability using non-homogeneous molding compound pelletsADVANCED MICRO DEVICES INC·Filed 1997·Granted Jul 18, 2000·23 cites·2 claims
- 2459US6803653B1Apparatus for suppressing packaged semiconductor chip curvature while minimizing thermal impedance and maximizing speed/reliabilityADVANCED MICRO DEVICES INC·Filed 2001·Granted Oct 12, 2004·12 cites·10 claims
- 2558US8384210B1Thermal interface material and semiconductor component including the thermal interface materialADVANCED MICRO DEVICES INC·Filed 2005·Granted Feb 26, 2013·1 cites·9 claims
- 2657US6252239B1Substrate removal from a semiconductor chip structure having buried insulator (BIN)ADVANCED MICRO DEVICES INC·Filed 2000·Granted Jun 26, 2001·7 cites·36 claims
- 2755US6181017B1System for marking electrophoretic dies while reducing damage due to electrostatic dischargeADVANCED MICRO DEVICES INC·Filed 1999·Granted Jan 30, 2001·21 cites·13 claims
- 2853US6495393B2Method to improve chip scale package electrostatic discharge performance and suppress marking artifactsADVANCED MICRO DEVICES INC·Filed 2001·Granted Dec 17, 2002·5 cites·12 claims
- 2953US6483337B1Method for achieving synchronous non-destructive latchup characterizationADVANCED MICRO DEVICES INC·Filed 2000·Granted Nov 19, 2002·6 cites·3 claims
- 3052US9293420B2Electronic device having a molding compound including a composite materialFOGLE ADAM D·Filed 2010·Granted Mar 22, 2016·2 cites·10 claims
- 3152US6339728B1Method for marking semiconductor device using a green laserADVANCED MICRO DEVICES INC·Filed 2000·Granted Jan 15, 2002·5 cites·17 claims
- 3250US8946663B2Soft error resistant circuitryBLISH RICHARD C·Filed 2012·Granted Feb 3, 2015·0 cites·21 claims
- 3350US6274473B1Flip chip packagesADVANCED MICRO DEVICES INC·Filed 1999·Granted Aug 14, 2001·16 cites·12 claims
- 3450US6049465ASignal carrying means including a carrier substrate and wire bonds for carrying signals between the cache and logic circuitry of a microprocessorADVANCED MICRO DEVICES INC·Filed 1998·Granted Apr 11, 2000·25 cites·4 claims
- 3550US5397746AQuad flat package heat slug compositionINTEL CORP·Filed 1993·Granted Mar 14, 1995·15 cites·2 claims
- 3649US6373126B1Method for reducing IC package delamination by use of internal bafflesADVANCED MICRO DEVICES INC·Filed 2000·Granted Apr 16, 2002·4 cites·17 claims
- 3747US6204516B1Method and apparatus for determining the robustness of memory cells to alpha-particle/cosmic ray induced soft errorsADVANCED MICRO DEVICES INC·Filed 1998·Granted Mar 20, 2001·9 cites·7 claims
- 3844US2008102637A1Method and semiconductor structure for reliability characterizationADVANCED MICRO DEVICES INC·Filed 2006·Application pending·0 cites
- 3943US6844573B1Structure for minimizing hot spots in SOI deviceADVANCED MICRO DEVICES INC·Filed 2002·Granted Jan 18, 2005·1 cites·11 claims
- 4043US6429657B1Apparatus for improving image depth resolution in a magnetic field imaging apparatusADVANCED MICRO DEVICES INC·Filed 2001·Granted Aug 6, 2002·5 cites·8 claims
- 4142US2008182407A1Method of forming vias in a semiconductor deviceADVANCED MICRO DEVICES INC·Filed 2007·Application pending·0 cites
- 4240US6119325AHigh pressure water stream to separate a multi-layer integrated circuit device and packageADVANCED MICRO DEVICES INC·Filed 1998·Granted Sep 19, 2000·9 cites·14 claims
- 4339US5907561AMethod to improve testing speed of memoryADVANCED MICRO DEVICES INC·Filed 1997·Granted May 25, 1999·6 cites·3 claims
- 4439US2010155611A1Radiation-detecting structuresSPANSION LLC·Filed 2008·Application pending·0 cites
- 4537US6294923B1Method and system for detecting faults utilizing an AC power supplyADVANCED MICRO DEVICES INC·Filed 1998·Granted Sep 25, 2001·7 cites·9 claims
- 4636US6021074ADirect access to random redundant logic gates by using multiple short addressesADVANCED MICRO DEVICES INC·Filed 1998·Granted Feb 1, 2000·4 cites·30 claims
- 4735US8723321B2Copper interconnects with improved electromigration lifetimeWOO CHRISTY·Filed 2006·Granted May 13, 2014·0 cites·20 claims
- 4835US6768198B1Method and system for removing conductive lines during deprocessingADVANCED MICRO DEVICES INC·Filed 1998·Granted Jul 27, 2004·5 cites·8 claims
- 4932US6331735B1Method to improve chip scale package electrostatic discharge performance and suppress marking artifactsADVANCED MICRO DEVICES INC·Filed 1998·Granted Dec 18, 2001·3 cites·2 claims
- 5031US6461879B1Method and apparatus for measuring effects of packaging stresses of common IC electrical performance parameters at wafer sortADVANCED MICRO DEVICES INC·Filed 2001·Granted Oct 8, 2002·0 cites·10 claims
Showing the top 50 of 52 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →