Inventor · disambiguated record
Richard F. Hill
Also filed as: HILL RICHARD · HILL RICHARD F · HILL RICHARD FRANK · WEBER WILLIS W
37 granted patents·13 pending applications·1,084 citations·filing 1979–2023
98Inventor score
Files withLAIRD TECHNOLOGIES INC22THERMAGON INC6ADVANCED CERAMICS CORP4HILL RICHARD F4UNION CARBIDE CORP4
Top patents by PatentIndex Score
50 records- 0197US4242271AProcess for preparing aluminum alkoxidesUNION CARBIDE CORP·Filed 1979·Granted Dec 30, 1980·192 cites·4 claims
- 0296US8081468B2Memory modules including compliant multilayered thermally-conductive interface assembliesHILL RICHARD F·Filed 2009·Granted Dec 20, 2011·44 cites·12 claims
- 0395US10600714B2Methods for establishing thermal joints between heat spreaders or lids and heat sourcesLAIRD TECHNOLOGIES INC·Filed 2019·Granted Mar 24, 2020·4 cites·20 claims
- 0495US9222735B2Compliant multilayered thermally-conductive interface assembliesLAIRD TECHNOLOGIES INC·Filed 2014·Granted Dec 29, 2015·20 cites·21 claims
- 0593US9330998B2Thermal interface material assemblies and related methodsLAIRD TECHNOLOGIES INC·Filed 2014·Granted May 3, 2016·15 cites·16 claims
- 0693US8837151B2Memory modules including compliant multilayered thermally-conductive interface assembliesHILL RICHARD F·Filed 2011·Granted Sep 16, 2014·21 cites·21 claims
- 0793US7965514B2Assemblies and methods for dissipating heat from handheld electronic devicesLAIRD TECHNOLOGIES INC·Filed 2009·Granted Jun 21, 2011·41 cites·25 claims
- 0893US6372997B1Multi-layer structure and method for forming a thermal interface with low contact resistance between a microelectronic component package and heat sinkTHERMAGON INC·Filed 2000·Granted Apr 16, 2002·95 cites·8 claims
- 0992US8477499B2Assemblies and methods for dissipating heat from handheld electronic devicesHILL RICHARD F·Filed 2011·Granted Jul 2, 2013·29 cites·24 claims
- 1091US5898009AHigh density agglomerated boron nitride particlesADVANCED CERAMICS CORP·Filed 1997·Granted Apr 27, 1999·73 cites·2 claims
- 1190US10964617B2Methods for establishing thermal joints between heat spreaders or lids and heat sourcesLAIRD TECHNOLOGIES INC·Filed 2020·Granted Mar 30, 2021·2 cites·20 claims
- 1290US7765811B2Flexible assemblies with integrated thermoelectric modules suitable for use in extracting power from or dissipating heat from fluid conduitsLAIRD TECHNOLOGIES INC·Filed 2007·Granted Aug 3, 2010·33 cites·27 claims
- 1390US6048511AMethod for forming high density boron nitride and high density agglomerated boron nitride particlesADVANCED CERAMICS CORP·Filed 1999·Granted Apr 11, 2000·66 cites·6 claims
- 1489US9322580B2Circuit assemblies including thermoelectric modulesLAIRD TECHNOLOGIES INC·Filed 2014·Granted Apr 26, 2016·10 cites·24 claims
- 1589US8647752B2Thermal interface material assemblies, and related methodsSTRADER JASON L·Filed 2010·Granted Feb 11, 2014·13 cites·29 claims
- 1689US8649179B2Circuit assemblies including thermoelectric modulesHERSHBERGER JEFFREY GERARD·Filed 2011·Granted Feb 11, 2014·19 cites·26 claims
- 1789US5681883AEnhanced boron nitride composition and polymer based high thermal conductivity molding compoundADVANCED CERAMICS CORP·Filed 1996·Granted Oct 28, 1997·94 cites·9 claims
- 1888US6940721B2Thermal interface structure for placement between a microelectronic component package and heat sinkFiled 2002·Granted Sep 6, 2005·51 cites·9 claims
- 1987US11776928B2Compressible foamed thermal interface materials and methods of making the sameLAIRD TECHNOLOGIES INC·Filed 2022·Granted Oct 3, 2023·1 cites·26 claims
- 2087US7369411B2Thermal interface assembly and method for forming a thermal interface between a microelectronic component package and heat sinkTHERMAGON INC·Filed 2004·Granted May 6, 2008·51 cites·8 claims
- 2186US11610831B2Methods for establishing thermal joints between heat spreaders or lids and heat sourcesLAIRD TECHNOLOGIES INC·Filed 2021·Granted Mar 21, 2023·1 cites·26 claims
- 2286US7078109B2Heat spreading thermal interface structureTHERMAGON INC·Filed 2004·Granted Jul 18, 2006·48 cites·8 claims
- 2385US6761928B2Multi-layer structure and method for forming a thermal interface with low contact resistance between a microelectronic component package and heat sinkTHERMAGON INC·Filed 2002·Granted Jul 13, 2004·38 cites·10 claims
- 2485US6617517B2Multi-layer structure having a thermal interface with low contact resistance between a microelectronic component package and a heat sinkTHERMAGON INC·Filed 2002·Granted Sep 9, 2003·32 cites·5 claims
- 2582US11776868B2Methods for establishing thermal joints between heat spreaders or lids and heat sourcesLAIRD TECHNOLOGIES INC·Filed 2023·Granted Oct 3, 2023·0 cites·27 claims
- 2680US10373891B2Methods for establishing thermal joints between heat spreaders or lids and heat sourcesLAIRD TECHNOLOGIES INC·Filed 2014·Granted Aug 6, 2019·3 cites·13 claims
- 2780US4835298AMethod for producing liquid alkoxides of mixed metalsUNION CARBIDE CORP·Filed 1986·Granted May 30, 1989·16 cites·14 claims
- 2879US12033971B2Compressible foamed thermal interface materials and methods of making the sameLAIRD TECHNOLOGIES INC·Filed 2023·Granted Jul 9, 2024·0 cites·28 claims
- 2979US11276662B2Compressible foamed thermal interface materials and methods of making the sameLAIRD TECHNOLOGIES INC·Filed 2019·Granted Mar 15, 2022·2 cites·20 claims
- 3077US9258928B2Assemblies and methods for dissipating heat from handheld electronic devicesLAIRD TECHNOLOGIES INC·Filed 2013·Granted Feb 9, 2016·4 cites·18 claims
- 3176US6849941B1Heat sink and heat spreader assemblyTHERMAGON INC·Filed 2004·Granted Feb 1, 2005·23 cites·7 claims
- 3273US9515004B2Thermal interface materialsLAIRD TECHNOLOGIES INC·Filed 2013·Granted Dec 6, 2016·3 cites·20 claims
- 3368US4288410AApparatus for preparing aluminum alkoxidesUNION CARBIDE CORP·Filed 1980·Granted Sep 8, 1981·9 cites·1 claims
- 3464US5173455ALow sintering cordierite powder compositionUNION CARBIDE COATINGS SERVICE·Filed 1991·Granted Dec 22, 1992·17 cites·3 claims
- 3560US2010321897A1Compliant multilayered thermally-conductive interface assembliesLAIRD TECHNOLOGIES INC·Filed 2009·Application pending·0 cites
- 3649US2012012382A1Conductive Films for EMI Shielding ApplicationsMCBAIN DOUGLAS·Filed 2011·Application pending·0 cites
- 3749US2011000516A1Flexible assemblies with integrated thermoelectric modules suitable for use in extracting power from or dissipating heat from fluid conduitsLAIRD TECHNOLOGIES INC·Filed 2010·Application pending·0 cites
- 3848US2011001404A1Apparatus including locking means and enclosure with locking meansDURHAM MFG COMPANY·Filed 2009·Application pending·0 cites
- 3944US5139976ACordierite composition and method of productionUNION CARBIDE COATINGS SERVICE·Filed 1989·Granted Aug 18, 1992·8 cites·13 claims
- 4044US2011030754A1Thermoelectric modules and related methodsLAIRD TECHNOLOGIES INC·Filed 2009·Application pending·0 cites
- 4144US2014368992A1Methods For Establishing Thermal Joints Between Heat Spreaders and Heat Generating Components Using Thermoplastic and/or Self-Healing Thermal Interface MaterialsLAIRD TECHNOLOGIES INC·Filed 2013·Application pending·0 cites
- 4244US2015334871A1Thermal interface materials with thin film sealantsLAIRD TECHNOLOGIES INC·Filed 2014·Application pending·0 cites
- 4341US2012061135A1Compliant multilayered thermally-conductive interface assemblies having emi shielding propertiesHILL RICHARD F·Filed 2010·Application pending·0 cites
- 4440US2012174956A1Thermoelectric Modules, Thermoelectric Assemblies, and Related MethodsSMYTHE ROBERT MICHAEL·Filed 2012·Application pending·0 cites
- 4539US2012080639A1Potato shaped graphite filler, thermal interface materials and emi shieldingBRUZDA KAREN·Filed 2010·Application pending·0 cites
- 4637US2012292005A1Thermal interface materials and methods for processing the sameBRUZDA KAREN·Filed 2011·Application pending·0 cites
- 4736US2015301568A1Thermal Solutions and Methods for Dissipating Heat from Electronic Devices Using the Same Side of an Anisotropic Heat SpreaderLAIRD TECHNOLOGIES INC·Filed 2015·Application pending·0 cites
- 4836US2016315030A1Reusable thermoplastic thermal interface materials and methods for establishing thermal joints between heat sources and heat dissipating/removal structuresLAIRD TECHNOLOGIES INC·Filed 2016·Application pending·0 cites
- 4932US5678832ABoron nitride seal and method of useADVANCED CERAMICS CORP·Filed 1995·Granted Oct 21, 1997·4 cites·5 claims
- 5031US4946976ACordierite composition and method of productionUNION CARBIDE CORP·Filed 1988·Granted Aug 7, 1990·2 cites·2 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →