Inventor · disambiguated record
Richard H. Lane
Also filed as: LANE RICHARD · LANE RICHARD H · LANE RICHARD HENRY
93 granted patents·6 pending applications·1,419 citations·filing 1978–2015
99Inventor score
Files withMICRON TECHNOLOGY INC85MOTOROLA INC2SIGNETICS CORP2BIPOLAR INTEGRATED TECHNOLOGY1GILGEN BRENT D1
Top patents by PatentIndex Score
99 records- 0195US6455370B1Method of patterning noble metals for semiconductor devices by electropolishingMICRON TECHNOLOGY INC·Filed 2000·Granted Sep 24, 2002·71 cites·28 claims
- 0294US5760434AIncreased interior volume for integrated memory cellMICRON TECHNOLOGY INC·Filed 1996·Granted Jun 2, 1998·106 cites·5 claims
- 0392US6372574B1Method of forming a capacitor container electrode and method of patterning a metal layer by selectively silicizing the electrode or metal layer and removing the silicized portionMICRON TECHNOLOGY INC·Filed 2000·Granted Apr 16, 2002·65 cites·74 claims
- 0491US6501114B2Structures comprising transistor gatesMICRON TECHNOLOGY INC·Filed 2001·Granted Dec 31, 2002·45 cites·1 claims
- 0591US6420250B1Methods of forming portions of transistor structures, methods of forming array peripheral circuitry, and structures comprising transistor gatesMICRON TECHNOLOGY INC·Filed 2000·Granted Jul 16, 2002·50 cites·51 claims
- 0690US6175146B1Semiconductor processing methods of forming integrated circuitry memory devices, methods of forming capacitor containers, methods of making electrical connection to circuit nodes and related integrated circuitryMICRON TECHNOLOGY INC·Filed 1997·Granted Jan 16, 2001·74 cites·22 claims
- 0790US5998257ASemiconductor processing methods of forming integrated circuitry memory devices, methods of forming capacitor containers, methods of making electrical connection to circuit nodes and related integrated circuitryMICRON TECHNOLOGY INC·Filed 1997·Granted Dec 7, 1999·73 cites·13 claims
- 0889US8552526B2Self-aligned semiconductor trench structuresMICRON TECHNOLOGY INC·Filed 2012·Granted Oct 8, 2013·6 cites·25 claims
- 0989US8148775B2Methods of providing electrical isolation and semiconductor structures including sameGILGEN BRENT D·Filed 2010·Granted Apr 3, 2012·13 cites·22 claims
- 1088US7935602B2Semiconductor processing methodsMICRON TECHNOLOGY INC·Filed 2005·Granted May 3, 2011·15 cites·14 claims
- 1188US6414364B2Isolation structure and process thereforMICRON TECHNOLOGY INC·Filed 2001·Granted Jul 2, 2002·43 cites·39 claims
- 1288US6238999B1Isolation region forming methodsMICRON TECHNOLOGY INC·Filed 2000·Granted May 29, 2001·24 cites·7 claims
- 1387US6770927B2Structures comprising transistor gatesMICRON TECHNOLOGY INC·Filed 2002·Granted Aug 3, 2004·31 cites·6 claims
- 1486US6265282B1Process for making an isolation structureMICRON TECHNOLOGY INC·Filed 1998·Granted Jul 24, 2001·74 cites·58 claims
- 1585US7288817B2Reverse metal process for creating a metal silicide transistor gate structureMICRON TECHNOLOGY INC·Filed 2005·Granted Oct 30, 2007·7 cites·15 claims
- 1685US4736271AProtection device utilizing one or more subsurface diodes and associated method of manufactureSIGNETICS CORP·Filed 1987·Granted Apr 5, 1988·80 cites·26 claims
- 1783US6475911B1Method of forming noble metal patternMICRON TECHNOLOGY INC·Filed 2000·Granted Nov 5, 2002·22 cites·45 claims
- 1883US6406977B2Isolation region forming methodsMICRON TECHNOLOGY INC·Filed 2000·Granted Jun 18, 2002·16 cites·6 claims
- 1983US5895274AHigh-pressure anneal process for integrated circuitsMICRON TECHNOLOGY INC·Filed 1996·Granted Apr 20, 1999·38 cites·22 claims
- 2082US7601598B2Reverse metal process for creating a metal silicide transistor gate structureMICRON TECHNOLOGY INC·Filed 2007·Granted Oct 13, 2009·5 cites·23 claims
- 2181US6090655AIncreased interior volume for integrated memory cellMICRON TECHNOLOGY INC·Filed 1998·Granted Jul 18, 2000·38 cites·25 claims
- 2280US8987834B2Methods of providing electrical isolation and semiconductor structures including sameGRISHAM PAUL·Filed 2012·Granted Mar 24, 2015·4 cites·24 claims
- 2380US7112508B2Method for forming conductive material in opening and structure regarding sameMICRON TECHNOLOGY INC·Filed 2005·Granted Sep 26, 2006·8 cites·30 claims
- 2480US6737730B1High-pressure anneal process for integrated circuitsMICRON TECHNOLOGY INC·Filed 2000·Granted May 18, 2004·12 cites·6 claims
- 2579US8101497B2Self-aligned trench formationJUENGLING WERNER·Filed 2008·Granted Jan 24, 2012·4 cites·26 claims
- 2679US6387828B1High-pressure anneal process for integrated circuitsMICRON TECHNOLOGY INC·Filed 2000·Granted May 14, 2002·11 cites·10 claims
- 2778US7179361B2Method of forming a mass over a semiconductor substrateMICRON TECHNOLOGY INC·Filed 2005·Granted Feb 20, 2007·3 cites·20 claims
- 2878US6984301B2Methods of forming capacitor constructionsMICRON TECHNOLOGY INC·Filed 2002·Granted Jan 10, 2006·12 cites·14 claims
- 2978US6080655AMethod for fabricating conductive components in microelectronic devices and substrate structures thereofMICRON TECHNOLOGY INC·Filed 1997·Granted Jun 27, 2000·47 cites·43 claims
- 3077US6569564B1Button cell constructions and thin profile battery constructionsMICRON TECHNOLOGY INC·Filed 1999·Granted May 27, 2003·41 cites·15 claims
- 3176US8343875B2Methods of forming an integrated circuit with self-aligned trench formationMICRON TECHNOLOGY INC·Filed 2012·Granted Jan 1, 2013·2 cites·20 claims
- 3276US7473644B2Method for forming controlled geometry hardmasks including subresolution elementsMICRON TECHNOLOGY INC·Filed 2004·Granted Jan 6, 2009·15 cites·46 claims
- 3376US6593206B2Isolation region forming methodsMICRON TECHNOLOGY INC·Filed 2002·Granted Jul 15, 2003·10 cites·3 claims
- 3476US6410951B2Structure for improving static refreshMICRON TECHNOLOGY INC·Filed 2001·Granted Jun 25, 2002·14 cites·4 claims
- 3574US6784501B2Process for forming metalized contacts to periphery transistorsMICRON TECHNOLOGY INC·Filed 2003·Granted Aug 31, 2004·17 cites·21 claims
- 3672US6967146B2Isolation region forming methodsMICRON TECHNOLOGY INC·Filed 2004·Granted Nov 22, 2005·7 cites·26 claims
- 3772US6703325B1High pressure anneal process for integrated circuitsMICRON TECHNOLOGY INC·Filed 2000·Granted Mar 9, 2004·7 cites·14 claims
- 3871US7501672B2Method and structure for a self-aligned silicided word line and polysilicon plug during the formation of a semiconductor deviceMICRON TECHNOLOGY INC·Filed 2006·Granted Mar 10, 2009·4 cites·20 claims
- 3970US6794238B2Process for forming metallized contacts to periphery transistorsMICRON TECHNOLOGY INC·Filed 2001·Granted Sep 21, 2004·14 cites·22 claims
- 4069US6482707B1Method of improving static refreshMICRON TECHNOLOGY INC·Filed 2000·Granted Nov 19, 2002·10 cites·34 claims
- 4168US8685859B2Self-aligned semiconductor trench structuresMICRON TECHNOLOGY INC·Filed 2013·Granted Apr 1, 2014·2 cites·20 claims
- 4268US6821855B2Reverse metal process for creating a metal silicide transistor gate structureMICRON TECHNOLOGY INC·Filed 2002·Granted Nov 23, 2004·8 cites·37 claims
- 4368US6261899B1Semiconductor processing methods of forming integrated circuitry memory devices, methods of forming capacitor containers, methods of making electrical connection to circuit nodes and related integrated circuitryMICRON TECHNOLOGY INC·Filed 1998·Granted Jul 17, 2001·19 cites·15 claims
- 4467US5145571AGold interconnect with sidewall-spacersBIPOLAR INTEGRATED TECHNOLOGY·Filed 1990·Granted Sep 8, 1992·41 cites·18 claims
- 4565US6153532AMethods and apparatuses for removing material from discrete areas on a semiconductor waferMICRON TECHNOLOGY INC·Filed 1998·Granted Nov 28, 2000·23 cites·50 claims
- 4664US6710420B2Semiconductor construction of a trenchMICRON TECHNOLOGY INC·Filed 2002·Granted Mar 23, 2004·4 cites·8 claims
- 4764US6670289B2High-pressure anneal process for integrated circuitsMICRON TECHNOLOGY INC·Filed 2002·Granted Dec 30, 2003·4 cites·3 claims
- 4863US4381956ASelf-aligned buried channel fabrication processMOTOROLA INC·Filed 1981·Granted May 3, 1983·24 cites·7 claims
- 4962US6884692B2Method for forming conductive material in opening and structures regarding sameMICRON TECHNOLOGY INC·Filed 2002·Granted Apr 26, 2005·9 cites·71 claims
- 5062US6424043B1Semiconductor processing methods of forming integrated circuitry memory devices, methods of forming capacitor containers, methods of making electrical connection to circuit nodes and related integrated circuitryMICRON TECHNOLOGY INC·Filed 2000·Granted Jul 23, 2002·9 cites·30 claims
Showing the top 50 of 99 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →