Inventor · disambiguated record
Richard J. Saye
Also filed as: SAYE RICHARD · SAYE RICHARD J
6 granted patents·2 pending applications·30 citations·filing 2005–2018
79Inventor score
Top patents by PatentIndex Score
8 records- 0191US9177945B2Packaged semiconductor device having multilevel leadframes configured as modulesTEXAS INSTRUMENTS INC·Filed 2014·Granted Nov 3, 2015·17 cites·5 claims
- 0279US9378882B2Method of fabricating an electronic circuitKUMMERL STEVEN·Filed 2011·Granted Jun 28, 2016·5 cites·14 claims
- 0376US8946880B2Packaged semiconductor device having multilevel leadframes configured as modulesTEXAS INSTRUMENTS INC·Filed 2013·Granted Feb 3, 2015·4 cites·12 claims
- 0473US10128219B2Multi-chip module including stacked power devices with metal clipTEXAS INSTRUMENTS INC·Filed 2013·Granted Nov 13, 2018·3 cites·13 claims
- 0561US10840171B2Integrated circuit package including inward bent leadsTEXAS INSTRUMENTS INC·Filed 2018·Granted Nov 17, 2020·1 cites·20 claims
- 0658US2016268023A1Transfer mold compound mixture for fabricating an electronic circuitTEXAS INSTRUMENTS INC·Filed 2016·Application pending·0 cites
- 0754US11495580B2Multi-chip module including stacked power devices with metal clipTEXAS INSTRUMENTS INC·Filed 2018·Granted Nov 8, 2022·0 cites·20 claims
- 0837US2006170080A1Semiconductor device having directly attached heat spreaderZUNIGA-ORTIZ EDGAR R·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →