Inventor · disambiguated record
Richard R. Steitz
Also filed as: STEITZ RICHARD R
8 granted patents·154 citations·filing 1989–1992
88Inventor score
Technology areasH10W
Files withCRAY RESEARCH INC8
Top patents by PatentIndex Score
8 records- 0178US5127570AFlexible automated bonding method and apparatusCRAY RESEARCH INC·Filed 1990·Granted Jul 7, 1992·72 cites·26 claims
- 0261US5182420AMethod of fabricating metallized chip carriers from wafer-shaped substratesCRAY RESEARCH INC·Filed 1990·Granted Jan 26, 1993·26 cites·21 claims
- 0345US5358826AMethod of fabricating metallized chip carries from wafer-shaped substratesCRAY RESEARCH INC·Filed 1992·Granted Oct 25, 1994·13 cites·29 claims
- 0443US5258576AIntegrated circuit chip carrier lidCRAY RESEARCH INC·Filed 1992·Granted Nov 2, 1993·13 cites·1 claims
- 0543US4949453AMethod of making a chip carrier with terminating resistive elementsCRAY RESEARCH INC·Filed 1989·Granted Aug 21, 1990·11 cites·7 claims
- 0636US5134247AReduced capacitance chip carrierCRAY RESEARCH INC·Filed 1989·Granted Jul 28, 1992·10 cites·21 claims
- 0734US5122620AChip carrier with terminating resistive elementsCRAY RESEARCH INC·Filed 1991·Granted Jun 16, 1992·6 cites·9 claims
- 0830USRE34395EMethod of making a chip carrier with terminating resistive elementsCRAY RESEARCH INC·Filed 1991·Granted Oct 5, 1993·3 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →