Inventor · disambiguated record
Roseann Alatorre
Also filed as: ALATORRE ROSEANN
13 granted patents·1 pending application·399 citations·filing 2012–2024
93Inventor score
Technology areasH10W
Top patents by PatentIndex Score
14 records- 0198US9105483B2Package-on-package assembly with wire bond viasCHAU ELLIS·Filed 2012·Granted Aug 11, 2015·60 cites·29 claims
- 0298US9041227B2Package-on-package assembly with wire bond viasINVENSAS CORP·Filed 2013·Granted May 26, 2015·37 cites·16 claims
- 0398US8836136B2Package-on-package assembly with wire bond viasCHAU ELLIS·Filed 2012·Granted Sep 16, 2014·84 cites·29 claims
- 0498US8404520B1Package-on-package assembly with wire bond viasCHAU ELLIS·Filed 2012·Granted Mar 26, 2013·112 cites·27 claims
- 0597US9601454B2Method of forming a component having wire bonds and a stiffening layerINVENSAS CORP·Filed 2015·Granted Mar 21, 2017·43 cites·17 claims
- 0697US9136254B2Microelectronic package having wire bond vias and stiffening layerINVENSAS CORP·Filed 2013·Granted Sep 15, 2015·57 cites·10 claims
- 0792US2025118705A1Package-on-package assembly with wire bond viasADEIA SEMICONDUCTOR TECH LLC·Filed 2024·Application pending·0 cites
- 0889US9761558B2Package-on-package assembly with wire bond viasINVENSAS CORP·Filed 2015·Granted Sep 12, 2017·4 cites·16 claims
- 0985US12211821B2Package-on-package assembly with wire bond viasADEIA SEMICONDUCTOR TECH LLC·Filed 2023·Granted Jan 28, 2025·0 cites·19 claims
- 1078US11735563B2Package-on-package assembly with wire bond viasINVENSAS LLC·Filed 2021·Granted Aug 22, 2023·0 cites·8 claims
- 1178US9252122B2Package-on-package assembly with wire bond viasINVENSAS CORP·Filed 2013·Granted Feb 2, 2016·2 cites·15 claims
- 1275US11189595B2Package-on-package assembly with wire bond viasINVENSAS CORP·Filed 2020·Granted Nov 30, 2021·0 cites·20 claims
- 1362US10756049B2Package-on-package assembly with wire bond viasINVENSAS CORP·Filed 2017·Granted Aug 25, 2020·0 cites·16 claims
- 1436US9659848B1Stiffened wires for offset BVAINVENSAS CORP·Filed 2016·Granted May 23, 2017·0 cites·21 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →