Inventor · disambiguated record
Roawen Chen
Also filed as: CHEN ROAWEN
13 granted patents·4 pending applications·75 citations·filing 2003–2024
91Inventor score
Top patents by PatentIndex Score
17 records- 0196US9768144B2Package assembly including a semiconductor substrate in which a first portion of a surface of the semiconductor substrate is recessed relative to a second portion of the surface of the semiconductor substrate to form a recessed region in the semiconductor substrateMARVELL WORLD TRADE LTD·Filed 2016·Granted Sep 19, 2017·11 cites·19 claims
- 0289US8008137B2Method for fabricating 1T-DRAM on bulk siliconMARVELL WORLD TRADE LTD·Filed 2007·Granted Aug 30, 2011·19 cites·11 claims
- 0388US7704805B1Fuse structures, methods of making and using the same, and integrated circuits including the sameMARVELL INT LTD·Filed 2008·Granted Apr 27, 2010·12 cites·23 claims
- 0483US7820493B1Methods of making and using fuse structures, and integrated circuits including the sameMARVELL INT LTD·Filed 2008·Granted Oct 26, 2010·8 cites·15 claims
- 0578US8935464B2Solid-state disk with wireless functionalityMARVELL WORLD TRADE LTD·Filed 2014·Granted Jan 13, 2015·4 cites·16 claims
- 0675US8719485B2Solid-state disk with wireless functionalitySUTARDJA SEHAT·Filed 2009·Granted May 6, 2014·6 cites·24 claims
- 0774US9257410B2Package assembly including a semiconductor substrate in which a first portion of a surface of the semiconductor substrate is recessed relative to a second portion of the surface of the semiconductor substrate to form a recessed region in the semiconductor substrateWU ALBERT·Filed 2011·Granted Feb 9, 2016·2 cites·26 claims
- 0871US7589363B1Fuse structures, methods of making and using the same, and integrated circuits including the sameMARVELL INT LTD·Filed 2007·Granted Sep 15, 2009·3 cites·20 claims
- 0966US7344924B1Fuse structures, methods of making and using the same, and integrated circuits including the sameMARVELL INT LTD·Filed 2005·Granted Mar 18, 2008·2 cites·15 claims
- 1064US6940107B1Fuse structures, methods of making and using the same, and integrated circuits including the sameMARVELL INT LTD·Filed 2003·Granted Sep 6, 2005·8 cites·36 claims
- 1160US2025336757A1Concurrent general-purpose memory die and near-memory compute die in system-in-package (sip)QUALCOMM INC·Filed 2024·Application pending·0 cites
- 1257US2014124961A1Techniques and configurations for recessed semiconductor substratesMARVELL WORLD TRADE LTD·Filed 2014·Application pending·0 cites
- 1355US9478541B2Half node scaling for vertical structuresQUALCOMM INC·Filed 2014·Granted Oct 25, 2016·0 cites·20 claims
- 1455US9391045B2Recessed semiconductor substrates and associated techniquesMARVELL WORLD TRADE LTD·Filed 2015·Granted Jul 12, 2016·0 cites·20 claims
- 1552US9034730B2Recessed semiconductor substrates and associated techniquesWU ALBERT·Filed 2011·Granted May 19, 2015·0 cites·23 claims
- 1651US2011186960A1Techniques and configurations for recessed semiconductor substratesWU ALBERT·Filed 2011·Application pending·0 cites
- 1742US2014306349A1Low cost interposer comprising an oxidation layerQUALCOMM INC·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →