Inventor · disambiguated record
Romain Coffy
Also filed as: COFFY ROMAIN
53 granted patents·27 pending applications·298 citations·filing 2006–2025
97Inventor score
Files withST MICROELECTRONICS GRENOBLE 250COFFY ROMAIN11ST MICROELECTRONICS INT NV4STMICROELECTRONICS (GRENOBLE 2) SAS3ST MICROELECTRONICS SA2
Top patents by PatentIndex Score
80 records- 0197US8664044B2Method of fabricating land grid array semiconductor packageJIN YONGGANG·Filed 2011·Granted Mar 4, 2014·97 cites·13 claims
- 0297US7643311B2Electronic circuit protection deviceST MICROELECTRONICS SA·Filed 2006·Granted Jan 5, 2010·79 cites·14 claims
- 0394US7737565B2Stackable semiconductor package and method for its fabricationST MICROELECTRONICS·Filed 2006·Granted Jun 15, 2010·38 cites·17 claims
- 0489US11322666B2Optoelectronic deviceST MICROELECTRONICS GRENOBLE 2·Filed 2020·Granted May 3, 2022·2 cites·27 claims
- 0589US10996412B2Electronic device comprising an electronic chip provided with an optical cableST MICROELECTRONICS GRENOBLE 2·Filed 2019·Granted May 4, 2021·10 cites·26 claims
- 0688US10777710B2Protection mechanism for light sourceST MICROELECTRONICS GRENOBLE 2·Filed 2019·Granted Sep 15, 2020·2 cites·20 claims
- 0787US9136292B2Optical electronic package having a blind cavity for covering an optical sensorCOFFY ROMAIN·Filed 2012·Granted Sep 15, 2015·10 cites·20 claims
- 0886US10738985B2Housing for light sourceSTMICROELECTRONICS (RESEARCH & DEVELOPMENT) LTD·Filed 2019·Granted Aug 11, 2020·5 cites·20 claims
- 0986US8860207B2Method of fabricating land grid array semiconductor packageST MICROELECTRONICS PTE LTD·Filed 2014·Granted Oct 14, 2014·7 cites·20 claims
- 1086US8716739B2Optical electronic package with an optically isolated chamberST MICROELECTRONICS GRENOBLE 2·Filed 2012·Granted May 6, 2014·9 cites·22 claims
- 1179US8232113B2Method for manufacturing and testing an integrated electronic circuitCOFFY ROMAIN·Filed 2009·Granted Jul 31, 2012·9 cites·19 claims
- 1278US9105766B2Optical electronic packageST MICROELECTRONICS GRENOBLE 2·Filed 2013·Granted Aug 11, 2015·6 cites·17 claims
- 1376US10865962B2Protection mechanism for light sourceST MICROELECTRONICS GRENOBLE 2·Filed 2019·Granted Dec 15, 2020·1 cites·19 claims
- 1474US11211772B2Protection mechanism for light sourceST MICROELECTRONICS GRENOBLE 2·Filed 2019·Granted Dec 28, 2021·1 cites·17 claims
- 1573US11908968B2Optoelectronic deviceST MICROELECTRONICS GRENOBLE 2·Filed 2022·Granted Feb 20, 2024·0 cites·15 claims
- 1673US11817377B2Electronics unit with integrated metallic patternST MICROELECTRONICS GRENOBLE 2·Filed 2022·Granted Nov 14, 2023·0 cites·15 claims
- 1773US7282906B2Electronic circuit protection deviceST MICROELECTRONICS SA·Filed 2006·Granted Oct 16, 2007·5 cites·19 claims
- 1871US10941921B2Protection mechanism for light sourceST MICROELECTRONICS GRENOBLE 2·Filed 2019·Granted Mar 9, 2021·1 cites·19 claims
- 1971US8227332B2Method for fabricating electrical bonding pads on a waferCOFFY ROMAIN·Filed 2008·Granted Jul 24, 2012·8 cites·9 claims
- 2071US2023245984A1Protection of integrated circuitsST MICROELECTRONICS GRENOBLE 2·Filed 2023·Application pending·0 cites
- 2170US11640946B2Protection of integrated circuitsST MICROELECTRONICS GRENOBLE 2·Filed 2021·Granted May 2, 2023·0 cites·8 claims
- 2270US11546059B2Cover for an electronic circuit packageST MICROELECTRONICS GRENOBLE 2·Filed 2021·Granted Jan 3, 2023·0 cites·20 claims
- 2369US11935992B2Electronic device comprising optical electronic components and fabricating processST MICROELECTRONICS GRENOBLE 2·Filed 2022·Granted Mar 19, 2024·0 cites·16 claims
- 2467US11437306B2Electronics unit with integrated metallic patternST MICROELECTRONICS GRENOBLE 2·Filed 2021·Granted Sep 6, 2022·0 cites·14 claims
- 2567US8754523B2Surface-mounted electronic componentCOFFY ROMAIN·Filed 2011·Granted Jun 17, 2014·2 cites·13 claims
- 2666US10965376B2Cover for an electronic circuit packageST MICROELECTRONICS GRENOBLE 2·Filed 2018·Granted Mar 30, 2021·0 cites·16 claims
- 2765US11641002B2Optical transmission/reception circuitST MICROELECTRONICS GRENOBLE 2·Filed 2021·Granted May 2, 2023·0 cites·19 claims
- 2865US8847243B2Semiconductor package comprising an optical semiconductor deviceCOFFY ROMAIN·Filed 2012·Granted Sep 30, 2014·2 cites·37 claims
- 2964US11387381B2Optoelectronic deviceST MICROELECTRONICS GRENOBLE 2·Filed 2020·Granted Jul 12, 2022·0 cites·28 claims
- 3064US2025365853A1Electronic circuitST MICROELECTRONICS GRENOBLE 2·Filed 2025·Application pending·0 cites
- 3163US12389526B2Electronic circuitST MICROELECTRONICS GRENOBLE 2·Filed 2022·Granted Aug 12, 2025·0 cites·24 claims
- 3262US8786084B2Semiconductor package and method of formingCOFFY ROMAIN·Filed 2010·Granted Jul 22, 2014·3 cites·11 claims
- 3361US11740416B2Optoelectronic deviceST MICROELECTRONICS GRENOBLE 2·Filed 2021·Granted Aug 29, 2023·0 cites·22 claims
- 3461US11676928B2Electronic device including electrical connections on an encapsulation blockST MICROELECTRONICS GRENOBLE 2·Filed 2021·Granted Jun 13, 2023·0 cites·10 claims
- 3560US11502227B2Electronic device comprising optical electronic components and fabricating processST MICROELECTRONICS GRENOBLE 2·Filed 2020·Granted Nov 15, 2022·0 cites·18 claims
- 3659US11139255B2Protection of integrated circuitsST MICROELECTRONICS ROUSSET·Filed 2019·Granted Oct 5, 2021·0 cites·10 claims
- 3758US2024087977A1Integrated circuit package heat sinkST MICROELECTRONICS GRENOBLE 2·Filed 2023·Application pending·0 cites
- 3856US12009572B2Antenna packageST MICROELECTRONICS GRENOBLE 2·Filed 2022·Granted Jun 11, 2024·0 cites·43 claims
- 3956US9006904B2Dual side package on packageST MICROELECTRONICS GRENOBLE 2·Filed 2012·Granted Apr 14, 2015·1 cites·12 claims
- 4055US11114404B2Electronic device including electrical connections on an encapsulation blockST MICROELECTRONICS GRENOBLE 2·Filed 2019·Granted Sep 7, 2021·0 cites·18 claims
- 4155US10978607B2Optical transmission/reception circuitST MICROELECTRONICS GRENOBLE 2·Filed 2019·Granted Apr 13, 2021·0 cites·20 claims
- 4254US2024168245A1Integrated circuit comprising an assembly of an electronic chip, an optical element and a substrate and corresponding manufacturing methodST MICROELECTRONICS GRENOBLE 2·Filed 2023·Application pending·0 cites
- 4354US2024321809A1Electronic deviceST MICROELECTRONICS INT NV·Filed 2024·Application pending·0 cites
- 4453US2024047407A1Integrated circuit packageST MICROELECTRONICS GRENOBLE 2·Filed 2023·Application pending·0 cites
- 4553US2024186679A1Integrated electronic device for the transmission/reception of a radio frequency waveST MICROELECTRONICS INT NV·Filed 2023·Application pending·0 cites
- 4653US2024079363A1Integrated circuit packageST MICROELECTRONICS GRENOBLE 2·Filed 2023·Application pending·0 cites
- 4753US2023403791A1Package, for example an optical package, for an integrated circuitST MICROELECTRONICS GRENOBLE 2·Filed 2023·Application pending·0 cites
- 4853US2012104454A1Optical device, process for fabricating it and an electronic package comprising this optical deviceCOFFY ROMAIN·Filed 2011·Application pending·0 cites
- 4951US11380663B2Electronic device comprising optical electronic components and manufacturing methodST MICROELECTRONICS GRENOBLE 2·Filed 2020·Granted Jul 5, 2022·0 cites·39 claims
- 5051US2023266441A1Time-of-flight sensorST MICROELECTRONICS GRENOBLE 2·Filed 2023·Application pending·0 cites
Showing the top 50 of 80 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →