Inventor · disambiguated record
Robert J. Contolini
Also filed as: CONTOLINI ROBERT · CONTOLINI ROBERT J
30 granted patents·3,412 citations·filing 1989–2003
98Inventor score
Top patents by PatentIndex Score
30 records- 0199US5096550AMethod and apparatus for spatially uniform electropolishing and electrolytic etchingUS ENERGY·Filed 1990·Granted Mar 17, 1992·413 cites·42 claims
- 0298US6569299B1Membrane partition system for plating of wafersNOVELLUS SYSTEMS INC·Filed 2000·Granted May 27, 2003·101 cites·14 claims
- 0398US6402923B1Method and apparatus for uniform electroplating of integrated circuits using a variable field shaping elementNOVELLUS SYSTEMS INC·Filed 2000·Granted Jun 11, 2002·163 cites·25 claims
- 0498US6126798AElectroplating anode including membrane partition system and method of preventing passivation of sameNOVELLUS SYSTEMS INC·Filed 1997·Granted Oct 3, 2000·259 cites·38 claims
- 0598US6074544AMethod of electroplating semiconductor wafer using variable currents and mass transfer to obtain uniform plated layerNOVELLUS SYSTEMS INC·Filed 1998·Granted Jun 13, 2000·288 cites·7 claims
- 0697US6193859B1Electric potential shaping apparatus for holding a semiconductor wafer during electroplatingNOVELLUS SYSTEMS INC·Filed 1998·Granted Feb 27, 2001·159 cites·29 claims
- 0797US6159354AElectric potential shaping method for electroplatingNOVELLUS SYSTEMS INC·Filed 1997·Granted Dec 12, 2000·182 cites·12 claims
- 0897US6110346AMethod of electroplating semicoductor wafer using variable currents and mass transfer to obtain uniform plated layerNOVELLUS SYSTEMS INC·Filed 1999·Granted Aug 29, 2000·158 cites·9 claims
- 0996US7070686B2Dynamically variable field shaping elementNOVELLUS SYSTEMS INC·Filed 2002·Granted Jul 4, 2006·76 cites·27 claims
- 1096US6551483B1Method for potential controlled electroplating of fine patterns on semiconductor wafersNOVELLUS SYSTEMS INC·Filed 2001·Granted Apr 22, 2003·110 cites·18 claims
- 1196US5256565AElectrochemical planarizationUS ARMY·Filed 1989·Granted Oct 26, 1993·185 cites·12 claims
- 1295US6162344AMethod of electroplating semiconductor wafer using variable currents and mass transfer to obtain uniform plated layerNOVELLUS SYSTEMS INC·Filed 1999·Granted Dec 19, 2000·179 cites·9 claims
- 1395US6099702AElectroplating chamber with rotatable wafer holder and pre-wetting and rinsing capabilityNOVELLUS SYSTEMS INC·Filed 1998·Granted Aug 8, 2000·203 cites·10 claims
- 1494US5099311AMicrochannel heat sink assemblyUS ENERGY·Filed 1991·Granted Mar 24, 1992·309 cites·18 claims
- 1591US6562204B1Apparatus for potential controlled electroplating of fine patterns on semiconductor wafersNOVELLUS SYSTEMS INC·Filed 2001·Granted May 13, 2003·47 cites·5 claims
- 1691US6315883B1Electroplanarization of large and small damascene features using diffusion barriers and electropolishingNOVELLUS SYSTEMS INC·Filed 1999·Granted Nov 13, 2001·112 cites·32 claims
- 1789US5658832AMethod of forming a spacer for field emission flat panel displaysUNIV CALIFORNIA·Filed 1994·Granted Aug 19, 1997·59 cites·10 claims
- 1888US6709565B2Method and apparatus for uniform electropolishing of damascene ic structures by selective agitationNOVELLUS SYSTEMS INC·Filed 2001·Granted Mar 23, 2004·42 cites·59 claims
- 1988US6514393B1Adjustable flange for plating and electropolishing thickness profile controlNOVELLUS SYSTEMS INC·Filed 2000·Granted Feb 4, 2003·27 cites·7 claims
- 2088US5486234ARemoval of field and embedded metal by spin spray etchingUS ARMY·Filed 1995·Granted Jan 23, 1996·100 cites·20 claims
- 2183US6716334B1Electroplating process chamber and method with pre-wetting and rinsing capabilityNOVELLUS SYSTEMS INC·Filed 2001·Granted Apr 6, 2004·30 cites·10 claims
- 2280US6214193B1Electroplating process including pre-wetting and rinsingNOVELLUS SYSTEMS INC·Filed 1999·Granted Apr 10, 2001·48 cites·10 claims
- 2380US5653019ARepairable chip bonding/interconnect processUNIV CALIFORNIA·Filed 1995·Granted Aug 5, 1997·66 cites·19 claims
- 2475US6033583AVapor etching of nuclear tracks in dielectric materialsUNIV CALIFORNIA·Filed 1997·Granted Mar 7, 2000·43 cites·24 claims
- 2561US7211175B1Method and apparatus for potential controlled electroplating of fine patterns on semiconductor wafersNOVELLUS SYSTEMS INC·Filed 2003·Granted May 1, 2007·7 cites·8 claims
- 2659US6139716ASubmicron patterned metal hole etchingUNIV CALIFORNIA·Filed 1999·Granted Oct 31, 2000·15 cites·27 claims
- 2756US6045678AFormation of nanofilament field emission devicesUNIV CALIFORNIA·Filed 1997·Granted Apr 4, 2000·12 cites·18 claims
- 2851US6193870B1Use of a hard mask for formation of gate and dielectric via nanofilament field emission devicesUNIV CALIFORNIA·Filed 1997·Granted Feb 27, 2001·16 cites·20 claims
- 2930US6261961B1Adhesion layer for etching of tracks in nuclear trackable materialsUNIV CALIFORNIA·Filed 1999·Granted Jul 17, 2001·0 cites·4 claims
- 3029US6051493AProcess for protecting bonded components from plating shortsUNIV CALIFORNIA·Filed 1994·Granted Apr 18, 2000·3 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →