Inventor · disambiguated record
Robert Edgeworth
Also filed as: EDGEWORTH ROBERT · EDGEWORTH ROBERT M
2 granted patents·2 pending applications·33 citations·filing 2001–2016
60Inventor score
Top patents by PatentIndex Score
4 records- 0182US9786559B2Process and material for preventing deleterious expansion of high aspect ratio copper filled through silicon vias (TSVs)INTEL CORP·Filed 2016·Granted Oct 10, 2017·3 cites·12 claims
- 0276US7787696B2Systems and methods for adaptive sampling and estimating a systematic relationship between a plurality of pointsUNIV NORTH CAROLINA·Filed 2001·Granted Aug 31, 2010·30 cites·31 claims
- 0346US2014117559A1Process and material for preventing deleterious expansion of high aspect ratio copper filled through silicon vias (tsvs)ZIMMERMAN PAUL A·Filed 2012·Application pending·0 cites
- 0434US2005123860A1Dielectric with fluorescent materialFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →