Inventor · disambiguated record
Robert D. Edwards
Also filed as: EDWARDS ROBERT D · EDWARDS ROBERT DOUGLAS
10 granted patents·2 pending applications·214 citations·filing 1989–2010
90Inventor score
Top patents by PatentIndex Score
12 records- 0194US4969979ADirect electroplating of through holesIBM·Filed 1989·Granted Nov 13, 1990·66 cites·18 claims
- 0285US5733466AElectrolytic method of depositing gold connectors on a printed circuit boardIBM·Filed 1996·Granted Mar 31, 1998·79 cites·11 claims
- 0382US7169313B2Plating method for circuitized substratesENDICOTT INTERCONNECT TECH INC·Filed 2005·Granted Jan 30, 2007·13 cites·15 claims
- 0476US7223476B2Composite flakes and methods for making and using the samePPG IND OHIO INC·Filed 2004·Granted May 29, 2007·11 cites·37 claims
- 0568US6414509B1Method and apparatus for in-situ testing of integrated circuit chipsIBM·Filed 2000·Granted Jul 2, 2002·18 cites·5 claims
- 0659US6841228B2Structure having embedded flush circuitry features and method of fabricatingIBM·Filed 2003·Granted Jan 11, 2005·6 cites·8 claims
- 0749US6086946AMethod for electroless gold deposition in the presence of a palladium seeder and article produced therebyIBM·Filed 1997·Granted Jul 11, 2000·11 cites·14 claims
- 0848US6383617B1Method for electroless gold deposition in the presence of a palladium seeder and article produced therebyIBM·Filed 2000·Granted May 7, 2002·2 cites·6 claims
- 0945US6663786B2Structure having embedded flush circuitry features and method of fabricatingIBM·Filed 2001·Granted Dec 16, 2003·1 cites·22 claims
- 1039US2005157475A1Method of making printed circuit board with electroplated conductive through holes and board resulting therefromENDICOTT INTERCONNECT TECH INC·Filed 2004·Application pending·0 cites
- 1136US5363553AMethod of drilling vias and through holesIBM·Filed 1993·Granted Nov 15, 1994·7 cites·1 claims
- 1234US2011260299A1Method for via plating in electronic packages containing fluoropolymer dielectric layersENDICOTT INTERCONNECT TECH INC·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →