Inventor · disambiguated record
Robert Fehler
Also filed as: FEHLER ROBERT
13 granted patents·2 pending applications·4 citations·filing 2018–2024
83Inventor score
Top patents by PatentIndex Score
15 records- 0190US11848262B2Semiconductor package and passive element with interposerINFINEON TECHNOLOGIES AG·Filed 2021·Granted Dec 19, 2023·2 cites·17 claims
- 0285US11469164B2Space efficient and low parasitic half bridgeINFINEON TECHNOLOGIES AG·Filed 2020·Granted Oct 11, 2022·2 cites·18 claims
- 0378US2025087581A1Method for fabricating a semiconductor packageINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2024·Application pending·0 cites
- 0474US12159829B2Semiconductor package with non-uniformly distributed viasINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2022·Granted Dec 3, 2024·0 cites·23 claims
- 0574US12131988B2Semiconductor package and passive element with interposerINFINEON TECHNOLOGIES AG·Filed 2023·Granted Oct 29, 2024·0 cites·14 claims
- 0674US12009290B2Semiconductor module having a multi-branch switch node connectorINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2023·Granted Jun 11, 2024·0 cites·20 claims
- 0768US11664304B2Semiconductor moduleINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2021·Granted May 30, 2023·0 cites·19 claims
- 0867US12431367B2Embedded package with shielding padINFINEON TECHNOLOGIES AG·Filed 2023·Granted Sep 30, 2025·0 cites·20 claims
- 0960US11444017B2Semiconductor package and method of manufacturing a semiconductor packageINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2019·Granted Sep 13, 2022·0 cites·10 claims
- 1059US11348861B2Semiconductor package and method of manufacturing a semiconductor packageINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2020·Granted May 31, 2022·0 cites·20 claims
- 1158US2025183232A1Power stage package with half bridge-connected transistor chips and driver chip having through connectionINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 1255US11935874B2Circuitry and method of forming a circuitryINFINEON TECHNOLOGIES AG·Filed 2021·Granted Mar 19, 2024·0 cites·12 claims
- 1352US10811342B2Semiconductor package and method of manufacturing a semiconductor packageINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2019·Granted Oct 20, 2020·0 cites·20 claims
- 1449US12237246B2Semiconductor devices including parallel electrically conductive layersINFINEON TECHNOLOGIES AG·Filed 2021·Granted Feb 25, 2025·0 cites·16 claims
- 1541US10916484B2Electronic device including redistribution layer pad having a voidINFINEON TECHNOLOGIES AG·Filed 2018·Granted Feb 9, 2021·0 cites·21 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →