Inventor · disambiguated record
Robert C. Frye
Also filed as: FRYE ROBERT C · FRYE ROBERT CHARLES · TASCH AL F JR
66 granted patents·1 pending application·1,874 citations·filing 1975–2022
99Inventor score
Top patents by PatentIndex Score
67 records- 0198US7629860B2Miniaturized wide-band baluns for RF applicationsSTATS CHIPPAC LTD·Filed 2007·Granted Dec 8, 2009·61 cites·31 claims
- 0296US9171797B2System-in-package having integrated passive devices and method thereforSTATS CHIPPAC LTD·Filed 2013·Granted Oct 27, 2015·18 cites·25 claims
- 0396US5534465AMethod for making multichip circuits using active semiconductor substratesAT & T CORP·Filed 1995·Granted Jul 9, 1996·231 cites·5 claims
- 0494US6154370ARecessed flip-chip packageLUCENT TECHNOLOGIES INC·Filed 1998·Granted Nov 28, 2000·117 cites·7 claims
- 0594US4501060ADielectrically isolated semiconductor devicesAT & T BELL LAB·Filed 1983·Granted Feb 26, 1985·94 cites·6 claims
- 0693US8576026B2Semiconductor device having balanced band-pass filter implemented with LC resonatorLIU KAI·Filed 2008·Granted Nov 5, 2013·24 cites·30 claims
- 0793US8269575B2Semiconductor device and method of forming RF balun having reduced capacitive coupling and high CMRRFRYE ROBERT C·Filed 2010·Granted Sep 18, 2012·15 cites·25 claims
- 0893US6097273AThin-film monolithic coupled spiral balun transformerLUCENT TECHNOLOGIES INC·Filed 1999·Granted Aug 1, 2000·166 cites·7 claims
- 0993US5481205ATemporary connections for fast electrical access to electronic devicesAT & T CORP·Filed 1994·Granted Jan 2, 1996·98 cites·28 claims
- 1093US5467883AActive neural network control of wafer attributes in a plasma etch processAT & T CORP·Filed 1993·Granted Nov 21, 1995·106 cites·20 claims
- 1192US6911870B2Quadrature voltage controlled oscillator utilizing common-mode inductive couplingAGERE SYSTEMS INC·Filed 2003·Granted Jun 28, 2005·50 cites·8 claims
- 1292US5898223AChip-on-chip IC packagesLUCENT TECHNOLOGIES INC·Filed 1997·Granted Apr 27, 1999·149 cites·15 claims
- 1390US6175158B1Interposer for recessed flip-chip packageLUCENT TECHNOLOGIES INC·Filed 1998·Granted Jan 16, 2001·115 cites·19 claims
- 1488US8111112B2Semiconductor device and method of forming compact coils for high performance filterLIU KAI·Filed 2010·Granted Feb 7, 2012·6 cites·24 claims
- 1588US4035906ASilicon gate CCD structureTEXAS INSTRUMENTS INC·Filed 1976·Granted Jul 19, 1977·35 cites·16 claims
- 1687US10693221B2Modular phased arrayBLUE DANUBE SYSTEMS INC·Filed 2016·Granted Jun 23, 2020·6 cites·23 claims
- 1787US8791775B2Semiconductor device and method of forming high-attenuation balanced band-pass filterLIU KAI·Filed 2010·Granted Jul 29, 2014·9 cites·32 claims
- 1886US7759212B2System-in-package having integrated passive devices and method thereforSTATS CHIPPAC LTD·Filed 2007·Granted Jul 20, 2010·12 cites·22 claims
- 1984US5737496AActive neural network control of wafer attributes in a plasma etch processLUCENT TECHNOLOGIES INC·Filed 1995·Granted Apr 7, 1998·51 cites·3 claims
- 2083US8564382B2Miniaturized wide-band baluns for RF applicationsLIU KAI·Filed 2009·Granted Oct 22, 2013·7 cites·25 claims
- 2183US8228154B2Miniaturized wide-band baluns for RF applicationsLIU KAI·Filed 2009·Granted Jul 24, 2012·8 cites·34 claims
- 2283US7892858B2Semiconductor package with stacked semiconductor die each having IPD and method of reducing mutual inductive coupling by providing selectable vertical and lateral separation between IPDSTATS CHIPPAC LTD·Filed 2008·Granted Feb 22, 2011·11 cites·21 claims
- 2383US5747982AMulti-chip modules with isolated coupling between modulesLUCENT TECHNOLOGIES INC·Filed 1996·Granted May 5, 1998·79 cites·11 claims
- 2483US4047215AUniphase charge coupled devicesTEXAS INSTRUMENTS INC·Filed 1975·Granted Sep 6, 1977·27 cites·9 claims
- 2582US8502339B2System-in-package having integrated passive devices and method thereforLIN YAOJIAN·Filed 2010·Granted Aug 6, 2013·5 cites·35 claims
- 2682US8358179B2Semiconductor device and method of forming directional RF coupler with IPD for additional RF signal processingSTATS CHIPPAC LTD·Filed 2009·Granted Jan 22, 2013·8 cites·20 claims
- 2782US7727879B2Method of forming top electrode for capacitor and interconnection in integrated passive device (IPD)STATS CHIPPAC LTD·Filed 2007·Granted Jun 1, 2010·7 cites·25 claims
- 2881US8124490B2Semiconductor device and method of forming passive devicesLIN YAOJIAN·Filed 2007·Granted Feb 28, 2012·9 cites·32 claims
- 2981US8035458B2Semiconductor device and method of integrating balun and RF coupler on a common substrateSTATS CHIPPAC LTD·Filed 2009·Granted Oct 11, 2011·8 cites·31 claims
- 3081US5461333AMulti-chip modules having chip-to-chip interconnections with reduced signal voltage level and swingAT & T CORP·Filed 1994·Granted Oct 24, 1995·75 cites·13 claims
- 3180US7688160B2Compact coils for high performance filtersSTATS CHIPPAC LTD·Filed 2007·Granted Mar 30, 2010·7 cites·12 claims
- 3279US8981866B2Semiconductor device and method of forming RF balun having reduced capacitive coupling and high CMRRFRYE ROBERT C·Filed 2012·Granted Mar 17, 2015·4 cites·24 claims
- 3379US8390391B2Semiconductor device and method of integrating balun and RF coupler on a common substrateFRYE ROBERT C·Filed 2011·Granted Mar 5, 2013·4 cites·31 claims
- 3479US7851257B2Integrated circuit stacking system with integrated passive componentsSTATS CHIPPAC LTD·Filed 2006·Granted Dec 14, 2010·8 cites·20 claims
- 3579US4118795ATwo-phase CCD regenerator - I/O circuitsTEXAS INSTRUMENTS INC·Filed 1976·Granted Oct 3, 1978·25 cites·15 claims
- 3679US4060738ACharge coupled device random access memoryTEXAS INSTRUMENTS INC·Filed 1976·Granted Nov 29, 1977·21 cites·20 claims
- 3778US9349723B2Semiconductor device and method of forming passive devicesLIN YAOJIAN·Filed 2012·Granted May 24, 2016·4 cites·14 claims
- 3878US8241952B2Semiconductor device and method of forming IPD in fan-out level chip scale packageLIN YAOJIAN·Filed 2010·Granted Aug 14, 2012·4 cites·19 claims
- 3976US8803630B2Miniaturized wide-band baluns for RF applicationsLIU KAI·Filed 2009·Granted Aug 12, 2014·5 cites·33 claims
- 4075US8111113B2Semiconductor device and method of forming thin film capacitorLIU KAI·Filed 2010·Granted Feb 7, 2012·2 cites·26 claims
- 4175US6160715ATranslator for recessed flip-chip packageLUCENT TECHNOLOGIES INC·Filed 1998·Granted Dec 12, 2000·39 cites·18 claims
- 4273US8399990B2Method of forming top electrode for capacitor and interconnection in integrated passive device (IPD)LIN YAOJIAN·Filed 2012·Granted Mar 19, 2013·2 cites·30 claims
- 4372US8921127B2Semiconductor device and method of simultaneous testing of multiple interconnects for electro-migrationFRYE ROBERT C·Filed 2012·Granted Dec 30, 2014·3 cites·23 claims
- 4472US8120183B2Method of forming top electrode for capacitor and interconnection in integrated passive device (IPD)LIN YAOJIAN·Filed 2010·Granted Feb 21, 2012·2 cites·25 claims
- 4572US7772080B2Semiconductor device and method of providing electrostatic discharge protection for integrated passive devicesSTATS CHIPPAC LTD·Filed 2008·Granted Aug 10, 2010·4 cites·20 claims
- 4670US8823466B2Miniaturized wide-band baluns for RF applicationsLIU KAI·Filed 2009·Granted Sep 2, 2014·3 cites·25 claims
- 4770US7061340B2Differently-tuned VCO using inductively coupled varactorsAGERE SYSTEMS INC·Filed 2004·Granted Jun 13, 2006·12 cites·14 claims
- 4864US10181943B2Distributing coherent signals to large electrical distances over serial interconnectionsBLUE DANUBE SYSTEMS INC·Filed 2017·Granted Jan 15, 2019·1 cites·36 claims
- 4963US4380865AMethod of forming dielectrically isolated silicon semiconductor materials utilizing porous silicon formationBELL TELEPHONE LABOR INC·Filed 1981·Granted Apr 26, 1983·24 cites·11 claims
- 5063US4344128AAutomatic process control deviceFRYE ROBERT C·Filed 1980·Granted Aug 10, 1982·21 cites·23 claims
Showing the top 50 of 67 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →