Inventor · disambiguated record
Ronald D. Goldblatt
Also filed as: GOLDBLATT RONALD · GOLDBLATT RONALD D · GOLDBLATT RONALD DEAN
17 granted patents·5 pending applications·897 citations·filing 1989–2017
95Inventor score
Top patents by PatentIndex Score
22 records- 0198US6187680B1Method/structure for creating aluminum wirebound pad on copper BEOLIBM·Filed 1998·Granted Feb 13, 2001·353 cites·19 claims
- 0297US5208068ALamination method for coating the sidewall or filling a cavity in a substrateIBM·Filed 1990·Granted May 4, 1993·143 cites·29 claims
- 0396US6534863B2Common ball-limiting metallurgy for I/O sitesIBM·Filed 2001·Granted Mar 18, 2003·112 cites·17 claims
- 0489US7098676B2Multi-functional structure for enhanced chip manufacturibility and reliability for low k dielectrics semiconductors and a crackstop integrity screen and monitorIBM·Filed 2003·Granted Aug 29, 2006·49 cites·12 claims
- 0587US6333559B1Method/structure for creating aluminum wirebound pad on copper BEOLIBM·Filed 2000·Granted Dec 25, 2001·41 cites·15 claims
- 0684US9300284B2Device select system for multi-device electronic systemBISKEBORN ROBERT GLENN·Filed 2007·Granted Mar 29, 2016·6 cites·19 claims
- 0784US5357005AReactive surface functionalizationIBM·Filed 1991·Granted Oct 18, 1994·51 cites·35 claims
- 0881US5019210AMethod for enhancing the adhesion of polymer surfaces by water vapor plasma treatmentIBM·Filed 1989·Granted May 28, 1991·40 cites·16 claims
- 0974US7294565B2Method of fabricating a wire bond pad with Ni/Au metallizationIBM·Filed 2003·Granted Nov 13, 2007·18 cites·20 claims
- 1070US6395164B1Copper seed layer repair technique using electroless touch-upIBM·Filed 1999·Granted May 28, 2002·36 cites·3 claims
- 1164US9337363B2Low resistance, low reflection, and low cost contact grids for photovoltaic cellsGOLDBLATT RONALD·Filed 2011·Granted May 10, 2016·3 cites·25 claims
- 1261US5340451AProcess for producing a metal organic polymer combinationIBM·Filed 1993·Granted Aug 23, 1994·22 cites·35 claims
- 1349US5178914AMeans of seeding and metallizing polymideIBM·Filed 1990·Granted Jan 12, 1993·17 cites·36 claims
- 1449US2008073790A1METHOD OF FABRICATING A WIRE BOND PAD WITH Ni/Au METALLIZATIONIBM·Filed 2007·Application pending·0 cites
- 1547US2009283865A1Electrochemical method to make high quality doped crystalline compound semiconductorsIBM·Filed 2008·Application pending·0 cites
- 1646US10199516B2Method for fabricating a photovoltaic device by uniform plating on dielectric passivated through-wafer vias and interconnectsIBM·Filed 2017·Granted Feb 5, 2019·0 cites·5 claims
- 1745US9666749B2Low resistance, low reflection, and low cost contact grids for photovoltaic cellsIBM·Filed 2016·Granted May 30, 2017·0 cites·16 claims
- 1843US2011272287A1Method for patterning magnetic filmsIBM·Filed 2010·Application pending·0 cites
- 1941US9716192B2Method for fabricating a photovoltaic device by uniform plating on emitter-lined through-wafer vias and interconnectsIBM·Filed 2015·Granted Jul 25, 2017·0 cites·8 claims
- 2040US2003092254A1Common ball-limiting metallurgy for I/O sitesFiled 2002·Application pending·0 cites
- 2135US6339022B1Method of annealing copper metallurgyIBM·Filed 1999·Granted Jan 15, 2002·6 cites·25 claims
- 2233US2015325716A1Manufacture and structure for photovoltaics including metal-rich silicideIBM·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →