Inventor · disambiguated record
Roland W. Gooch
Also filed as: GOOCH ROLAND · GOOCH ROLAND W · GOOCH ROLAND WILBY
45 granted patents·2 pending applications·1,232 citations·filing 1975–2018
98Inventor score
Top patents by PatentIndex Score
47 records- 0197US6479320B1Vacuum package fabrication of microelectromechanical system devices with integrated circuit componentsRAYTHEON CO·Filed 2000·Granted Nov 12, 2002·235 cites·23 claims
- 0296US7459686B2Systems and methods for integrating focal plane arraysL 3 COMM CORP·Filed 2006·Granted Dec 2, 2008·51 cites·45 claims
- 0395US8153980B1Color correction for radiation detectorsBRADY JOHN F·Filed 2006·Granted Apr 10, 2012·70 cites·35 claims
- 0495US6690014B1Microbolometer and method for formingRAYTHEON CO·Filed 2000·Granted Feb 10, 2004·177 cites·38 claims
- 0593US7462831B2Systems and methods for bondingL 3 COMM CORP·Filed 2006·Granted Dec 9, 2008·21 cites·39 claims
- 0691US7655909B2Infrared detector elements and methods of forming sameL 3 COMM CORP·Filed 2006·Granted Feb 2, 2010·22 cites·37 claims
- 0791US6297511B1High frequency infrared emitterRAYTHEON CO·Filed 1999·Granted Oct 2, 2001·123 cites·24 claims
- 0889US8736045B1Integrated bondline spacers for wafer level packaged circuit devicesRAYTHEON CO·Filed 2012·Granted May 27, 2014·8 cites·6 claims
- 0989US6586831B2Vacuum package fabrication of integrated circuit componentsRAYTHEON CO·Filed 2001·Granted Jul 1, 2003·65 cites·15 claims
- 1088US6521477B1Vacuum package fabrication of integrated circuit componentsRAYTHEON CO·Filed 2000·Granted Feb 18, 2003·66 cites·31 claims
- 1185US8809784B2Incident radiation detector packagingGOOCH ROLAND W·Filed 2011·Granted Aug 19, 2014·11 cites·20 claims
- 1283US7262412B2Optically blocked reference pixels for focal plane arraysL 3 COMM CORP·Filed 2005·Granted Aug 28, 2007·10 cites·48 claims
- 1383US6392232B1High fill factor bolometer arrayTEXAS INSTRUMENTS INC·Filed 1996·Granted May 21, 2002·63 cites·9 claims
- 1482US9093444B2Wafer level package solder barrier used as vacuum getterRAYTHEON CO·Filed 2013·Granted Jul 28, 2015·4 cites·6 claims
- 1582US8454789B2Disposable bond gap control structuresDIEP BUU·Filed 2011·Granted Jun 4, 2013·6 cites·2 claims
- 1682US6879035B2Vacuum package fabrication of integrated circuit componentsFiled 2003·Granted Apr 12, 2005·27 cites·19 claims
- 1781US5777328ARamped foot supportTEXAS INSTRUMENTS INC·Filed 1996·Granted Jul 7, 1998·57 cites·10 claims
- 1880US7375331B2Optically blocked reference pixels for focal plane arraysL 3 COMM CORP·Filed 2007·Granted May 20, 2008·8 cites·32 claims
- 1979US5449908AHybrid CCD imagingTEXAS INSTRUMENTS INC·Filed 1993·Granted Sep 12, 1995·45 cites·11 claims
- 2078US9427776B2Method of stress relief in anti-reflective coated cap wafers for wafer level packaged infrared focal plane arraysRAYTHEON CO·Filed 2012·Granted Aug 30, 2016·1 cites·11 claims
- 2176US8844793B2Reducing formation of oxide on solderDIEP BUU·Filed 2011·Granted Sep 30, 2014·4 cites·20 claims
- 2275US6897469B2Sub-wavelength structures for reduction of reflective propertiesFiled 2003·Granted May 24, 2005·26 cites·7 claims
- 2375US5789753AStress tolerant bolometerTEXAS INSTRUMENTS INC·Filed 1996·Granted Aug 4, 1998·44 cites·7 claims
- 2471US9132496B2Reducing formation of oxide on solderRAYTHEON CO·Filed 2014·Granted Sep 15, 2015·2 cites·20 claims
- 2570US9227839B2Wafer level packaged infrared (IR) focal plane array (FPA) with evanescent wave couplingRAYTHEON CO·Filed 2014·Granted Jan 5, 2016·2 cites·14 claims
- 2669US7528061B2Systems and methods for solder bondingL 3 COMM CORP·Filed 2005·Granted May 5, 2009·4 cites·31 claims
- 2766US9073298B2Disposable bond gap control structuresRAYTHEON CO·Filed 2013·Granted Jul 7, 2015·0 cites·12 claims
- 2866US3965568AProcess for fabrication and assembly of semiconductor devicesTEXAS INSTRUMENTS INC·Filed 1975·Granted Jun 29, 1976·24 cites·11 claims
- 2963US7977208B2Method and apparatus for packaging circuit devicesRAYTHEON CO·Filed 2010·Granted Jul 12, 2011·1 cites·11 claims
- 3063US7535093B1Method and apparatus for packaging circuit devicesRAYTHEON CO·Filed 2002·Granted May 19, 2009·9 cites·8 claims
- 3161US5652150AHybrid CCD imagingTEXAS INSTRUMENTS INC·Filed 1996·Granted Jul 29, 1997·26 cites·21 claims
- 3259US10262913B2Wafer level package solder barrier used as vacuum getterRAYTHEON CO·Filed 2018·Granted Apr 16, 2019·0 cites·8 claims
- 3359US7867874B2Method and apparatus for packaging circuit devicesRAYTHEON CO·Filed 2009·Granted Jan 11, 2011·1 cites·9 claims
- 3458US9174836B2Integrated bondline spacers for wafer level packaged circuit devicesRAYTHEON CO·Filed 2014·Granted Nov 3, 2015·0 cites·23 claims
- 3558US7514684B2Surface mounted infrared image detector systems and associated methodsL 3 COMM CORP·Filed 2006·Granted Apr 7, 2009·1 cites·19 claims
- 3657US9187312B2Integrated bondline spacers for wafer level packaged circuit devicesRAYTHEON CO·Filed 2014·Granted Nov 17, 2015·0 cites·15 claims
- 3756US10315918B2Method of stress relief in anti-reflective coated cap wafers for wafer level packaged infrared focal plane arraysRAYTHEON CO·Filed 2016·Granted Jun 11, 2019·0 cites·18 claims
- 3856US9966320B2Wafer level package solder barrier used as vacuum getterRAYTHEON CO·Filed 2016·Granted May 8, 2018·0 cites·5 claims
- 3956US9196556B2Getter structure and method for forming such structureRAYTHEON CO·Filed 2014·Granted Nov 24, 2015·0 cites·6 claims
- 4053US9520332B2Wafer level package solder barrier used as vacuum getterRAYTHEON CO·Filed 2015·Granted Dec 13, 2016·0 cites·4 claims
- 4148US7015074B2Vacuum package fabrication of integrated circuit componentsL 3 COMM CORP·Filed 2004·Granted Mar 21, 2006·1 cites·14 claims
- 4246US9105800B2Method of forming deposited patterns on a surfaceRAYTHEON CO·Filed 2013·Granted Aug 11, 2015·0 cites·3 claims
- 4346US2016040282A1Getter structure and method for forming such structureRAYTHEON CO·Filed 2015·Application pending·0 cites
- 4445US7220621B2Sub-wavelength structures for reduction of reflective propertiesL 3 COMM CORP·Filed 2004·Granted May 22, 2007·0 cites·25 claims
- 4542US2014175590A1Getter structure for wafer level vacuum packaged deviceRAYTHEON CO·Filed 2012·Application pending·0 cites
- 4639US5543641AHybrid signal conditioning/infared imaging structureTEXAS INSTRUMENTS INC·Filed 1995·Granted Aug 6, 1996·6 cites·18 claims
- 4728US5800503AApparatus and method for producing electrical stimulation in response to an audio signalSWAK VENTURES INC·Filed 1996·Granted Sep 1, 1998·11 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →