Inventor · disambiguated record
Rolf Guenther
Also filed as: GUENTHER ROLF · GUENTHER ROLF A · GUENTHER ROLF ADOLF
21 granted patents·7 pending applications·1,312 citations·filing 1978–2009
97Inventor score
Files withAPPLIED MATERIALS INC19GUENTHER ROLF A2EVOTEC AG1EVOTEC BIOSYSTEM AG1EVOTEC BIOSYSTEMS AG1
Top patents by PatentIndex Score
28 records- 0196US7294208B2Apparatus for providing gas to a processing chamberAPPLIED MATERIALS INC·Filed 2005·Granted Nov 13, 2007·30 cites·34 claims
- 0296US6915592B2Method and apparatus for generating gas to a processing chamberAPPLIED MATERIALS INC·Filed 2002·Granted Jul 12, 2005·94 cites·63 claims
- 0396US6367410B1Closed-loop dome thermal control apparatus for a semiconductor wafer processing systemAPPLIED MATERIALS INC·Filed 1997·Granted Apr 9, 2002·620 cites·29 claims
- 0495US8267386B2Pneumatically actuated area vacuum gripperSCHAAF WALTER·Filed 2009·Granted Sep 18, 2012·72 cites·6 claims
- 0592US6902947B2Integrated method for release and passivation of MEMS structuresAPPLIED MATERIALS INC·Filed 2003·Granted Jun 7, 2005·89 cites·10 claims
- 0686US7354501B2Upper chamber for high density plasma CVDAPPLIED MATERIALS INC·Filed 2002·Granted Apr 8, 2008·39 cites·21 claims
- 0786US5978202AElectrostatic chuck having a thermal transfer regulator padAPPLIED MATERIALS INC·Filed 1997·Granted Nov 2, 1999·81 cites·38 claims
- 0885US7074298B2High density plasma CVD chamberAPPLIED MATERIALS INC·Filed 2002·Granted Jul 11, 2006·23 cites·26 claims
- 0980US6830950B2Integrated method for release and passivation of MEMS structuresAPPLIED MATERIALS INC·Filed 2002·Granted Dec 14, 2004·27 cites·38 claims
- 1076US7674338B2Heated substrate support and method of fabricating sameAPPLIED MATERIALS INC·Filed 2005·Granted Mar 9, 2010·3 cites·19 claims
- 1176US6916147B2Substrate storage cassette with substrate alignment featureAPPLIED MATERIALS INC·Filed 2002·Granted Jul 12, 2005·20 cites·37 claims
- 1272US4701231AMethod of forming a joint between a tubular composite and a metal ringWESTINGHOUSE ELECTRIC CORP·Filed 1986·Granted Oct 20, 1987·34 cites·8 claims
- 1370US6900133B2Method of etching variable depth features in a crystalline substrateAPPLIED MATERIALS INC·Filed 2002·Granted May 31, 2005·14 cites·21 claims
- 1467US5893643AApparatus for measuring pedestal temperature in a semiconductor wafer processing systemAPPLIED MATERIALS INC·Filed 1997·Granted Apr 13, 1999·37 cites·15 claims
- 1565US7202953B1Scanning microscopic method having high axial resolutionEVOTEC BIOSYSTEMS AG·Filed 1999·Granted Apr 10, 2007·35 cites·34 claims
- 1661US5851926AMethod for etching transistor gates using a hardmaskAPPLIED MATERIALS INC·Filed 1996·Granted Dec 22, 1998·25 cites·5 claims
- 1760US6822185B2Temperature controlled dome-coil system for high power inductively coupled plasma systemsAPPLIED MATERIALS INC·Filed 2002·Granted Nov 23, 2004·7 cites·56 claims
- 1860US4228976AMain connector for an airfoil or wingMESSERSCHMITT BOELKOW BLOHM·Filed 1978·Granted Oct 21, 1980·27 cites·8 claims
- 1956US2006191478A1High density plasma CVD chamberAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
- 2055US2010080957A1Surface CoatingINTEGRATED SURFACE TECHNOLOGIE·Filed 2008·Application pending·0 cites
- 2154US7345759B2Method and device for the measurement of chemical and/or biological samplesEVOTEC AG·Filed 2001·Granted Mar 18, 2008·2 cites·38 claims
- 2253US8065789B2Method of fabricating a heated substrate supportGUENTHER ROLF A·Filed 2008·Granted Nov 29, 2011·2 cites·24 claims
- 2348US2005241771A1Substrate carrier for processing substratesAPPLIED MATERIALS INC·Filed 2005·Application pending·0 cites
- 2445US6213735B1Micromechanical ejection pump for separating small fluid volumes from a flowing sample fluidEVOTEC BIOSYSTEM AG·Filed 1997·Granted Apr 10, 2001·31 cites·16 claims
- 2541US2003219986A1Substrate carrier for processing substratesAPPLIED MATERIALS INC·Filed 2002·Application pending·0 cites
- 2637US2003217693A1Substrate support assembly having an edge protectorAPPLIED MATERIALS INC·Filed 2002·Application pending·0 cites
- 2737US2004087054A1Disposable barrier technique for through wafer etching in MEMSAPPLIED MATERIALS INC·Filed 2002·Application pending·0 cites
- 2833US2006075970A1Heated substrate support and method of fabricating sameGUENTHER ROLF A·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →