Inventor · disambiguated record
Ross W. Keesler
Also filed as: KEESLER ROSS W · KEESLER ROSS WILLIAM
21 granted patents·2 pending applications·952 citations·filing 1997–2008
96Inventor score
Top patents by PatentIndex Score
23 records- 0198US6902869B2Manufacturing methods for printed circuit boardsIBM·Filed 2003·Granted Jun 7, 2005·156 cites·15 claims
- 0296US6451509B2Composite laminate circuit structure and method of forming the sameIBM·Filed 2001·Granted Sep 17, 2002·117 cites·10 claims
- 0396US6222136B1Printed circuit board with continuous connective bumpsIBM·Filed 1997·Granted Apr 24, 2001·131 cites·13 claims
- 0496US6204453B1Two signal one power plane circuit boardIBM·Filed 1998·Granted Mar 20, 2001·173 cites·6 claims
- 0596US6175087B1Composite laminate circuit structure and method of forming the sameIBM·Filed 1998·Granted Jan 16, 2001·170 cites·8 claims
- 0684US7353590B2Method of forming printed circuit cardIBM·Filed 2005·Granted Apr 8, 2008·10 cites·15 claims
- 0784US6538213B1High density design for organic chip carriersIBM·Filed 2000·Granted Mar 25, 2003·40 cites·27 claims
- 0877US6684497B2Manufacturing methods for printed circuit boardsIBM·Filed 2001·Granted Feb 3, 2004·16 cites·14 claims
- 0977US6521844B1Through hole in a photoimageable dielectric structure with wired and uncured dielectricIBM·Filed 1999·Granted Feb 18, 2003·33 cites·11 claims
- 1076US6750405B1Two signal one power plane circuit boardIBM·Filed 2000·Granted Jun 15, 2004·19 cites·2 claims
- 1168US6492600B1Laminate having plated microvia interconnects and method for forming the sameIBM·Filed 1999·Granted Dec 10, 2002·28 cites·16 claims
- 1267US7240430B2Manufacturing methods for printed circuit boardsIBM·Filed 2005·Granted Jul 10, 2007·2 cites·7 claims
- 1366US6739048B2Process of fabricating a circuitized structureIBM·Filed 2000·Granted May 25, 2004·12 cites·5 claims
- 1465US7351917B2Vents with signal image for signal return pathIBM·Filed 2005·Granted Apr 1, 2008·2 cites·17 claims
- 1558US6986198B2Method of forming printed circuit cardIBM·Filed 2003·Granted Jan 17, 2006·6 cites·6 claims
- 1658US6977345B2Vents with signal image for signal return pathIBM·Filed 2002·Granted Dec 20, 2005·6 cites·11 claims
- 1751US6830875B2Forming a through hole in a photoimageable dielectric structureIBM·Filed 2002·Granted Dec 14, 2004·3 cites·17 claims
- 1851US6131279AIntegrated manufacturing packaging processIBM·Filed 1998·Granted Oct 17, 2000·14 cites·22 claims
- 1949US2008017410A1Method for forming a plated microvia interconnectJIMAREZ MIGUEL A·Filed 2007·Application pending·0 cites
- 2049US2008127485A1Vents with signal image for signal return pathBUDELL TIMOTHY W·Filed 2008·Application pending·0 cites
- 2147US7328506B2Method for forming a plated microvia interconnectIBM·Filed 2002·Granted Feb 12, 2008·2 cites·14 claims
- 2243US6027858AProcess for tenting PTH's with PID dry filmIBM·Filed 1997·Granted Feb 22, 2000·11 cites·23 claims
- 2338US6887651B2Electrodeposited photoresist and dry film photoresist photolithography process for printed circuit board patterningIBM·Filed 2002·Granted May 3, 2005·1 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →