Inventor · disambiguated record
Robert Paul Mikulka
Also filed as: MIKULKA ROBERT · MIKULKA ROBERT P · MIKULKA ROBERT PAUL
28 granted patents·5 pending applications·108 citations·filing 2012–2016
95Inventor score
Top patents by PatentIndex Score
33 records- 0198US9449753B2Varying thickness inductorQUALCOMM INC·Filed 2014·Granted Sep 20, 2016·33 cites·25 claims
- 0292US9001031B2Complex passive design with special via implementationLO CHI SHUN·Filed 2012·Granted Apr 7, 2015·17 cites·34 claims
- 0387US10290414B2Substrate comprising an embedded inductor and a thin film magnetic coreQUALCOMM INC·Filed 2015·Granted May 14, 2019·6 cites·20 claims
- 0487US9425761B2High pass filters and low pass filters using through glass via technologyQUALCOMM INC·Filed 2013·Granted Aug 23, 2016·9 cites·21 claims
- 0587US9203373B2Diplexer design using through glass via technologyQUALCOMM INC·Filed 2013·Granted Dec 1, 2015·8 cites·20 claims
- 0686US10069474B2Encapsulation of acoustic resonator devicesQUALCOMM INC·Filed 2016·Granted Sep 4, 2018·4 cites·30 claims
- 0783US9813043B2Tunable diplexers in three-dimensional (3D) integrated circuits (IC) (3DIC) and related components and methodsQUALCOMM INC·Filed 2016·Granted Nov 7, 2017·3 cites·23 claims
- 0883US9275786B2Superposed structure 3D orthogonal through substrate inductorQUALCOMM INC·Filed 2014·Granted Mar 1, 2016·5 cites·23 claims
- 0982US9966426B2Augmented capacitor structure for high quality (Q)-factor radio frequency (RF) applicationsQUALCOMM INC·Filed 2015·Granted May 8, 2018·4 cites·20 claims
- 1080US9660110B2Varactor device with backside contactQUALCOMM INC·Filed 2014·Granted May 23, 2017·3 cites·30 claims
- 1176US9906318B2Frequency multiplexerQUALCOMM INC·Filed 2015·Granted Feb 27, 2018·3 cites·24 claims
- 1275US9634640B2Tunable diplexers in three-dimensional (3D) integrated circuits (IC) (3DIC) and related components and methodsQUALCOMM INC·Filed 2013·Granted Apr 25, 2017·3 cites·19 claims
- 1371US10171112B2RF multiplexer with integrated directional couplersQUALCOMM INC·Filed 2016·Granted Jan 1, 2019·2 cites·16 claims
- 1469US9136574B2Compact 3-D coplanar transmission linesQUALCOMM MEMS TECHNOLOGIES INC·Filed 2013·Granted Sep 15, 2015·2 cites·20 claims
- 1566US9666362B2Superposed structure 3D orthogonal through substrate inductorQUALCOMM INC·Filed 2016·Granted May 30, 2017·1 cites·7 claims
- 1665US9876513B2LC filter layer stacking by layer transfer to make 3D multiplexer structuresQUALCOMM INC·Filed 2016·Granted Jan 23, 2018·1 cites·24 claims
- 1763US10074625B2Wafer level package (WLP) ball support using cavity structureQUALCOMM INC·Filed 2015·Granted Sep 11, 2018·1 cites·18 claims
- 1863US9202789B2Die package comprising die-to-wire connector and a wire-to-die connector configured to couple to a die packageQUALCOMM INC·Filed 2014·Granted Dec 1, 2015·1 cites·34 claims
- 1962US10354795B2Varying thickness inductorQUALCOMM INC·Filed 2016·Granted Jul 16, 2019·0 cites·10 claims
- 2060US9264013B2Systems for reducing magnetic coupling in integrated circuits (ICS), and related components and methodsQUALCOMM INC·Filed 2013·Granted Feb 16, 2016·1 cites·19 claims
- 2157US9331666B2Composite dilation mode resonatorsQUALCOMM MEMS TECHNOLOGIES INC·Filed 2012·Granted May 3, 2016·1 cites·30 claims
- 2255US9468098B2Face-up substrate integration with solder ball connection in semiconductor packageQUALCOMM INC·Filed 2014·Granted Oct 11, 2016·0 cites·6 claims
- 2352US2016181233A1Metal-insulator-metal (mim) capacitors arranged in a pattern to reduce inductance, and related methodsQUALCOMM INC·Filed 2014·Application pending·0 cites
- 2449US10103703B2Double-sided circuitQUALCOMM INC·Filed 2016·Granted Oct 16, 2018·0 cites·20 claims
- 2549US9343399B2Thick conductive stack plating process with fine critical dimension feature size for compact passive on glass technologyQUALCOMM INC·Filed 2014·Granted May 17, 2016·0 cites·12 claims
- 2649US9343403B2Stress mitigation structure for wafer warpage reductionQUALCOMM INC·Filed 2014·Granted May 17, 2016·0 cites·10 claims
- 2748US9935166B2Capacitor with a dielectric between a via and a plate of the capacitorQUALCOMM INC·Filed 2013·Granted Apr 3, 2018·0 cites·35 claims
- 2848US2016381809A1Face-up substrate integration with solder ball connection in semiconductor packageQUALCOMM INC·Filed 2016·Application pending·0 cites
- 2947US2014327508A1Inductor tunable by a variable magnetic flux density componentQUALCOMM INC·Filed 2013·Application pending·0 cites
- 3047US2014327510A1Electronic device having asymmetrical through glass viasQUALCOMM INC·Filed 2013·Application pending·0 cites
- 3143US10490348B2Two-dimensional structure to form an embedded three-dimensional structureQUALCOMM INC·Filed 2016·Granted Nov 26, 2019·0 cites·21 claims
- 3243US10187031B2Tunable matching networkQUALCOMM INC·Filed 2016·Granted Jan 22, 2019·0 cites·18 claims
- 3343US2015035162A1Inductive device that includes conductive via and metal layerQUALCOMM INC·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →