Inventor · disambiguated record
Robinson Quiazon
Also filed as: QUIAZON ROBINSON
6 granted patents·94 citations·filing 2005–2011
84Inventor score
Technology areasH10W
Top patents by PatentIndex Score
6 records- 0193US7250685B2Etched leadframe flipchip package systemSTATS CHIPPAC LTD·Filed 2006·Granted Jul 31, 2007·25 cites·20 claims
- 0292US7443015B2Integrated circuit package system with downset leadSTATS CHIPPAC LTD·Filed 2006·Granted Oct 28, 2008·28 cites·13 claims
- 0389US8405230B2Semiconductor flip chip package having substantially non-collapsible spacer and method of manufacture thereofLEE JAE SOO·Filed 2011·Granted Mar 26, 2013·11 cites·21 claims
- 0489US7880313B2Semiconductor flip chip package having substantially non-collapsible spacerCHIPPAC INC·Filed 2005·Granted Feb 1, 2011·17 cites·6 claims
- 0587US7414318B2Etched leadframe flipchip package systemSTATS CHIPPAC LTD·Filed 2007·Granted Aug 19, 2008·13 cites·20 claims
- 0643US7482683B2Integrated circuit encapsulation system with ventSTATS CHIPPAC LTD·Filed 2006·Granted Jan 27, 2009·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →