Inventor · disambiguated record
Roman Roth
Also filed as: ROTH ROMAN
13 granted patents·3 pending applications·31 citations·filing 2006–2024
86Inventor score
Top patents by PatentIndex Score
16 records- 0192US9397022B2Semiconductor device having a locally reinforced metallization structureINFINEON TECHNOLOGIES AUSTRIA·Filed 2015·Granted Jul 19, 2016·9 cites·7 claims
- 0290US9196560B2Semiconductor device having a locally reinforced metallization structure and method for manufacturing thereofINFINEON TECHNOLOGIES AUSTRIA·Filed 2013·Granted Nov 24, 2015·12 cites·14 claims
- 0373US7851913B2Semiconductor device including a power device with first metal layer and second metal layer laterally spaced apartINFINEON TECHNOLOGIES AG·Filed 2006·Granted Dec 14, 2010·6 cites·37 claims
- 0472US10756035B2Semiconductor device load terminalINFINEON TECHNOLOGIES AG·Filed 2016·Granted Aug 25, 2020·2 cites·19 claims
- 0565US9859272B2Semiconductor device with a reduced band gap zoneINFINEON TECHNOLOGIES AG·Filed 2016·Granted Jan 2, 2018·1 cites·20 claims
- 0662US2025183175A1Semiconductor device with metal structure passivationINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 0760US10777506B2Silicon carbide semiconductor device having a metal adhesion and barrier structure and a method of forming such a semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2019·Granted Sep 15, 2020·0 cites·13 claims
- 0860US9773736B2Intermediate layer for copper structuring and methods of formation thereofINFINEON TECHNOLOGIES AG·Filed 2015·Granted Sep 26, 2017·1 cites·21 claims
- 0953US11315892B2Power semiconductor device load terminalINFINEON TECHNOLOGIES AG·Filed 2018·Granted Apr 26, 2022·0 cites·37 claims
- 1052US10475743B2Semiconductor device having a metal adhesion and barrier structure and a method of forming such a semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2017·Granted Nov 12, 2019·0 cites·25 claims
- 1152US2023317542A1Semiconductor device comprising contact pad structureINFINEON TECHNOLOGIES AG·Filed 2023·Application pending·0 cites
- 1251US10079217B2Power semiconductor device load terminalINFINEON TECHNOLOGIES AG·Filed 2017·Granted Sep 18, 2018·0 cites·13 claims
- 1348US2023082571A1Power semiconductor device and method of producing power semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2022·Application pending·0 cites
- 1442US10224237B2Semiconductor devices and methods for forming a semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2017·Granted Mar 5, 2019·0 cites·16 claims
- 1538US8541892B2Bonding connection between a bonding wire and a power semiconductor chipSIEPE DIRK·Filed 2010·Granted Sep 24, 2013·0 cites·20 claims
- 1632US8955219B2Method for fabricating a bondROTH ROMAN·Filed 2010·Granted Feb 17, 2015·0 cites·24 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →