Inventor · disambiguated record
Robert L. Sankman
Also filed as: SANKMAN ROBERT · SANKMAN ROBERT L · SANKMAN ROBERT LEON
153 granted patents·42 pending applications·1,166 citations·filing 2000–2025
99Inventor score
Top patents by PatentIndex Score
195 records- 0199US10163798B1Embedded multi-die interconnect bridge packages with lithotgraphically formed bumps and methods of assembling sameINTEL CORP·Filed 2017·Granted Dec 25, 2018·105 cites·25 claims
- 0299US9349703B2Method for making high density substrate interconnect using inkjet printingINTEL CORP·Filed 2013·Granted May 24, 2016·111 cites·10 claims
- 0399US6388207B1Electronic assembly with trench structures and methods of manufactureINTEL CORP·Filed 2000·Granted May 14, 2002·238 cites·52 claims
- 0498US9741664B2High density substrate interconnect formed through inkjet printingINTEL CORP·Filed 2016·Granted Aug 22, 2017·32 cites·20 claims
- 0597US11824018B2Heterogeneous nested interposer package for IC chipsINTEL CORP·Filed 2022·Granted Nov 21, 2023·3 cites·20 claims
- 0697US9224674B2Packaged semiconductor die with bumpless die-package interface for bumpless build-up layer (BBUL) packagesMALATKAR PRAMOD·Filed 2011·Granted Dec 29, 2015·38 cites·28 claims
- 0797US8987918B2Interconnect structures with polymer coreINTEL CORP·Filed 2013·Granted Mar 24, 2015·54 cites·25 claims
- 0897US8535989B2Embedded semiconductive chips in reconstituted wafers, and systems containing sameSANKMAN ROBERT L·Filed 2010·Granted Sep 17, 2013·40 cites·24 claims
- 0996US11043457B2Embedded multi-die interconnect bridge packages with lithotgraphically formed bumps and methods of assembling sameINTEL CORP·Filed 2020·Granted Jun 22, 2021·3 cites·9 claims
- 1096US9543224B1Hybrid exposure for semiconductor devicesINTEL IP CORP·Filed 2015·Granted Jan 10, 2017·19 cites·25 claims
- 1194US10707168B2Embedded multi-die interconnect bridge packages with lithographically formed bumps and methods of assembling sameINTEL CORP·Filed 2018·Granted Jul 7, 2020·7 cites·14 claims
- 1294US10651051B2Embedded semiconductive chips in reconstituted wafers, and systems containing sameINTEL CORP·Filed 2017·Granted May 12, 2020·6 cites·10 claims
- 1394US8207453B2Glass core substrate for integrated circuit devices and methods of making the sameMA QING·Filed 2009·Granted Jun 26, 2012·28 cites·13 claims
- 1494US2025391754A1Ultra-thin, hyper-density semiconductor packagesINTEL CORP·Filed 2025·Application pending·0 cites
- 1593US11923257B2Hybrid microelectronic substratesINTEL CORP·Filed 2021·Granted Mar 5, 2024·2 cites·18 claims
- 1693US11164818B2Inorganic-based embedded-die layers for modular semiconductive devicesINTEL CORP·Filed 2019·Granted Nov 2, 2021·7 cites·19 claims
- 1793US9941054B2Integration of embedded thin film capacitors in package substratesINTEL CORP·Filed 2016·Granted Apr 10, 2018·9 cites·15 claims
- 1893US8969140B2Embedded semiconductive chips in reconstituted wafers, and systems containing sameINTEL CORP·Filed 2013·Granted Mar 3, 2015·8 cites·19 claims
- 1992US10658279B2High density package interconnectsINTEL CORP·Filed 2019·Granted May 19, 2020·6 cites·19 claims
- 2091US11430724B2Ultra-thin, hyper-density semiconductor packagesINTEL CORP·Filed 2017·Granted Aug 30, 2022·5 cites·24 claims
- 2191US9646851B2Embedded semiconductive chips in reconstituted wafers, and systems containing sameINTEL CORP·Filed 2016·Granted May 9, 2017·4 cites·14 claims
- 2290US11276630B2Planar integrated circuit package interconnectsINTEL CORP·Filed 2020·Granted Mar 15, 2022·2 cites·20 claims
- 2390US9971089B2Chip-to-chip interconnect with embedded electro-optical bridge structuresINTEL CORP·Filed 2015·Granted May 15, 2018·6 cites·19 claims
- 2490US9847234B2Embedded semiconductive chips in reconstituted wafers, and systems containing sameINTEL CORP·Filed 2015·Granted Dec 19, 2017·4 cites·15 claims
- 2590US7456047B2Thermally enhanced electronic flip-chip packaging with external-connector-side die and methodINTEL CORP·Filed 2007·Granted Nov 25, 2008·15 cites·18 claims
- 2689US10056182B2Surface-mount inductor structures for forming one or more inductors with substrate tracesINTEL CORP·Filed 2015·Granted Aug 21, 2018·7 cites·9 claims
- 2789US9686861B2Glass core substrate for integrated circuit devices and methods of making the sameINTEL CORP·Filed 2016·Granted Jun 20, 2017·5 cites·5 claims
- 2888US11901248B2Embedded die architecture and method of makingINTEL CORP·Filed 2020·Granted Feb 13, 2024·2 cites·20 claims
- 2988US11894359B2Distributed semiconductor die and package architectureINTEL CORP·Filed 2022·Granted Feb 6, 2024·1 cites·23 claims
- 3088US11355849B2Antenna package using ball attach array to connect antenna and base substratesINTEL CORP·Filed 2017·Granted Jun 7, 2022·4 cites·21 claims
- 3188US10700051B2Multi-chip packagingINTEL CORP·Filed 2018·Granted Jun 30, 2020·4 cites·24 claims
- 3288US7133294B2Integrated circuit packages with sandwiched capacitorsINTEL CORP·Filed 2005·Granted Nov 7, 2006·16 cites·24 claims
- 3387US7268425B2Thermally enhanced electronic flip-chip packaging with external-connector-side die and methodINTEL CORP·Filed 2003·Granted Sep 11, 2007·31 cites·12 claims
- 3487US6664483B2Electronic package with high density interconnect and associated methodsINTEL CORP·Filed 2001·Granted Dec 16, 2003·53 cites·34 claims
- 3586US11756860B2Semiconductor device stack-up with bulk substrate material to mitigate hot spotsINTEL CORP·Filed 2019·Granted Sep 12, 2023·3 cites·25 claims
- 3686US10651116B2Planar integrated circuit package interconnectsINTEL CORP·Filed 2016·Granted May 12, 2020·3 cites·20 claims
- 3786US9420693B2Integration of embedded thin film capacitors in package substratesSANKMAN ROBERT L·Filed 2014·Granted Aug 16, 2016·7 cites·25 claims
- 3886US9368437B2High density package interconnectsGANESAN SANKA·Filed 2011·Granted Jun 14, 2016·6 cites·28 claims
- 3986US2024332203A1Microelectronic device with embedded die substrate on interposerINTEL CORP·Filed 2024·Application pending·0 cites
- 4085US12199048B2Heterogeneous nested interposer package for IC chipsINTEL CORP·Filed 2023·Granted Jan 14, 2025·0 cites·20 claims
- 4185US11694959B2Multi-die ultrafine pitch patch architecture and method of makingINTEL CORP·Filed 2019·Granted Jul 4, 2023·3 cites·25 claims
- 4285US11652020B2Thermal solutions for multi-package assemblies and methods for fabricating the sameINTEL CORP·Filed 2019·Granted May 16, 2023·4 cites·18 claims
- 4385US9530758B23D integrated circuit package with through-mold first level interconnectsMALLIK DEBENDRA·Filed 2015·Granted Dec 27, 2016·4 cites·16 claims
- 4485US2025118641A1Planar integrated circuit package interconnectsINTEL CORP·Filed 2024·Application pending·0 cites
- 4584US12476174B2Ultra-thin, hyper-density semiconductor packagesINTEL CORP·Filed 2023·Granted Nov 18, 2025·0 cites·20 claims
- 4684US12341080B2Semiconductor device stack-up with bulk substrate material to mitigate hot spotsINTEL CORP·Filed 2024·Granted Jun 24, 2025·0 cites·20 claims
- 4784US12272656B2Heterogeneous nested interposer package for IC chipsINTEL CORP·Filed 2023·Granted Apr 8, 2025·0 cites·20 claims
- 4884US11735533B2Heterogeneous nested interposer package for IC chipsINTEL CORP·Filed 2019·Granted Aug 22, 2023·2 cites·22 claims
- 4984US11430740B2Microelectronic device with embedded die substrate on interposerINTEL CORP·Filed 2017·Granted Aug 30, 2022·2 cites·13 claims
- 5084US9922916B2High density package interconnectsINTEL CORP·Filed 2016·Granted Mar 20, 2018·3 cites·22 claims
Showing the top 50 of 195 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →