Inventor · disambiguated record
Robert M. Smith
Also filed as: SMITH II ROBERT MILTON · SMITH ROBERT M · SMITH ROBERT MILTON
13 granted patents·2 pending applications·396 citations·filing 1991–2008
93Inventor score
Top patents by PatentIndex Score
15 records- 0195US7405106B2Quad flat no-lead chip carrier with stand-offIBM·Filed 2006·Granted Jul 29, 2008·33 cites·10 claims
- 0276US5754855ASystem and method for managing control flow of computer programs executing in a computer systemIBM·Filed 1997·Granted May 19, 1998·87 cites·25 claims
- 0371US5835768AComputer operating system providing means for formatting information in accordance with specified cultural preferencesIBM·Filed 1996·Granted Nov 10, 1998·82 cites·3 claims
- 0470US5608260ALeadframe having contact pads defined by a polymer insulating filmIBM·Filed 1994·Granted Mar 4, 1997·38 cites·14 claims
- 0564US6603195B1Planarized plastic package modules for integrated circuitsIBM·Filed 2000·Granted Aug 5, 2003·15 cites·16 claims
- 0662US5455949AMethod for representing and signaling run-time program conditionsIBM·Filed 1991·Granted Oct 3, 1995·36 cites·9 claims
- 0759US6332168B1Method of, system for, and computer program product for providing a run time subsystem for run time librariesIBM·Filed 1995·Granted Dec 18, 2001·37 cites·49 claims
- 0853US6428300B2Ultra mold for encapsulating very thin packagesIBM·Filed 2001·Granted Aug 6, 2002·5 cites·13 claims
- 0952US8134225B2Quad flat no-lead chip carrier with standoffMALONEY JOHN J·Filed 2008·Granted Mar 13, 2012·0 cites·7 claims
- 1052US5724564AComputer program product and program storage device for representing and signaling run-time program conditionsIBM·Filed 1995·Granted Mar 3, 1998·25 cites·9 claims
- 1152US2008203546A1Quad flat no-lead chip carrier with stand-offIBM·Filed 2008·Application pending·0 cites
- 1244US6306331B1Ultra mold for encapsulating very thin packagesIBM·Filed 1999·Granted Oct 23, 2001·11 cites·9 claims
- 1344US5630137ACondition handling in a multi-language computer programIBM·Filed 1995·Granted May 13, 1997·20 cites·48 claims
- 1442US2007278629A1Method and structure for improving the reliability of leadframe integrated circuit packagesIBM·Filed 2006·Application pending·0 cites
- 1538US5776801ALeadframe having contact pads defined by a polymer insulating filmIBM·Filed 1996·Granted Jul 7, 1998·7 cites·14 claims
Join the waitlist — get patent alerts
Get an alert when Robert M. Smith files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →