Inventor · disambiguated record
Roberto Tiziani
Also filed as: TIZIANI ROBERTO
17 granted patents·14 pending applications·88 citations·filing 1998–2025
91Inventor score
Files withST MICROELECTRONICS SRL26MAGNETI MARELLI SPA2SHENZHEN STS MICROELECTRONICS CO LTD1ST MICROELECTRONICS INT NV1
Top patents by PatentIndex Score
31 records- 0192US12040263B2Semiconductor device with die mounted to an insulating substrate and corresponding method of manufacturing semiconductor devicesST MICROELECTRONICS SRL·Filed 2021·Granted Jul 16, 2024·2 cites·18 claims
- 0274US2025337219A1Electronic module for generating light pulses for lidar applications and method for manufacturing the electronic moduleST MICROELECTRONICS SRL·Filed 2025·Application pending·0 cites
- 0373US2024371738A1Semiconductor device and corresponding method of manufacturing semiconductor devicesST MICROELECTRONICS SRL·Filed 2024·Application pending·0 cites
- 0469US2023411258A1Semiconductor device and corresponding methodST MICROELECTRONICS SRL·Filed 2023·Application pending·0 cites
- 0568US6909166B2Leads of a no-lead type package of a semiconductor deviceST MICROELECTRONICS SRL·Filed 2002·Granted Jun 21, 2005·17 cites·7 claims
- 0668US6815789B2Semiconductor electronic device and method of manufacturing thereofST MICROELECTRONICS SRL·Filed 2002·Granted Nov 9, 2004·15 cites·22 claims
- 0763US6468356B1Method for removing molding residues in the fabrication of plastic packages for semiconductor devicesST MICROELECTRONICS SRL·Filed 2000·Granted Oct 22, 2002·12 cites·42 claims
- 0862US12381372B2Electronic module for generating light pulses for LIDAR applications and method for manufacturing the electronic moduleST MICROELECTRONICS SRL·Filed 2022·Granted Aug 5, 2025·0 cites·20 claims
- 0961US7803663B2Method for manufacturing a molded MMC multi media card package obtained with laser cuttingST MICROELECTRONICS SRL·Filed 2005·Granted Sep 28, 2010·2 cites·19 claims
- 1060US11749588B2Semiconductor device and corresponding methodST MICROELECTRONICS SRL·Filed 2020·Granted Sep 5, 2023·0 cites·14 claims
- 1159US12322684B2Method of manufacturing electronic devices and corresponding electronic deviceST MICROELECTRONICS SRL·Filed 2022·Granted Jun 3, 2025·0 cites·14 claims
- 1259US2024329098A1Current measurement device, corresponding manufacturing method and method of useST MICROELECTRONICS INT NV·Filed 2024·Application pending·0 cites
- 1358US2024363501A1Semiconductor package, method of forming semiconductor package, and power moduleSHENZHEN STS MICROELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1457US2024178105A1Method of manufacturing substrates for semiconductor devices, corresponding product and semiconductor deviceST MICROELECTRONICS SRL·Filed 2023·Application pending·0 cites
- 1556US6195256B1Card assembly of power device in plastic package with external heat sink soldered to the internal heat sinkST MICROELECTRONICS SRL·Filed 1998·Granted Feb 27, 2001·26 cites·22 claims
- 1652US12456629B2Method of producing substrates for semiconductor device packages comprising anchoring encapsulation to die padST MICROELECTRONICS SRL·Filed 2022·Granted Oct 28, 2025·0 cites·10 claims
- 1750US11557547B2Leadframe for semiconductor devices, corresponding semiconductor product and methodST MICROELECTRONICS SRL·Filed 2020·Granted Jan 17, 2023·0 cites·22 claims
- 1850US6838755B2Leadframe for integrated circuit chips having low resistance connectionsST MICROELECTRONICS SRL·Filed 2001·Granted Jan 4, 2005·5 cites·16 claims
- 1949US2023230948A1Method of manufacturing semiconductor devices and corresponding semiconductor deviceST MICROELECTRONICS SRL·Filed 2023·Application pending·0 cites
- 2048US12322603B2Method of manufacturing semiconductor devices and corresponding semiconductor deviceST MICROELECTRONICS SRL·Filed 2022·Granted Jun 3, 2025·0 cites·11 claims
- 2148US2022199500A1Method of manufacturing semiconductor devices, component for use therein and corresponding semiconductor deviceST MICROELECTRONICS SRL·Filed 2021·Application pending·0 cites
- 2246US11626379B2Method of manufacturing semiconductor devices and corresponding semiconductor deviceST MICROELECTRONICS SRL·Filed 2021·Granted Apr 11, 2023·0 cites·21 claims
- 2346US7459387B2Semiconductor electronic device and method of manufacturing thereofST MICROELECTRONICS SRL·Filed 2004·Granted Dec 2, 2008·3 cites·9 claims
- 2436US2004262721A1Manufacturing method for power semiconductor electronic devicesST MICROELECTRONICS SRL·Filed 2004·Application pending·0 cites
- 2535US6291893B1Power semiconductor device for “flip-chip” connectionsST MICROELECTRONICS SRL·Filed 1999·Granted Sep 18, 2001·6 cites·18 claims
- 2635US2016105997A1Liquid cooling system for an electronic componentMAGNETI MARELLI SPA·Filed 2015·Application pending·0 cites
- 2734US2004072396A1Semiconductor electronic device and method of manufacturing thereofST MICROELECTRONICS SRL·Filed 2003·Application pending·0 cites
- 2833US2003146500A1Package for semiconductor device with ground lead connection having high stress resistanceST MICROELECTRONICS SRL·Filed 2002·Application pending·0 cites
- 2928US2017125998A1Electronic device with electronic power component and direct detection of the temperature of such a componentMAGNETI MARELLI SPA·Filed 2016·Application pending·0 cites
- 3027US2001008139A1Method for removing molding residues in the fabrication of plastic packages for semiconductor devicesFiled 1998·Application pending·0 cites
- 3125US6593665B2Protective envelope for a semiconductor integrated circuitST MICROELECTRONICS SRL·Filed 2001·Granted Jul 15, 2003·0 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →