Inventor · disambiguated record
Russell A. Budd
Also filed as: BUDD RUSSELL · BUDD RUSSELL A · BUDD RUSSELL ALAN
117 granted patents·17 pending applications·2,376 citations·filing 1987–2024
99Inventor score
Top patents by PatentIndex Score
134 records- 0199US6222677B1Compact optical system for use in virtual display applicationsIBM·Filed 1999·Granted Apr 24, 2001·455 cites·30 claims
- 0298US10217637B1Chip handling and electronic component integrationIBM·Filed 2017·Granted Feb 26, 2019·35 cites·13 claims
- 0398US10118250B1In-situ laser beam position and spot size sensor and high speed scanner calibration, wafer debonding methodIBM·Filed 2017·Granted Nov 6, 2018·12 cites·13 claims
- 0498US9935088B2Packaging optoelectronic components and CMOS circuitry using silicon-on-insulator substrates for photonics applicationsIBM·Filed 2017·Granted Apr 3, 2018·23 cites·19 claims
- 0598US9786641B2Packaging optoelectronic components and CMOS circuitry using silicon-on-insulator substrates for photonics applicationsIBM·Filed 2015·Granted Oct 10, 2017·28 cites·20 claims
- 0698US9372307B1Monolithically integrated III-V optoelectronics with SI CMOSIBM·Filed 2015·Granted Jun 21, 2016·15 cites·20 claims
- 0798US6747611B1Compact optical system and packaging for head mounted displayIBM·Filed 2000·Granted Jun 8, 2004·391 cites·24 claims
- 0897USD436960SHead mounted displayIBM·Filed 1999·Granted Jan 30, 2001·129 cites·1 claims
- 0997US5943171AHead mounted displays utilizing reflection light valvesIBM·Filed 1998·Granted Aug 24, 1999·207 cites·26 claims
- 1096US11307147B2Accurate colorimetric based test strip reader systemIBM·Filed 2020·Granted Apr 19, 2022·6 cites·18 claims
- 1196US10605741B2Accurate colorimetric based test strip reader systemIBM·Filed 2018·Granted Mar 31, 2020·8 cites·21 claims
- 1296US9029238B2Advanced handler wafer bonding and debondingIBM·Filed 2012·Granted May 12, 2015·26 cites·20 claims
- 1396US8483253B23D optoelectronic packagingBUDD RUSSELL A·Filed 2012·Granted Jul 9, 2013·27 cites·14 claims
- 1495US10488605B1Photonic waveguide coupling using offset light sourceIBM·Filed 2018·Granted Nov 26, 2019·13 cites·18 claims
- 1595US10381255B2Double layer release temporary bond and debond processes and systemsIBM·Filed 2018·Granted Aug 13, 2019·7 cites·11 claims
- 1695US8855452B2Silicon photonic chip optical coupling structuresANDRY PAUL S·Filed 2012·Granted Oct 7, 2014·26 cites·23 claims
- 1794US10224229B2Double layer release temporary bond and debond processes and systemsIBM·Filed 2016·Granted Mar 5, 2019·8 cites·8 claims
- 1894US9103972B2Optical waveguide structure with waveguide coupler to facilitate off-chip couplingIBM·Filed 2013·Granted Aug 11, 2015·17 cites·25 claims
- 1994US7421160B1Coupling element alignment using waveguide fiducialsIBM·Filed 2007·Granted Sep 2, 2008·36 cites·14 claims
- 2093US10090286B2Packaging optoelectronic components and CMOS circuitry using silicon-on-insulator substrates for photonics applicationsIBM·Filed 2017·Granted Oct 2, 2018·6 cites·20 claims
- 2193US9563018B2Tapered photonic waveguide to optical fiber proximity couplerIBM·Filed 2014·Granted Feb 7, 2017·12 cites·16 claims
- 2293US5896232AHighly efficient and compact frontlighting for polarization-based reflection light valvesIBM·Filed 1997·Granted Apr 20, 1999·170 cites·27 claims
- 2392US8111730B23D optoelectronic packagingBUDD RUSSELL A·Filed 2009·Granted Feb 7, 2012·20 cites·8 claims
- 2492US7780063B2Techniques for arranging solder balls and forming bumpsIBM·Filed 2008·Granted Aug 24, 2010·12 cites·16 claims
- 2591US10082625B2Optical component with angled-facet waveguideIBM·Filed 2017·Granted Sep 25, 2018·6 cites·20 claims
- 2691US9915784B2Optical waveguide structure with waveguide coupler to facilitate off-chip couplingIBM·Filed 2015·Granted Mar 13, 2018·7 cites·20 claims
- 2790US9857531B2Optical component with angled-facet waveguideIBM·Filed 2016·Granted Jan 2, 2018·5 cites·20 claims
- 2890US8290008B2Silicon carrier optoelectronic packagingANDRY PAUL S·Filed 2009·Granted Oct 16, 2012·18 cites·12 claims
- 2989US10490525B1High speed handling of ultra-small chips by selective laser bonding and debondingIBM·Filed 2018·Granted Nov 26, 2019·5 cites·16 claims
- 3089US8755644B2Silicon based optical viasBUDD RUSSELL A·Filed 2008·Granted Jun 17, 2014·16 cites·44 claims
- 3189US8411719B23D optoelectronic packagingBUDD RUSSELL A·Filed 2012·Granted Apr 2, 2013·8 cites·4 claims
- 3289US8289231B2Compact optical system and packaging for head mounted displayBUDD RUSSELL A·Filed 2004·Granted Oct 16, 2012·39 cites·1 claims
- 3389US7853105B2Coupling element alignment using waveguide fiducialsIBM·Filed 2009·Granted Dec 14, 2010·15 cites·6 claims
- 3488US7980445B2Fill head for full-field solder coverage with a rotatable memberIBM·Filed 2008·Granted Jul 19, 2011·11 cites·4 claims
- 3587US10595401B1Tamper detection at enclosure-to-board interfaceIBM·Filed 2019·Granted Mar 17, 2020·5 cites·20 claims
- 3687US10166632B1In-situ laser beam position and spot size sensor and high speed scanner calibration, wafer debonding methodIBM·Filed 2017·Granted Jan 1, 2019·2 cites·7 claims
- 3786US10658182B2Chip handling and electronic component integrationIBM·Filed 2019·Granted May 19, 2020·1 cites·20 claims
- 3886US8559474B2Silicon carrier optoelectronic packagingANDRY PAUL S·Filed 2012·Granted Oct 15, 2013·9 cites·6 claims
- 3986US7352066B2Silicon based optical viasIBM·Filed 2003·Granted Apr 1, 2008·43 cites·10 claims
- 4085US7404251B2Manufacture of printed circuit boards with stubless plated through-holesIBM·Filed 2006·Granted Jul 29, 2008·9 cites·10 claims
- 4185US7212698B2Circuit board integrated optical coupling elementsIBM·Filed 2004·Granted May 1, 2007·30 cites·23 claims
- 4284US11733170B2Optical sensor system for quantitative colorimetric liquid analysisIBM·Filed 2019·Granted Aug 22, 2023·2 cites·10 claims
- 4384US9278401B2Fill head interface with combination vacuum pressure chamberIBM·Filed 2013·Granted Mar 8, 2016·5 cites·16 claims
- 4484US8963020B2Process for making stubless printed circuit boardsIBM·Filed 2013·Granted Feb 24, 2015·4 cites·15 claims
- 4583US8181846B2Method of full-field solder coverage using a vacuum fill headBUDD RUSSELL A·Filed 2011·Granted May 22, 2012·4 cites·5 claims
- 4682US9958625B2Structured substrate for optical fiber alignmentIBM·Filed 2017·Granted May 1, 2018·2 cites·1 claims
- 4782US9935089B2Packaging optoelectronic components and CMOS circuitry using silicon-on-insulator substrates for photonics applicationsIBM·Filed 2017·Granted Apr 3, 2018·2 cites·16 claims
- 4881US10395929B2Chip handling and electronic component integrationIBM·Filed 2017·Granted Aug 27, 2019·2 cites·14 claims
- 4981US9671578B2Structured substrate for optical fiber alignmentIBM·Filed 2015·Granted Jun 6, 2017·2 cites·9 claims
- 5081US9658415B2Structured substrate for optical fiber alignmentIBM·Filed 2015·Granted May 23, 2017·2 cites·3 claims
Showing the top 50 of 134 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →