Inventor · disambiguated record
Runzi Chang
Also filed as: CHANG RUNZI
66 granted patents·12 pending applications·175 citations·filing 2007–2025
98Inventor score
Files withMARVELL WORLD TRADE LTD30MARVELL ASIA PTE LTD19MARVELL INT LTD19WU ALBERT6SUTARDJA PANTAS2
Top patents by PatentIndex Score
78 records- 0197US10713411B1Photolithography mask design-rule check assistanceMARVELL INT LTD·Filed 2018·Granted Jul 14, 2020·12 cites·18 claims
- 0296US9768144B2Package assembly including a semiconductor substrate in which a first portion of a surface of the semiconductor substrate is recessed relative to a second portion of the surface of the semiconductor substrate to form a recessed region in the semiconductor substrateMARVELL WORLD TRADE LTD·Filed 2016·Granted Sep 19, 2017·11 cites·19 claims
- 0394US11774490B1Real-time, in-situ reliability monitoring in an integrated circuitMARVELL ASIA PTE LTD·Filed 2020·Granted Oct 3, 2023·3 cites·13 claims
- 0491US8030128B1Method to form high density phase change memory (PCM) top contact every two bitsMARVELL INT LTD·Filed 2008·Granted Oct 4, 2011·21 cites·22 claims
- 0589US11527625B1Electrical performance and reliability of a semiconductor device comprising continuous diffusion structuresMARVELL ASIA PTE LTD·Filed 2020·Granted Dec 13, 2022·2 cites·22 claims
- 0689US7892936B1Self aligned integration of high density phase change memory with thin film access deviceMARVELL INT LTD·Filed 2009·Granted Feb 22, 2011·18 cites·12 claims
- 0788US7939445B1High density via and metal interconnect structures, and methods of forming the sameMARVELL INT LTD·Filed 2008·Granted May 10, 2011·17 cites·21 claims
- 0887US10535774B1Modular memory-like layout for finFET analog designsMARVELL INT LTD·Filed 2018·Granted Jan 14, 2020·4 cites·8 claims
- 0986US8999786B1Reducing source contact to gate spacing to decrease transistor pitchWU ALBERT·Filed 2008·Granted Apr 7, 2015·9 cites·20 claims
- 1084US10217669B2Isolation components for transistors formed on fin features of semiconductor substratesMARVELL WORLD TRADE LTD·Filed 2016·Granted Feb 26, 2019·3 cites·18 claims
- 1184US8947909B1System and method for creating a bipolar resistive RAM (RRAM)MARVELL INT LTD·Filed 2013·Granted Feb 3, 2015·7 cites·18 claims
- 1283US10928870B2Apparatus and methods for temperature-based memory managementMARVELL WORLD TRADE LTD·Filed 2019·Granted Feb 23, 2021·3 cites·20 claims
- 1383US8934285B2Method and apparatus for forming a contact in a cell of a resistive random access memory to reduce a voltage required to program the cellMARVELL WORLD TRADE LTD·Filed 2013·Granted Jan 13, 2015·6 cites·20 claims
- 1482US11398431B2Through-silicon via for high-speed interconnectsMARVELL ASIA PTE LTD·Filed 2021·Granted Jul 26, 2022·1 cites·22 claims
- 1582US10056363B2Methods and systems to improve yield in multiple chips integration processesMARVELL WORLD TRADE LTD·Filed 2016·Granted Aug 21, 2018·2 cites·21 claims
- 1682US7745809B1Ultra high density phase change memory having improved emitter contacts, improved GST cell reliability and highly matched UHD GST cells using column mirco-trench stripsMARVELL INT LTD·Filed 2008·Granted Jun 29, 2010·9 cites·19 claims
- 1780US11134135B1Mobile storage system for storing and transferring data generated by Internet of Things (IoT) devicesMARVELL INT LTD·Filed 2019·Granted Sep 28, 2021·3 cites·23 claims
- 1879US11630750B1Systems and methods for configuring a central processing unit having multiple coresMARVELL ASIA PTE LTD·Filed 2020·Granted Apr 18, 2023·2 cites·22 claims
- 1977US7888166B2Method to form high efficiency GST cell using a double heater cutMARVELL WORLD TRADE LTD·Filed 2010·Granted Feb 15, 2011·3 cites·9 claims
- 2077US2025391789A1Double seal ring and electrical connection of multiple chipletsMARVELL ASIA PTE LTD·Filed 2025·Application pending·0 cites
- 2175US12342591B2Gate stack for metal gate transistorMARVELL ASIA PTE LTD·Filed 2023·Granted Jun 24, 2025·0 cites·5 claims
- 2275US8885388B2Apparatus and method for reforming resistive memory cellsMARVELL WORLD TRADE LTD·Filed 2013·Granted Nov 11, 2014·4 cites·21 claims
- 2374US9257410B2Package assembly including a semiconductor substrate in which a first portion of a surface of the semiconductor substrate is recessed relative to a second portion of the surface of the semiconductor substrate to form a recessed region in the semiconductor substrateWU ALBERT·Filed 2011·Granted Feb 9, 2016·2 cites·26 claims
- 2474US7709835B2Method to form high efficiency GST cell using a double heater cutMARVELL WORLD TRADE LTD·Filed 2008·Granted May 4, 2010·3 cites·7 claims
- 2573US10319727B2Fabricating memory devices with optimized gate oxide thicknessMARVELL WORLD TRADE LTD·Filed 2017·Granted Jun 11, 2019·1 cites·7 claims
- 2672US7807539B1Ion implantation and process sequence to form smaller base pick-upMARVELL INT LTD·Filed 2008·Granted Oct 5, 2010·4 cites·10 claims
- 2771US12362293B2Double seal ring and electrical connection of multiple chipletsMARVELL ASIA PTE LTD·Filed 2022·Granted Jul 15, 2025·0 cites·20 claims
- 2870US9214230B2Resistive random access memory cell structure with reduced programming voltageMARVELL WORLD TRADE LTD·Filed 2015·Granted Dec 15, 2015·2 cites·20 claims
- 2970US8241993B2Method for shallow trench isolationWU ALBERT·Filed 2008·Granted Aug 14, 2012·2 cites·23 claims
- 3070US7985616B1Methods to form wide heater trenches and to form memory cells to engage heatersMARVELL INT LTD·Filed 2008·Granted Jul 26, 2011·3 cites·11 claims
- 3169US8993398B1Method for creating ultra-high-density holes and metallizationSUTARDJA PANTAS·Filed 2011·Granted Mar 31, 2015·2 cites·10 claims
- 3268US9245961B1Reducing source contact to gate spacing to decrease transistor pitchMARVELL INT LTD·Filed 2015·Granted Jan 26, 2016·1 cites·20 claims
- 3367US9490427B2Resistive random access memory cell structureMARVELL WORLD TRADE LTD·Filed 2015·Granted Nov 8, 2016·1 cites·22 claims
- 3467US9147837B1Resistive memory cell and method for forming a resistive memory cellMARVELL INT LTD·Filed 2015·Granted Sep 29, 2015·2 cites·18 claims
- 3567US9047945B2Systems and methods for reading resistive random access memory (RRAM) cellsMARVELL WORLD TRADE LTD·Filed 2013·Granted Jun 2, 2015·3 cites·20 claims
- 3667US7863709B1Low base resistance bipolar junction transistor arrayMARVELL INT LTD·Filed 2008·Granted Jan 4, 2011·2 cites·15 claims
- 3766US10896900B2Methods and systems for packaging an integrated circuitMARVELL ASIA PTE LTD·Filed 2019·Granted Jan 19, 2021·0 cites·20 claims
- 3865US11862453B2Gate stack for metal gate transistorMARVELL ASIA PTE LTD·Filed 2021·Granted Jan 2, 2024·0 cites·5 claims
- 3964US7994052B1High-density patterningMARVELL INT LTD·Filed 2008·Granted Aug 9, 2011·2 cites·17 claims
- 4064US2025118692A1Mitigating process problems in hybrid bonding of vertical die stackingMARVELL ASIA PTE LTD·Filed 2024·Application pending·0 cites
- 4164US2025079394A1Compensating for registration error in vertical die stackingMARVELL ASIA PTE LTD·Filed 2024·Application pending·0 cites
- 4263US2025029948A1Reducing warpage in a package of stacked integrated circuit diesMARVELL ASIA PTE LTD·Filed 2024·Application pending·0 cites
- 4362US12046553B2Electronic fuse (eFuse) designs for enhanced chip securityMARVELL ASIA PTE LTD·Filed 2022·Granted Jul 23, 2024·0 cites·14 claims
- 4462US10978592B1Systems and methods for forming finFET analog designs having a modular memory-like layoutMARVELL ASIA PTE LTD·Filed 2020·Granted Apr 13, 2021·0 cites·11 claims
- 4562US10431574B2Methods and systems for packaging semiconductor devices to improve yieldMARVELL WORLD TRADE LTD·Filed 2018·Granted Oct 1, 2019·0 cites·19 claims
- 4661US7939414B1Ion implantation and process sequence to form smaller base pick-upMARVELL INT LTD·Filed 2010·Granted May 10, 2011·1 cites·8 claims
- 4760US10784167B2Isolation components for transistors formed on fin features of semiconductor substratesMARVELL WORLD TRADE LTD·Filed 2018·Granted Sep 22, 2020·0 cites·20 claims
- 4860US9275731B1Systems and methods for increasing the read sensitivity of a resistive random access memory (RRAM)MARVELL INT LTD·Filed 2013·Granted Mar 1, 2016·2 cites·21 claims
- 4960US8030215B1Method for creating ultra-high-density holes and metallizationMARVELL INT LTD·Filed 2009·Granted Oct 4, 2011·1 cites·5 claims
- 5059US11081387B2Creating an aligned via and metal line in an integrated circuit including forming an oversized via maskMARVELL WORLD TRADE LTD·Filed 2019·Granted Aug 3, 2021·0 cites·20 claims
Showing the top 50 of 78 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →