Inventor · disambiguated record
Runsheng Mao
Also filed as: MAO RUNSHENG
2 granted patents·1 pending application·0 citations·filing 2008–2020
23Inventor score
Top patents by PatentIndex Score
3 records- 0143US11581239B2Lead-free solder paste as thermal interface materialINDIUM CORP·Filed 2020·Granted Feb 14, 2023·0 cites·11 claims
- 0241US10010981B2Materials having increased mobility after heatingLEE NING CHENG·Filed 2008·Granted Jul 3, 2018·0 cites·25 claims
- 0336US2020230750A1Lead-free solder paste for thermal via fillingINDIUM CORP·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →