Inventor · disambiguated record
Ruben B. Montez
Also filed as: MONTEZ RUBEN B
21 granted patents·78 citations·filing 2008–2018
92Inventor score
Top patents by PatentIndex Score
21 records- 0197US9318376B1Through substrate via with diffused conductive componentFREESCALE SEMICONDUCTOR INC·Filed 2014·Granted Apr 19, 2016·38 cites·15 claims
- 0285US8592926B2Substrate bonding with metal germanium silicon materialMONTEZ RUBEN B·Filed 2011·Granted Nov 26, 2013·8 cites·22 claims
- 0383US8058143B2Substrate bonding with metal germanium silicon materialMONTEZ RUBEN B·Filed 2009·Granted Nov 15, 2011·11 cites·24 claims
- 0481US9458008B1Method of making a MEMS die having a MEMS device on a suspended structureFREESCALE SEMICONDUCTOR INC·Filed 2015·Granted Oct 4, 2016·3 cites·17 claims
- 0576US7943525B2Method of producing microelectromechanical device with isolated microstructuresFREESCALE SEMICONDUCTOR INC·Filed 2008·Granted May 17, 2011·6 cites·10 claims
- 0673US9776853B2Reducing MEMS stiction by deposition of nanoclustersFREESCALE SEMICONDUCTOR INC·Filed 2016·Granted Oct 3, 2017·1 cites·3 claims
- 0772US10427929B1Forming a eutectic bond between a wafer having an anti-stiction coating and a cap waferNXP USA INC·Filed 2018·Granted Oct 1, 2019·2 cites·13 claims
- 0871US9988260B2Rough MEMS surfaceFREESCALE SEMICONDUCTOR INC·Filed 2016·Granted Jun 5, 2018·1 cites·22 claims
- 0971US9550664B2Reducing MEMS stiction by increasing surface roughnessFREESCALE SEMICONDUCTOR INC·Filed 2014·Granted Jan 24, 2017·2 cites·20 claims
- 1069US8633088B2Glass frit wafer bond protective structureMONTEZ RUBEN B·Filed 2012·Granted Jan 21, 2014·2 cites·20 claims
- 1168US9290380B2Reducing MEMS stiction by deposition of nanoclustersSTEIMLE ROBERT F·Filed 2012·Granted Mar 22, 2016·1 cites·8 claims
- 1265US9960081B1Method for selective etching using dry film photoresistNXP USA INC·Filed 2017·Granted May 1, 2018·1 cites·20 claims
- 1365US8895339B2Reducing MEMS stiction by introduction of a carbon barrierMONTEZ RUBEN B·Filed 2012·Granted Nov 25, 2014·1 cites·12 claims
- 1463US9637372B2Bonded wafer structure having cavities with low pressure and method for formingFREESCALE SEMICONDUCTOR INC·Filed 2015·Granted May 2, 2017·1 cites·15 claims
- 1559US9463973B2Reducing MEMS stiction by introduction of a carbon barrierMONTEZ RUBEN B·Filed 2014·Granted Oct 11, 2016·0 cites·8 claims
- 1654US9425115B2Glass frit wafer bond protective structureFREESCALE SEMICONDUCTOR INC·Filed 2013·Granted Aug 23, 2016·0 cites·21 claims
- 1751US9663356B2Etch release residue removal using anhydrous solutionFREESCALE SEMICONDUCTOR INC·Filed 2014·Granted May 30, 2017·0 cites·17 claims
- 1850US9434602B2Reducing MEMS stiction by deposition of nanoclustersSTEIMLE ROBERT F·Filed 2014·Granted Sep 6, 2016·0 cites·16 claims
- 1950US9108842B2Reducing microelectromechanical systems stiction by formation of a silicon carbide layerTURNER MICHAEL D·Filed 2013·Granted Aug 18, 2015·0 cites·19 claims
- 2047US9458010B1Systems and methods for anchoring components in MEMS semiconductor devicesFREESCALE SEMICONDUCTOR INC·Filed 2015·Granted Oct 4, 2016·0 cites·14 claims
- 2135US8455286B2Method of making a micro-electro-mechanical-systems (MEMS) deviceKARLIN LISA H·Filed 2010·Granted Jun 4, 2013·0 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →