Inventor · disambiguated record
Russell K. Mortensen
Also filed as: MORTENSEN RUSSELL · MORTENSEN RUSSELL K · MORTENSEN RUSSELL KEVIN
7 granted patents·9 pending applications·22 citations·filing 2008–2024
83Inventor score
Top patents by PatentIndex Score
16 records- 0196US12107082B2Offset interposers for large-bottom packages and large-die package-on-package structuresINTEL CORP·Filed 2023·Granted Oct 1, 2024·2 cites·16 claims
- 0292US11798932B2Offset interposers for large-bottom packages and large-die package-on-package structuresINTEL CORP·Filed 2022·Granted Oct 24, 2023·1 cites·10 claims
- 0390US11978730B2Offset interposers for large-bottom packages and large-die package-on-package structuresINTEL CORP·Filed 2022·Granted May 7, 2024·1 cites·9 claims
- 0490US10607976B2Offset interposers for large-bottom packages and large-die package-on-package structuresINTEL CORP·Filed 2016·Granted Mar 31, 2020·6 cites·11 claims
- 0586US2024222350A1Offset interposers for large-bottom packages and large-die package-on- package structuresINTEL CORP·Filed 2024·Application pending·0 cites
- 0682US10446530B2Offset interposers for large-bottom packages and large-die package-on-package structuresMORTENSEN RUSSELL K·Filed 2011·Granted Oct 15, 2019·5 cites·24 claims
- 0780US9496211B2Logic die and other components embedded in build-up layersINTEL CORP·Filed 2012·Granted Nov 15, 2016·5 cites·17 claims
- 0875US10453799B2Logic die and other components embedded in build-up layersINTEL CORP·Filed 2016·Granted Oct 22, 2019·2 cites·15 claims
- 0964US2020251462A1Offset interposers for large-bottom packages and large-die package-on-package structuresINTEL CORP·Filed 2019·Application pending·0 cites
- 1060US2010073894A1Coreless substrate, method of manufacturing same, and package for microelectronic device incorporating sameMORTENSEN RUSSELL·Filed 2008·Application pending·0 cites
- 1156US2016133557A1Offset interposers for large-bottom packages and large-die package-on-package structuresINTEL CORP·Filed 2015·Application pending·0 cites
- 1255US2025112125A1Bridges over metal voids in integrated circuit packagesINTEL CORP·Filed 2023·Application pending·0 cites
- 1352US2012005887A1Coreless substrate, method of manufacturing same, and package for microelectronic device incorporating sameMORTENSEN RUSSELL·Filed 2011·Application pending·0 cites
- 1451US2024114622A1Embedded passives with cavity sidewall interconnect in glass core architectureINTEL CORP·Filed 2022·Application pending·0 cites
- 1550US2023089096A1Multiple dies coupled with a glass core substrateINTEL CORP·Filed 2021·Application pending·0 cites
- 1640US2021296241A1Microelectronic package with reduced through-substrate routingINTEL CORP·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →